Read Sony HCD-ECL5 Service Manual online
SERVICE MANUAL
Sony Corporation
Published by Sony Techno Create Corporation
HCD-ECL5
SPECIFICATIONS
COMPACT DISC RECEIVER
9-893-805-01
2013H33-1
©
2013.08
E Model
Russian Model
Ver. 1.0 2013.08
• HCD-ECL5 is compact disc receiver in MHC-ECL5.
Model Name Using Similar Mechanism
NEW
Mechanism Type
TDL-5
HCD-ECL5
2
1.
SERVICING NOTES
.............................................
3
2. DISASSEMBLY
2-1. Disassembly
Flow
........................................................... 6
2-2. Side Cover, Top Cover Assy ........................................... 7
2-3. Power Cord (AC1), Rear Panel Block ............................ 8
2-4. CD
2-3. Power Cord (AC1), Rear Panel Block ............................ 8
2-4. CD
Door
.......................................................................... 9
2-5. Front Panel Block ........................................................... 9
2-6. MAIN Board Block ........................................................ 10
2-7. MAIN
2-6. MAIN Board Block ........................................................ 10
2-7. MAIN
Board
................................................................... 10
2-8. POWER
Board
................................................................ 11
2-9. FRONT
Board
................................................................. 12
2-10. USB Board ...................................................................... 13
2-11. Loader with FFC (TDL-5) (CDM1) ............................... 13
2-11. Loader with FFC (TDL-5) (CDM1) ............................... 13
3.
TEST MODE
............................................................ 14
4.
ELECTRICAL CHECK
......................................... 15
5. DIAGRAMS
5-1. Block
Diagram
................................................................ 16
5-2. Printed Wiring Board - MAIN Board - ........................... 18
5-3. Schematic Diagram - MAIN Board (1/7) - ..................... 19
5-4. Schematic Diagram - MAIN Board (2/7) - ..................... 20
5-5. Schematic Diagram - MAIN Board (3/7) - ..................... 21
5-6. Schematic Diagram - MAIN Board (4/7) - ..................... 22
5-7. Schematic Diagram - MAIN Board (5/7) - ..................... 23
5-8. Schematic Diagram - MAIN Board (6/7) - ..................... 24
5-9. Schematic Diagram - MAIN Board (7/7) - ..................... 25
5-10. Printed Wiring Boards - TUNER/USB Boards - ............ 26
5-11. Schematic Diagram - TUNER/USB Boards - ................. 27
5-12. Printed Wiring Board - FRONT Board - ......................... 28
5-13. Schematic Diagram - FRONT Board - ........................... 29
5-14. Schematic Diagram - POWER Board - .......................... 30
5-15. Printed Wiring Board - POWER Board - ........................ 31
5-3. Schematic Diagram - MAIN Board (1/7) - ..................... 19
5-4. Schematic Diagram - MAIN Board (2/7) - ..................... 20
5-5. Schematic Diagram - MAIN Board (3/7) - ..................... 21
5-6. Schematic Diagram - MAIN Board (4/7) - ..................... 22
5-7. Schematic Diagram - MAIN Board (5/7) - ..................... 23
5-8. Schematic Diagram - MAIN Board (6/7) - ..................... 24
5-9. Schematic Diagram - MAIN Board (7/7) - ..................... 25
5-10. Printed Wiring Boards - TUNER/USB Boards - ............ 26
5-11. Schematic Diagram - TUNER/USB Boards - ................. 27
5-12. Printed Wiring Board - FRONT Board - ......................... 28
5-13. Schematic Diagram - FRONT Board - ........................... 29
5-14. Schematic Diagram - POWER Board - .......................... 30
5-15. Printed Wiring Board - POWER Board - ........................ 31
6.
EXPLODED VIEWS
6-1. Cover
Section
.................................................................. 32
6-2. Rear Panel Section .......................................................... 33
6-3. Front Panel Section ......................................................... 34
6-4. Main
6-3. Front Panel Section ......................................................... 34
6-4. Main
Section
................................................................... 35
7.
ELECTRICAL PARTS LIST
.............................. 36
TABLE OF CONTENTS
SAFETY-RELATED COMPONENT WARNING!
COMPONENTS IDENTIFIED BY MARK
0 OR DOTTED LINE
WITH MARK
0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS
REPLACE THESE COMPONENTS WITH SONY PARTS
WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specifi ed herein may result in hazardous radia-
tion exposure.
Use of controls or adjustments or performance of procedures
other than those specifi ed herein may result in hazardous radia-
tion exposure.
HCD-ECL5
3
SECTION 1
SERVICING NOTES
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electro-
static break-down because of the potential difference generated by
the charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The fl exible board is easily damaged and should be handled with
care.
static break-down because of the potential difference generated by
the charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The fl exible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused
on the disc refl ective surface by the objective lens in the optical
pickup block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
The laser beam on this model is concentrated so as to be focused
on the disc refl ective surface by the objective lens in the optical
pickup block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher
• Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong
viscosity
Unleaded solder is more viscous (sticky, less prone to fl ow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
•
Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
also be added to ordinary solder.
ABOUT PART REPAIR OF EACH BOARD
When boards installed by this unit are defective, replace the com-
plete board. However, AMP IC (U22) on the MAIN board and fuse
(F501) on the POWER board are replaceable.
Printed wiring board and schematic diagram that have been de-
scribed on this service manual are for reference.
When boards installed by this unit are defective, replace the com-
plete board. However, AMP IC (U22) on the MAIN board and fuse
(F501) on the POWER board are replaceable.
Printed wiring board and schematic diagram that have been de-
scribed on this service manual are for reference.
TEST DISCS
Use following TEST DISC (for CD) when this unit confi rms the
operation and checks it.
Use following TEST DISC (for CD) when this unit confi rms the
operation and checks it.
Part No.
Description
3-702-101-01 DISC
(YEDS-18),
TEST
4-225-203-01 DISC
(PATD-012),
TEST
RELEASING THE DISC TRAY LOCK
The disc tray lock function for the antitheft of sample disc in the
shop is equipped.
The disc tray lock function for the antitheft of sample disc in the
shop is equipped.
Releasing Procedure:
1. Press the [
1. Press the [
?/1
] button to turn the power on.
2. Press two buttons of the [x] and [Z] simultaneously for fi ve
seconds.
3. The message “UNLOCKED” is displayed on the fluorescent
indicator tube and the disc tray is unlocked.
Note: When “LOCKED” is displayed, the disc tray lock is not released by
turning power on/off with the [?/1] button.
CAPACITOR ELECTRICAL DISCHARGE PROCESSING
When checking the board, the electrical discharge is necessary for
the electric shock prevention.
Connect the resistor to both ends of respective capacitors.
When checking the board, the electrical discharge is necessary for
the electric shock prevention.
Connect the resistor to both ends of respective capacitors.
• POWER
Board
CE502
– POWER Board (Conductor Side) –
800
/2 W
(for CE502)
HCD-ECL5
4
MODEL IDENTIFICATION
Distinguish by model number label stuck on the rear side of a main unit.
Distinguish by model number label stuck on the rear side of a main unit.
Note: The printed contents of following fi gure model number label may be different from the model number label of a main unit.
– Rear view –
MODEL NUMBER LABEL
120V AC area in E model
Chilean and Peruvian models
Mexican model
Argentina model
Russian model