HCD-EX6, HCD-EX6T, HCD-EX8, HCD-EX8T, HCD-EX9, HCD-EX9T, MHC-EX6, MHC-EX6T, MHC-EX8, MHC-EX8T, MHC-EX9, MHC-EX9T - Sony Audio Service Manual (repair manual)

2012B33-1

© 

2012.02

•  HCD-EX6 is the amplifi er, USB, CD player 

and tuner section in MHC-EX6.

•  HCD-EX6T is the amplifi er, USB, CD player, 

tape deck and tuner section in MHC-EX6T.

•  HCD-EX8 is the amplifi er, USB, CD player 

and tuner section in MHC-EX8.

•  HCD-EX8T is the amplifi er, USB, CD player, 

tape deck and tuner section in MHC-EX8T.

•  HCD-EX9 is the amplifi er, USB, CD player 

and tuner section in MHC-EX9.

•  HCD-EX9T is the amplifi er, USB, CD player, 

tape deck and tuner section in MHC-EX9T.

CD Section

Model Name Using Similar Mechanism

New

Mechanism Type

CDM88CL-D1BD74UR

Optical Pick-up Block Name

DA11MMVGP

Tape Deck Section
(HCD-EX6T/EX8T/EX9T)

Model Name Using Similar Mechanism

HCD-EC69T/EC79T/EC99T

Tape Transport Mechanism Type

TCM-J1 or CS-21SC-901TP

The following measured at AC 127 V,
60 Hz (Mexican model)
The following measured at AC 220 V,
50/60 Hz (Argentine model)
The following measured at AC 120 V,
220 V, 240 V, 50/60 Hz (Other models)

Front Speaker:
Power output (rated):
 Low 

channel

 

40 W + 40 W (at 8 

, 1 kHz, 1%

 THD)
 High 

channel

 

40 W + 40 W (at 8 

, 1 kHz, 1%

 THD)
RMS output power (reference):
 Low 

channel

 

85 W + 85 W (per channel at 8 

,

 1 

kHz)

 High 

channel

 

85 W + 85 W (per channel at 8 

,

 1 

kHz)

Subwoofer:
RMS output power (reference):
 

125 W (at 4 

, 80 Hz)

Power output (rated):
 Low 

channel

 

50 W + 50 W (at 8 

, 1 kHz, 1%

 THD)
 High 

channel

 

50 W + 50 W (at 8 

, 1 kHz, 1%

 THD)

RMS output power (reference):
 Low 

channel

 

100 W + 100 W (per channel at 8 

,

 1 

kHz)

 High 

channel

 

100 W + 100 W (per channel at 8 

,

 1 

kHz)

Power output (rated):
 

40 W + 40 W (at 6 

, 1 kHz, 1%

 THD)
RMS output power (reference):
 

90 W + 90 W (per channel at 6 

,

 1 

kHz)

PC IN (stereo mini jack):
 

Sensitivity 800 mV, impedance

 22 

kilohms

PHONES (stereo mini jack):
 

accepts headphones with an

 

impedance of 8 

 or more

SPEAKERS: impedance
 HCD-EX9/EX9T/EX8/EX8T: 

8 



 HCD-EX6/EX6T: 

6 



SUBWOOFER (HCD-EX9/EX9T only):
 impedance 

4 



Supported bit rate:
 

MP3 (MPEG 1 Audio Layer-3):

 

32 kbps – 320 kbps, VBR

 

WMA: 48 kbps – 192 kbps

 

AAC: 48 kbps – 320 kbps

Sampling frequencies:
 

MP3 (MPEG 1 Audio Layer-3):

 32/44.1/48 

kHz

 

WMA: 44.1 kHz

 

AAC: 44.1 kHz

 (USB) port:

 Maximum 

current:

 500 

mA

System:
 

Compact disc and digital audio

 system
Laser Diode Properties
 

Emission Duration: Continuous

 

Laser Output*: Less than 44.6

W

 

* This output is the value

 

  measurement at a distance of

 

  200mm from the objective lens

 

  surface on the Optical Pick-up 

 

  Block with 7mm aperture.

