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HCD-GNZ7D/GNZ8D/GNZ9D
HCD-GNZ7D/GNZ8D/GNZ9D
PRINTED WIRING BOARD — DMB11 SECTION (SIDE A) —
: Uses unleaded solder.
A3
A2
A1
A4
A5
A6
A7
A9
A10
A11
A12
R318
A8
IC102
FB115
FB114
FB113
FB112
R3653
IC201
R319
Q103
R116
R117
C224
R136
IC106
R142
IC104
IC103
R144
C222
C221
R153
R155
C220
C219
C218
C215
IC101
C210
X101
R208
C208
CN105
CN106
CN201
CN401
R209
C206
C205
R210
R214
FB401
FB402
FB403
FB404
D1001
FB405
FB406
R215
R216
R219
R224
FL402
C190
R233
R234
C180
C179
R161
R107
R101
C217
C102
C105
C402
C108
R189
C307
C305
R190
R191
C302
R192
R193
C153
C152
R1101
C117
R1102
R1105
R1553
C138
C137
C135
R1129
C133
C132
R1168
C119
C118
C116
C112
R195
C306
C101
R197
C167
C170
C181
C187
C189
C177
R1544
C403
C129
R152
C3783
R1550
R1549
C3782
C3781
C3774
C3773
C3772
C3771
C3707
R3782
R3781
R4706
R4705
R1543
C3784
R3773
R3774
R3775
R3776
R3777
R3772
R3771
R3768
R3767
R3766
R3765
R3764
R3763
R3758
R3757
R3778
R3783
R3784
R3785
R3786
R3753
C3764
R3787
C3763
C3762
C3761
C3754
C3801
R3788
C3753
C3705
R3762
R3761
R3802
R3801
C178
R3716
R3752
R3717
R3715
R3751
R3748
R3747
R3746
R3714
R3745
R3744
R3743
R3738
R3713
R3737
R3736
R3734
R3733
C3744
R3718
R3721
R3722
R3723
C3743
C3742
C3741
C3734
R3712
R3711
R3724
R3725
C3733
C3703
D3502
D3501
CN302
C150
C3724
C3723
C3722
C3721
C3714
R3742
CN301
R3741
C3713
C3712
C3711
R3732
R3731
C3701
R3728
R3727
R3726
R1557
C3805
C3803
FL401
R3803
C3802
R3804
Q3801
C3804
RB112
CN101
RB113
RB108
RB107
FL403
FL107
FL101
R3805
C3731
C3732
R3735
C3752
C3751
R3754
R3756
R3755
A
B
C
D
E
F
G
H
I
1
2
3
4
5
6
7
8
9
10
Ref. No.
Location
D1001
G-5
D3501
E-8
D3502
E-8
IC101
C-3
IC102
D-5
IC103
F-6
IC104
F-5
IC106
G-5
IC201
F-3
Q103
B-6
Q3801
E-8
• Semiconductor
Location
New part of EEP ROM (IC103) on the DMB11 board cannot be used. Therefore,
if the mounted DMB11 board (A-1095-784-A, etc.) is replaced, exchange new
EEP ROM (IC103) with that used before the replacement.
if the mounted DMB11 board (A-1095-784-A, etc.) is replaced, exchange new
EEP ROM (IC103) with that used before the replacement.
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