HCD-GN800, MHC-GN800 - Sony Audio Service Manual (repair manual)

Model Name Using Similar Mechanism

NEW

CD

CD Mechanism Type

CDM74-K6BD47S

Section

Base Unit Name

BU-K6BD47S

Optical Pick-up Name

KSM-213DCP

TAPE

Model Name Using Similar Mechanism

HCD-XGR88

Section

Tape Transport Mechanism Type

CWM43RR23

E Model

Australian Model

2003F02-1

C

 2003.06

HCD-GN800 is the amplifier, CD player,
tape deck and tuner section in MHC-
GN800.

– Continued on next page –

Amplifier section
The following are measured at AC 127V, 60 Hz
(Mexican model only)
The following are measured at AC 120, 220, 240V
50/60 Hz (except Mexican model)
DIN power output (rated)

170 + 170 watts
(6 ohms at 1 kHz, DIN)

Continuous RMS power output (reference)

220 + 220 watts
(6 ohms at 1 kHz, 10% THD)

Inputs
GAME (VIDEO):

1 Vp-p, 75 ohms

(phono jack)
GAME (AUDIO):

Voltage 250 mV,

(phono jacks)

impedance 47 kilohms

MD/VIDEO (AUDIO) IN:

voltage 450 mV/250 mV,

(phono jacks)

impedance 47 kilohms

MIC:

sensitivity 1 mV,

(phone jack)

impedance 10 kilohms

Outputs
VIDEO OUT:

max. output level 1 Vp-p,

(phono jacks)

unbalanced, Sync.
negative load impedance 75 ohms

PHONES:

accepts headphones of

(stereo mini jack)

 8 ohms or more

FRONT SPEAKER:

accepts impedance of 6 to 16 ohms

SURROUND SPEAKER:

accepts impedance of 24 ohms or more

CD player section
System

Compact disc and digital audio system

Laser

Semiconductor laser
(

λ=795nm)

Laser Output

Max. 44.6 

µW*

*This output is the value measured at a
distance of 200 mm from the objective
lens surface on the Optical Pick-up
Block with 7 mm aperture.

Frequency response

2 Hz – 20 kHz (

±0.5 dB)

Wave length

795 nm

CD OPTICAL DIGITAL OUT
(Square optical connector jack, rear panel)
Wave length

660 nm

Output Level

–18 dBm

Tape player section
Recording system

4-track 2-channel stereo

Frequency response

50 – 13,000 Hz (

±3 dB), using Sony

TYPE I cassette

2

Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-

aged by heat.

Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270 ˚C dur-

ing repairing.

• Do not touch the soldering iron on the same conductor of the

circuit board (within 3 times).

• Be careful not to apply force on the conductor when soldering

or unsoldering.

CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous ra-
diation exposure.

COMPONENTS  IDENTIFIED  BY  MARK  0  OR  DOTTED
LINE  WITH  MARK  0  ON  THE  SCHEMATIC  DIAGRAMS
AND  IN  THE  PARTS  LIST  ARE  CRITICAL  TO  SAFE
OPERATION.  REPLACE  THESE  COMPONENTS  WITH
SONY  PARTS  WHOSE  PART  NUMBERS  APPEAR  AS
SHOWN  IN  THIS  MANUAL  OR  IN  SUPPLEMENTS  PUB-
LISHED  BY  SONY.

This appliance is classified as
a CLASS 1 LASER product.
The CLASS 1 LASER
PRODUCT MARKING is
located on the rear exterior.

Tuner section
FM stereo, FM/AM superheterodyne tuner

FM tuner section
Tuning range

87.5 – 108.0 MHz

Antenna

FM lead antenna

Antenna terminals

75 ohm unbalanced

Intermediate frequency

10.7 MHz

AM tuner section
Tuning range
Latin Americanmodels:

530 – 1,710 kHz
(with the interval set at 10 kHz)
531 – 1,710 kHz
(with the interval set at 9 kHz)

Middle Eastern models: 531 – 1,602 kHz

(with the interval set at 9 kHz)

Other models:

531 – 1,602 kHz
(with the interval set at 9 kHz)
530 – 1,710 kHz
(with the interval set at 10 kHz)

Antenna

AM loop antenna

Antenna terminals

External antenna terminal

Intermediate frequency

450 kHz

General
Power requirements
Mexican models:

120V or 127V AC, 60 Hz

Argentina models:

220 V AC, 50/60 Hz

Australian model:

240V AC, 50/60 Hz

Other models:

120 V, 220 V or 230 - 240 V AC, 50/60 Hz
Adjustable with voltage selector

Power consumption

250 watts

Dimensions (w/h/d)

Approx. 280 x 360 x 386.5 mm

Mass :

Approx. 13.6 kg

Design and specifications are subject to change without notice.