Frequency response: 20 Hz – 20 kHz
Signal-to-noise ratio: More than 90 dB
Dynamic range: More than 88 dB

Recording system: 4-track 2-channel, stereo

FM stereo, FM/AM superheterodyne tuner
Antenna:
 

FM lead antenna

 

AM loop antenna

FM tuner section:
Tuning range:
 

87.5 MHz – 108.0 MHz (50 kHz step)

Intermediate frequency: 225 kHz

AM tuner section:
Tuning range
Latin American models:
 

530 kHz – 1,710 kHz (10 kHz step)

 

531 kHz – 1,710 kHz (9 kHz step)

Other models:
 

531 kHz – 1,602 kHz (9 kHz step)

 

530 kHz – 1,610 kHz (10 kHz step)

Intermediate frequency: 53 kHz

– Continued on next page –

Photo: HCD-EX9T

•  MPEG Layer-3 audio coding technology and pat-

ents licensed from Fraunhofer IIS and Thomson.

•  Windows Media is a registered trademark of 

Microsoft Corporation in the United States and/or 
other countries.

  .............................................   3

2-1.   Side Panel (R)/(L)  ..........................................................   7
2-2.  Top Panel Section ...........................................................   7
2-3.   Tape Mechanism Deck (HCD-EX6T/EX8T/EX9T) .......   8
2-4.   Front Panel Section .........................................................   8
2-5. MAIN 

Board 

...................................................................   9

2-6.  Back Panel Section .........................................................   10
2-7.  CD Mechanism Section ..................................................   11
2-8. Belt 

(DLM3A) 

................................................................  11

2-9. Base 

Unit 

.........................................................................  12

2-10. BD74 Board ....................................................................   12

  ............................................................   13

  ......................   15

  ........................   15

6-1.  Block Diagram –CD/Tuner Section– ..............................   21
6-2.  Block Diagram –Tape/Audio Section– ...........................   22
6-3.  Block Diagram –Display/Power Supply Section– ..........   23
6-4.  Printed Wiring Board –CD Section– ..............................   24
6-5.  Schematic Diagram –CD Section– .................................   25
6-6.  Printed Wiring Board –USB Section– ............................   26
6-7.  Schematic Diagram –USB Section– ...............................   27
6-8.  Printed Wiring Board –Panel Section– ...........................   28
6-9.  Schematic Diagram –Panel Section– ..............................   29
6-10.  Printed Wiring Board –USB-JACK Section– .................   30
6-11.  Schematic Diagram –USB-JACK Section– ....................   30
6-12.  Printed Wiring Boards –MAIN-AMP Section– ..............   31
6-13.  Schematic Diagram –MAIN-AMP Section (1/2)–..........   32
6-14.  Schematic Diagram –MAIN-AMP Section (2/2)–..........   33
6-15.  Printed Wiring Board –Power Supply Section– .............   34
6-16.  Schematic Diagram –Power Supply Section– ................   35
6-17.  Schematic Diagram –Tape Deck Section
 (HCD-EX6T/EX8T/EX9T)– 

..........................................  

36

6-18.  Printed Wiring Board –Tape Deck Section
 (HCD-EX6T/EX8T/EX9T)– 

..........................................  

37

7-1. Overall 

Section 

...............................................................  46

7-2.  Front Panel Section .........................................................   47
7-3.  Top Panel Section (HCD-EX6T/EX8T/EX9T) ..............   48
7-4. Chassis 

Section 

...............................................................  49

7-5.  MAIN Board Section ......................................................   50
7-6.  CD Mechanism Section (CDM88CL-D1BD74UR) .......   51

  ..............................   52

Accessories are given in the last of the electrical parts list.

NOTES  ON  CHIP  COMPONENT  REPLACEMENT
• 

Never reuse a disconnected chip component.

• 

Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.

FLEXIBLE  CIRCUIT  BOARD  REPAIRING
• 

Keep the temperature of soldering iron around 270 °C during 
repairing.

• 

Do not touch the soldering iron on the same conductor of the 
circuit board (within 3 times).

• 

Be careful not to apply force on the conductor when soldering 
or unsoldering.

