HCD-EC68, HCD-EC78, MHC-EC68, MHC-EC78 - Sony Audio Service Manual (repair manual). Page 2

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HCD-EC68/EC78
2
1. 
SERVICING  NOTES
  .............................................   3
2. GENERAL
  ..................................................................   6
3. DISASSEMBLY
3-1. Disassembly 
Flow 
...........................................................   8
3-2. Side 
Panel 
(L)/(R) 
...........................................................   9
3-3.  Top Panel (EC68: UK model)/Top Panel Block 
 
(Except EC68: UK model) ..............................................   9
3-4.  Tape Mechanism Deck (Except EC68: UK model) ........   10
3-5. MAIN 
Board 
...................................................................  10
3-6.  Front Panel Section .........................................................   11
3-7.  Back Panel Block ............................................................   11
3-8. CD 
Mechanism 
Block 
.....................................................  12
3-9. BU 
Block 
........................................................................  12
3-10.  OP Base Assy (KSM-213D) ...........................................   13
4. 
TEST  MODE 
 ............................................................   14
5. MECHANICAL 
 
ADJUSTMENTS 
 ......................   18
6. ELECTRICAL 
 
ADJUSTMENTS 
 ........................   18
7. DIAGRAMS
7-1.  Printed Wiring Board - CD Board - ................................   24
7-2.  Schematic Diagram - CD Board - ...................................   25
7-3. Printed 
Wiring 
Board 
 
- DECK Board (Except EC68: UK model) - ..................   26
7-4. Schematic 
Diagram 
 
- DECK Board (Except EC68: UK model) - ..................   26
7-5.  Printed Wiring Board - MAIN Board - ...........................   27
7-6.  Schematic Diagram - MAIN Board (1/2) - .....................   28
7-7.  Schematic Diagram - MAIN Board (2/2) - .....................   29
7-8.  Printed Wiring Board - HI AMP Board (EC78) - ...........   30
7-9.  Schematic Diagram - HI AMP Board (EC78) - ..............   30
7-10.  Printed Wiring Board - LOW AMP Board - ...................   31
7-11.  Schematic Diagram - LOW AMP Board - ......................   31
7-12.  Printed Wiring Board - PANEL Board (Suffi x-12) - ......   32
7-13.  Printed Wiring Board - PANEL Board (Suffi x-13) - ......   32
7-14.  Schematic Diagram - PANEL Board - ............................   33
7-15.  Printed Wiring Boards - KEY Section - ..........................   34
7-16.  Schematic Diagram - KEY Section - ..............................   34
7-17.  Printed Wiring Board - PT Board - .................................   35
7-18.  Schematic Diagram - PT Board - ....................................   36
8. 
EXPLODED  VIEWS
8-1. Panel 
Section 
...................................................................  44
8-2.  Tape Deck Section (Except EC68: UK)..........................   45
8-3.  Front Panel Section .........................................................   46
8-4. Chassis 
Section 
...............................................................  47
8-5. Main 
Section 
...................................................................  48
8-6.  CD Mechanism Section (CDM88A-K6BD90-WOD) ....   49
9. 
ELECTRICAL  PARTS  LIST
  ..............................   50
TABLE  OF  CONTENTS
SAFETY-RELATED COMPONET WARNING!
COMPONENTS  IDENTIFIED  BY  MARK 0 OR  DOTTED  LINE  
WITH  MARK 
0 ON  THE  SCHEMATIC  DIAGRAMS  AND  IN  
THE  PARTS  LIST  ARE  CRITICAL  TO  SAFE  OPERATION.
REPLACE  THESE  COMPONENTS  WITH  SONY  PARTS 
 
WHOSE  PART  NUMBERS  APPEAR  AS  SHOWN  IN  THIS  
MANUAL  OR  IN  SUPPLEMENTS  PUBLISHED  BY  SONY.
Notes on chip component replacement
• 
Never reuse a disconnected chip component.
• 
Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
Flexible Circuit Board Repairing
• 
Keep the temperature of soldering iron around 270 °C during 
repairing.
• 
Do not touch the soldering iron on the same conductor of the 
circuit board (within 3 times).
• 
Be careful not to apply force on the conductor when soldering 
or unsoldering.
This appliance is 
classified as a CLASS 1
LASER product. This
marking is located on the 
rear exterior.
CAUTION
Use of controls or adjustments or performance of procedures other than 
those specifi ed herein may result in hazardous radiation exposure.
General
Power requirements:
European and Russian models: AC 230 V, 50/60 Hz
Mexican model: AC 127 V, 60 Hz
Argentine model: AC 220 V, 50/60 Hz
Australian model: AC 230 – 240 V, 50/60 Hz
Other models: AC 120, 220 or 230 – 240 V, 50/60 Hz,
adjustable with voltage selector
Power consumption:
HCD-EC78
European and Russian models: 160 W
0.5 W (in Power Saving Mode)
Mexican model: 160 W
Other models: 150 W
HCD-EC68
European and Russian models (except for the UK model): 100 W
0.5 W (in Power Saving Mode)
Other models: 100 W
Dimensions (w/h/d) (excl. speakers):
Approx. 200 × 306 × 415 mm
Mass (excl. speakers):
HCD-EC78
European and Russian models: Approx. 6.0 kg
Other models: Approx. 6.3 kg
HCD-EC68
European and Russian models (except for the UK model): 
Other models: Approx. 5.3 kg
Approx. 5.3 kg
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