3

................................................

4

Location of Controls .......................................................

5

3-1. Case .................................................................................

8

3-2. Loading (Panel) ...............................................................

8

3-3. Front Panel Assy .............................................................

9

3-4. Tuner Pack, Sub Trans Board .........................................

9

3-5. CD Mechanism Deck ...................................................... 10
3-6. Game In Board, Tape Mechanism Deck ......................... 10
3-7. CD Switch Board, Display Board .................................. 11
3-8. Volume Board .................................................................. 11
3-9. Subwoofer Board, Rear Panel ........................................ 12
3-10. Main Board ...................................................................... 12
3-11. Power Amp Board ........................................................... 13
3-12. SW Board, Driver Board ................................................. 13
3-13. CD Board, CD Block Assy ............................................. 14
3-14. Sensor Board ................................................................... 14
3-15. Motor (TB) Board ........................................................... 15
3-16. Motor (LD) Board ........................................................... 15

.............................................................. 16

....................... 20

Deck section .................................................................... 20
CD Section ...................................................................... 22

7-1. Circuit Board Location ................................................... 26
7-2. Block Diagram  – CD Servo Section – ........................... 28

Block Diagram  – Tuner/Tape Deck Section – ............... 29
Block Diagram  – Main/Power Section – ....................... 30
Block Diagram  – Display Section – .............................. 31

7-3. Printed Wiring Board  – CD Board – ............................. 32
7-4. Schematic Diagram  – CD Board – ................................ 33
7-5. Printed Wiring Board  – CD Mechanism Board – ......... 34
7-6. Schematic Diagram  – CD Mechanism Board – ............ 35
7-7. Printed Wiring Boards  – Main Board – ......................... 36
7-8. Schematic Diagram  – Main Board (1/3) – .................... 37
7-9. Schematic Diagram  – Main Board (2/3) – .................... 38
7-10. Schematic Diagram  – Main Board (3/3) – .................... 39
7-11. Printed Wiring Boards

– Game In, CD Switch Board – ...................................... 40

7-12. Schematic Diagram

– Game In, CD Switch Board – ...................................... 41

7-13. Printed Wiring Board  – Display Board – ...................... 42

7-14. Schematic Diagram  – Display Board – ......................... 43
7-15. Printed Wiring Board  – Power Amp Board – ................ 44
7-16. Schematic Diagram  – Power Amp Board – .................. 45
7-17. Printed Wiring Board  – Subwoofer Board – ................. 46
7-18. Schematic Diagram  – Subwoofer Board – .................... 47
7-19. Printed Wiring Boards  – Trans Board – ........................ 48
7-20. Schematic Diagram  – Trans Board – ............................. 49
7-21. IC Block Diagram ........................................................... 50
7-22. IC Pin Function Description ........................................... 51

8-1. Case, Rear Panel Section ................................................ 56
8-2. Front Panel Section ......................................................... 57
8-3. Chassis Section ............................................................... 58
8-4. CD Mechanism Deck Section-1

(CDM74-K6BD47S) ....................................................... 59

8-5. CD Mechanism Deck Section-2

(CDM74-K6BD47S) ....................................................... 60

............................... 61

4

The laser diode in the optical pick-up block may suffer electro-
static break-down because of the potential difference generated
by the charged electrostatic load, etc. on clothing and the human
body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.

NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused
on the disc reflective surface by the objective lens in the optical
pick-up block. Therefore, when checking the laser diode emis-
sion, observe from more than 30 cm away from the objective lens.

LASER  DIODE  AND  FOCUS  SEARCH  OPERATION
CHECK
Carry out the “S curve check” in “CD section adjustment” and
check that the S curve waveforms is output three times.

MODEL

PART No.

E2, E3models

4-244-107-0

[]

E51 model

4-244-107-1

[]

Mexican model

4-244-107-2

[]

Argentina model

4-244-107-3

[]

•

Abbreviation
E2

: 120 V AC Area in E model

E3

: 240 V AC Area in E model

E51

: Chilean and Peruvian model

PART No.