Read Sony HCD-E300HD / NAS-E300HD Service Manual online
77
HCD-E300HD
SECTION 7
ELECTRICAL PARTS LIST
A-1498-560-A CD BOARD, COMPLETE
*******************
< CAPACITOR >
C101 1-162-919-11 CERAMIC
CHIP 22PF
5% 50V
C102 1-162-919-11 CERAMIC
CHIP 22PF
5% 50V
C103 1-162-919-11 CERAMIC
CHIP 22PF
5% 50V
C104 1-164-230-11 CERAMIC
CHIP 220PF 5% 50V
C105 1-162-919-11 CERAMIC
CHIP 22PF
5% 50V
C106 1-164-230-11 CERAMIC
CHIP 220PF 5% 50V
C201 1-128-995-21 ELECT
CHIP 100uF 20% 10V
C202 1-164-360-11 CERAMIC
CHIP 0.1uF
16V
C203 1-128-995-21 ELECT
CHIP 100uF 20% 10V
C204 1-164-360-11 CERAMIC
CHIP 0.1uF
16V
C205 1-164-360-11 CERAMIC
CHIP 0.1uF
16V
C206 1-164-360-11 CERAMIC
CHIP 0.1uF
16V
C207 1-128-995-21 ELECT
CHIP 100uF 20% 10V
C208 1-164-360-11 CERAMIC
CHIP 0.1uF
16V
C210 1-164-360-11 CERAMIC
CHIP 0.1uF
16V
C211 1-128-995-21 ELECT
CHIP 100uF 20% 10V
C212 1-164-360-11 CERAMIC
CHIP 0.1uF
16V
C213 1-164-360-11 CERAMIC
CHIP 0.1uF
16V
C214 1-164-360-11 CERAMIC
CHIP 0.1uF
16V
C215 1-164-360-11 CERAMIC
CHIP 0.1uF
16V
C217 1-164-360-11 CERAMIC
CHIP 0.1uF
16V
C218 1-164-360-11 CERAMIC
CHIP 0.1uF
16V
C219 1-164-360-11 CERAMIC
CHIP 0.1uF
16V
C220 1-164-360-11 CERAMIC
CHIP 0.1uF
16V
C232 1-164-360-11 CERAMIC
CHIP 0.1uF
16V
C251 1-164-315-11 CERAMIC
CHIP 470PF 5% 50V
C252 1-162-967-11 CERAMIC
CHIP 0.0033uF 10% 50V
C253 1-164-315-11 CERAMIC
CHIP 470PF 5% 50V
C254 1-162-967-11 CERAMIC
CHIP 0.0033uF 10% 50V
C256 1-107-826-11 CERAMIC
CHIP 0.1uF
10% 16V
C257 1-107-826-11 CERAMIC
CHIP 0.1uF
10% 16V
C258 1-164-388-91 CERAMIC
CHIP 270PF 5% 50V
C259 1-162-927-11 CERAMIC
CHIP 100PF 5% 50V
C260 1-117-863-11 CERAMIC
CHIP 0.47uF 10% 6.3V
C261 1-162-970-11 CERAMIC
CHIP 0.01uF 10% 25V
C264 1-162-965-11 CERAMIC
CHIP 0.0015uF 10% 50V
C265 1-107-826-11 CERAMIC
CHIP 0.1uF
10% 16V
C267 1-162-910-11 CERAMIC
CHIP 5PF
0.25PF 50V
C268 1-162-910-11 CERAMIC
CHIP 5PF
0.25PF 50V
C269 1-124-778-00 ELECT
CHIP 22uF
20% 6.3V
C270 1-124-778-00 ELECT
CHIP 22uF
20% 6.3V
C271 1-107-826-11 CERAMIC
CHIP 0.1uF
10% 16V
C272 1-164-360-11 CERAMIC
CHIP 0.1uF
16V
C291 1-164-315-11 CERAMIC
CHIP 470PF 5% 50V
C292 1-164-315-11 CERAMIC
CHIP 470PF 5% 50V
C301 1-164-360-11 CERAMIC
CHIP 0.1uF
16V
C302 1-137-710-91 CERAMIC
CHIP 10uF
20% 6.3V
C303 1-137-710-91 CERAMIC
CHIP 10uF
20% 6.3V
C321 1-162-964-11 CERAMIC
CHIP 0.001uF 10% 50V
C322 1-115-156-11 CERAMIC
CHIP 1uF
10V
C323 1-128-995-21 ELECT
CHIP 100uF 20% 10V
C401 1-128-396-11 ELECT
CHIP 470uF 20% 10V
C403 1-164-360-11 CERAMIC
CHIP 0.1uF
16V
C404 1-164-360-11 CERAMIC
CHIP 0.1uF
16V
C405 1-164-360-11 CERAMIC
CHIP 0.1uF
16V
C421 1-107-826-11 CERAMIC
CHIP 0.1uF
10% 16V
C422 1-107-826-11 CERAMIC
CHIP 0.1uF
