Read Sony HCD-FX350I Service Manual online
HCD-FX350i
2
1.
SERVICING NOTES
............................................. 3
2. DISASSEMBLY
2-1. Disassembly
Flow
........................................................... 5
2-2. Panel (Rear) Block .......................................................... 5
2-3. Top Panel Block .............................................................. 6
2-4. Front Panel Block ........................................................... 6
2-5. Knob
2-3. Top Panel Block .............................................................. 6
2-4. Front Panel Block ........................................................... 6
2-5. Knob
(VOL)
.................................................................... 7
2-6. Module (DAB Tuner) Block, MAIN Board .................... 7
2-7. Base
2-7. Base
Unit
......................................................................... 8
2-8. Optical Pick-up Block (DA11MMVGP) ........................ 8
3.
TEST MODE
............................................................ 9
4.
ELECTRICAL CHECK
......................................... 10
5 DIAGRAMS
5-1. Block Diagram - CD, TUNER Section - ........................ 12
5-2. Block
5-2. Block
Diagram
- OUTPUT, PANEL, POWER SUPPLY Section - ......... 13
5-3. Printed Wiring Board - BD73 Board - ............................ 16
5-4. Schematic Diagram - BD73 Board - ............................... 17
5-5. Schematic Diagram - MAIN Section (1/2) - ................... 18
5-6. Schematic Diagram - MAIN Section (2/2) - ................... 19
5-7. Printed Wiring Boards - MAIN Section - ....................... 20
5-8. Printed Wiring Board - IP Board - .................................. 21
5-9. Schematic Diagram - IP Board - ..................................... 21
5-10. Schematic Diagram - PANEL Board (1/2) - ................... 22
5-11. Schematic Diagram - PANEL Board (2/2) - ................... 23
5-12. Printed Wiring Board - PANEL Board - ......................... 24
5-13. Printed Wiring Board - PT Board - ................................. 25
5-14. Schematic Diagram - PT Board - .................................... 25
5-4. Schematic Diagram - BD73 Board - ............................... 17
5-5. Schematic Diagram - MAIN Section (1/2) - ................... 18
5-6. Schematic Diagram - MAIN Section (2/2) - ................... 19
5-7. Printed Wiring Boards - MAIN Section - ....................... 20
5-8. Printed Wiring Board - IP Board - .................................. 21
5-9. Schematic Diagram - IP Board - ..................................... 21
5-10. Schematic Diagram - PANEL Board (1/2) - ................... 22
5-11. Schematic Diagram - PANEL Board (2/2) - ................... 23
5-12. Printed Wiring Board - PANEL Board - ......................... 24
5-13. Printed Wiring Board - PT Board - ................................. 25
5-14. Schematic Diagram - PT Board - .................................... 25
6.
EXPLODED VIEWS
6-1. Overall
Section
............................................................... 28
6-2. Top Panel Section ........................................................... 29
6-3. Front Panel Section ......................................................... 30
6-4. Chassis
6-3. Front Panel Section ......................................................... 30
6-4. Chassis
Section
............................................................... 31
7.
ELECTRICAL PARTS LIST
.............................. 32
TABLE OF CONTENTS
NOTES ON CHIP COMPONENT REPLACEMENT
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
FLEXIBLE CIRCUIT BOARD REPAIRING
• Keep the temperature of soldering iron around 270 °C during
• Keep the temperature of soldering iron around 270 °C during
repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
SAFETY-RELATED COMPONENT WARNING!
COMPONENTS IDENTIFIED BY MARK
0 OR DOTTED LINE
WITH MARK
0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS
REPLACE THESE COMPONENTS WITH SONY PARTS
WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
This appliance is classifi ed as
a CLASS 1 LASER product.
This marking is located on the
rear exterior.
a CLASS 1 LASER product.
This marking is located on the
rear exterior.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specifi ed herein may result in hazardous radia-
tion exposure.
Use of controls or adjustments or performance of procedures
other than those specifi ed herein may result in hazardous radia-
tion exposure.
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