HCD-F150, HCD-FR10, MHC-F150, MHC-FR10 - Sony Audio Service Manual (repair manual). Page 4

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– FRONT PANEL – ······························································· 5
– REAR PANEL – ·································································· 6

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Deck Section ········································································ 21
CD Section ··········································································· 25

6-1.

Block Diagram –CD Section– ·········································· 27

6-2.

Block Diagram –Main Section– ······································· 29

6-3.

Block Diagram –Audio Section– ····································· 31

6-4.

Circuit Boards Location ··················································· 33

6-5.

Printed Wiring Board –BD Section– ································ 35

6-6.

Schematic Diagram –BD Section– ··································· 37

6-7.

Printed Wiring Board –CD Motor Section– ····················· 39

6-8.

Schematic Diagram –CD Motor Section– ························ 41

6-9.

Printed Wiring Board –Audio Section– ···························· 43

6-10. Schematic Diagram –Audio Section– ······························ 45
6-11. Printed Wiring Board –Leaf SW Section– ······················· 47
6-12. Schematic Diagram –Leaf SW Section– ·························· 49
6-13. Printed Wiring Board –Main Section– ····························· 51
6-14. Schematic Diagram –Main (1/5) Section– ······················· 53
6-15. Schematic Diagram –Main (2/5) Section– ······················· 55
6-16. Schematic Diagram –Main (3/5) Section– ······················· 57
6-17. Schematic Diagram –Main (4/5) Section– ······················· 59
6-18. Schematic Diagram –Main (5/5) Section– ······················· 61
6-19. Printed Wiring Board –Panel Section– ····························· 63
6-20. Schematic Diagram –Panel Section– ······························· 65
6-21. Printed Wiring Board –Power Section– ··························· 67
6-22. Schematic Diagram –Power Section– ······························ 69
6-23. Waveforms ········································································ 71
6-24. IC Pin Function Description ············································· 72
6-25. IC Block Diagrams ··························································· 80

····················································· 82

····································· 90

The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.

The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission, observe
from more than 30 cm away from the objective lens.

Carry out the “S curve check” in “CD section adjustment” and check
that the S curve waveform is output repeatedly.

•

Never reuse a disconnected chip component.

•

Notice that the minus side of a tantalum capacitor may be damaged
by heat.

•

Keep the temperature of the soldering iron around 270 ˚C during
repairing.

•

Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).

•

Be careful not to apply force on the conductor when soldering or
unsoldering.