10% 16V
C423 1-162-927-11 CERAMIC
CHIP 100PF 5% 50V
C424 1-162-970-11 CERAMIC
CHIP 0.01uF 10% 25V
C425 1-162-968-11 CERAMIC
CHIP 0.0047uF 10% 50V
C428 1-107-826-11 CERAMIC
CHIP 0.1uF
10% 16V
C429 1-107-826-11 CERAMIC
CHIP 0.1uF
10% 16V
C430 1-107-826-11 CERAMIC
CHIP 0.1uF
10% 16V
C440 1-164-230-11 CERAMIC
CHIP 220PF 5% 50V
< CONNECTOR >
CN101
1-770-702-21 CONNECTOR, FFC/FPC 19P
CN301
1-770-425-51 CONNECTOR, FFC/FPC 16P
< DIODE >
D440
8-719-058-24 DIODE RB501V-40TE-17
D441
8-719-058-24 DIODE RB501V-40TE-17
< IC >
IC201
8-752-425-12 IC CXD3059AR
IC401
8-759-713-71 IC AN41050
<
TRANSISTOR
>
Q321 6-551-120-01 TRANSISTOR 2SA2119K
< RESISTOR/FERRITE BEAD >
R101 1-216-809-11 METAL
CHIP 100
5% 1/10W
R102 1-216-809-11 METAL
CHIP 100
5% 1/10W
R103 1-216-809-11 METAL
CHIP 100
5% 1/10W
R104 1-216-809-11 METAL
CHIP 100
5% 1/10W
R105 1-216-809-11 METAL
CHIP 100
5% 1/10W
R106 1-216-809-11 METAL
CHIP 100
5% 1/10W
R201
1-500-445-21 FERRITE, EMI (SMD) (2012)
R202
1-500-445-21 FERRITE, EMI (SMD) (2012)
R203 1-216-295-91 SHORT
CHIP 0
R206 1-216-864-11 SHORT
CHIP 0
Ref. No.
Part No.
Description
Remark
Ref. No.
Part No.
Description
Remark
CD
When indicating parts by reference num-
ber, please include the board name.
ber, please include the board name.
Note:
• Due to standardization, replacements in
• Due to standardization, replacements in
the parts list may be different from the
parts specifi ed in the diagrams or the com-
ponents used on the set.
parts specifi ed in the diagrams or the com-
ponents used on the set.
• -XX and -X mean standardized parts, so
they may have some difference from the
original one.
original one.
• Items marked “*” are not stocked since
they are seldom required for routine ser-
vice. Some delay should be anticipated
when ordering these items.
vice. Some delay should be anticipated
when ordering these items.
• CAPACITORS
uF:
uF:
μF
• COILS
uH:
uH:
μH
• RESISTORS
All resistors are in ohms.
METAL:
All resistors are in ohms.
METAL:
Metal-fi lm resistor.
METAL OXIDE: Metal oxide-fi lm resistor.
F:
F:
nonfl ammable
• SEMICONDUCTORS
In each case, u: μ, for example:
uA.
In each case, u: μ, for example:
uA.
. :
μA. . , uPA. . , μPA. . ,
uPB.
.
:
μPB. . , uPC. . , μPC. . ,
uPD.
.
:
μPD. .
The components identifi ed by mark 0
or dotted line with mark 0 are critical for
safety.
Replace only with part number specifi ed.
Replace only with part number specifi ed.
• Abbreviation
AUS :
AUS :
Australian
model
E51
: Chilean and Peruvian models
MX
: Mexican model
RU
: Russian model
SP
: Singapore model
TH :
Thai
model
TW :
Taiwan
model
Ver. 1.2
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