Read Sony HCD-EC68W / MHC-EC68W Service Manual online
HCD-EC68W
2
1.
SERVICING NOTES
............................................. 3
2. GENERAL
.................................................................. 6
3. DISASSEMBLY
3-1. Disassembly
Flow
........................................................... 8
3-2. Side
Panel
(L)/(R)
........................................................... 9
3-3. Top Panel Block .............................................................. 9
3-4. Tape Mechanism Deck .................................................... 10
3-5. MAIN
3-4. Tape Mechanism Deck .................................................... 10
3-5. MAIN
Board
................................................................... 10
3-6. Front Panel Section ......................................................... 11
3-7. Back Panel Block ............................................................ 11
3-8. CD
3-7. Back Panel Block ............................................................ 11
3-8. CD
Mechanism
Block
..................................................... 12
3-9. BU
Block
........................................................................ 12
3-10. OP Base Assy (KSM-213D) ........................................... 13
3-11. Belt (DLM3A) ................................................................ 13
3-11. Belt (DLM3A) ................................................................ 13
4.
TEST MODE
............................................................ 14
5. MECHANICAL
ADJUSTMENTS
...................... 18
6. ELECTRICAL
ADJUSTMENTS
........................ 18
7. DIAGRAMS
7-1. Printed Wiring Board - CD Board - ................................ 24
7-2. Schematic Diagram - CD Board - ................................... 25
7-3. Printed Wiring Board - DECK Board - ........................... 26
7-4. Schematic Diagram - DECK Board - ............................. 26
7-5. Printed Wiring Board - MAIN Board - ........................... 27
7-6. Schematic Diagram - MAIN Board (1/2) - ..................... 28
7-7. Schematic Diagram - MAIN Board (2/2) - ..................... 29
7-8. Printed Wiring Board - PANEL Board - ......................... 30
7-9. Schematic Diagram - PANEL Board - ............................ 31
7-10. Printed Wiring Boards
7-2. Schematic Diagram - CD Board - ................................... 25
7-3. Printed Wiring Board - DECK Board - ........................... 26
7-4. Schematic Diagram - DECK Board - ............................. 26
7-5. Printed Wiring Board - MAIN Board - ........................... 27
7-6. Schematic Diagram - MAIN Board (1/2) - ..................... 28
7-7. Schematic Diagram - MAIN Board (2/2) - ..................... 29
7-8. Printed Wiring Board - PANEL Board - ......................... 30
7-9. Schematic Diagram - PANEL Board - ............................ 31
7-10. Printed Wiring Boards
- AUDIO IN/OUT, KEY, POWER SUPPLY Section - ... 32
7-11. Schematic Diagram
- AUDIO IN/OUT, KEY, POWER SUPPLY Section - ... 33
8.
EXPLODED VIEWS
8-1. Panel
Section
................................................................... 39
8-2. Tape Deck Section .......................................................... 40
8-3. Front Panel Section ......................................................... 41
8-4. Chassis
8-3. Front Panel Section ......................................................... 41
8-4. Chassis
Section
............................................................... 42
8-5. Main
Section
................................................................... 43
8-6. CD Mechanism Section (CDM88A-K6BD90-WOD) .... 44
9.
ELECTRICAL PARTS LIST
.............................. 45
TABLE OF CONTENTS
NOTES ON CHIP COMPONENT REPLACEMENT
•
•
Never reuse a disconnected chip component.
•
Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
aged by heat.
FLEXIBLE CIRCUIT BOARD REPAIRING
•
•
Keep the temperature of soldering iron around 270 °C during
repairing.
repairing.
•
Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
circuit board (within 3 times).
•
Be careful not to apply force on the conductor when soldering
or unsoldering.
or unsoldering.
SAFETY-RELATED COMPONENT WARNING!
COMPONENTS IDENTIFIED BY MARK
0 OR DOTTED LINE
WITH MARK
0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS
REPLACE THESE COMPONENTS WITH SONY PARTS
WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specifi ed herein may result in hazardous radia-
tion exposure.
Use of controls or adjustments or performance of procedures
other than those specifi ed herein may result in hazardous radia-
tion exposure.
This appliance is classifi ed as
a CLASS 1 LASER product.
This marking is located on the
rear exterior.
a CLASS 1 LASER product.
This marking is located on the
rear exterior.
Click on the first or last page to see other HCD-EC68W / MHC-EC68W service manuals if exist.