0  OR  DOTTED  LINE  

0  ON  THE  SCHEMATIC  DIAGRAMS  AND  IN  

Power requirements
 Mexican 

model:

 

AC 127 V, 60 Hz

 Argentine 

model:

 

AC 220 V, 50/60 Hz

 Other 

models:

 

AC 120 V, 220 V or 230 V – 240 V,

 

50/60 Hz, adjustable with voltage

 selector
Power consumption
 HCD-EX9/EX9T: 

175 

W

 

(0.5 W at the Power Saving Mode)

 HCD-EX8/EX8T: 

170 

W

 

(0.5 W at the Power Saving Mode)

 HCD-EX6/EX6T: 

110 

W

 

(0.5 W at the Power Saving Mode)

Dimensions (W/H/D) (excl. speakers)
 

Approx. 200 mm × 306 mm ×

 350 

mm

Mass (excl. speakers)
 

HCD-EX9: Approx. 6.7 kg

 

HCD-EX9T: Approx. 7.0 kg

 

HCD-EX8: Approx. 6.6 kg

 

HCD-EX8T: Approx. 6.9 kg

 

HCD-EX6: Approx. 5.6 kg

 

HCD-EX6T: Approx. 5.9 kg

Design and specifi cations are subject to
change without notice.

CAUTION
Use of controls or adjustments or performance of procedures 
other than those specifi ed herein may result in hazardous radia-
tion exposure.

This appliance is classifi ed as 
a CLASS 1 LASER product.
This marking is located on the 
rear exterior.

UNLEADED  SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution:  Some printed circuit boards may not come printed with 

the lead free mark due to their particular size)

Unleaded solder has the following characteristics.
•  Unleaded solder melts at a temperature about 40 °C higher 

than ordinary solder.

 

Ordinary soldering irons can be used but the iron tip has to be 
applied to the solder joint for a slightly longer time.

 

Soldering irons using a temperature regulator should be set to 
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if 

the heated tip is applied for too long, so be careful!

• Strong 

viscosity

 

Unleaded solder is more viscous (sticky, less prone to fl ow) 
than ordinary solder so use caution not to let solder bridges 
occur such as on IC pins, etc.

•  Usable with ordinary solder
 

It is best to use only unleaded solder but unleaded solder may 
also be added to ordinary solder.

The laser diode in the optical pick-up block may suffer electro-
static break-down because of the potential difference generated by 
the charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also 
use the procedure in the printed matter which is included in the 
repair parts.
The fl exible board is easily damaged and should be handled with 
care.

NOTES  ON  LASER  DIODE  EMISSION  CHECK
The laser beam on this model is concentrated so as to be focused 
on the disc refl ective surface by the objective lens in the optical 
pickup block. Therefore, when checking the laser diode emission, 
observe from more than 30 cm away from the objective lens.

• Abbreviation
  E4 

: 220 – 240V AC area in E model

 AR  : 

Argentina 

model

  MX 

: Mexican model

  E2 

: 120V AC area in E model

  E51 

: Chilean and Peruvian models

EX6T: E4 model

4-178-730-0[]

EX6: AR model

4-178-731-0[]

EX8T: E4 model

4-178-733-0[]

EX8: AR model

4-178-734-0[]

EX8: MX model

4-178-735-0[]

EX9T: E4 model

4-178-736-0[]

EX9: AR model

4-178-737-0[]

EX9: MX model

4-178-738-0[]

EX6: E2, E51 models

*

EX8: E2, E51 models

*

EX9: E2, E51 models

*

RELEASING  THE  DISC  TRAY  LOCK
The disc tray lock function for the antitheft of an demonstration 
disc in the store is equipped.

Releasing Procedure:
1. Press 

[

?/1

] button to turn the power on.

2.  Press the [FUNCTION] button to select CD function.
3.  While pressing the [

x

] button, press the [

Z

] button for more 5 

seconds).

4.  The message “UNLOCKED” is displayed and the disc tray is 

unlocked.

Note: When “LOCKED” is displayed, the slot lock is not released by turn-

ing power on/off with the [?/1] button.

*

: Since the HCD-EX6/EX8/EX9: E2 and E51 models have their 

model number labels marked directly on the back panel, the 
model number labels have no relative part numbers.

  Because of this, determine the model through the marked model 

number when comparing the difference between these models.

1 Turn a gear by a driver 

2 Pull the tray by the hand.

2 VOL knob

1 Push the VOL knob by the flat head driver.

Note: Please take out the side panel (R) from a set refer to DISASSEMBLY (page 7).