Read Sony HCD-DX90 / MHC-DX90 Service Manual online
2
HCD-DX90
This appliance is classified as a CLASS 1 LASER product. The
CLASS 1 LASER PRODUCT MARKING is located on the rear
exterior.
CLASS 1 LASER PRODUCT MARKING is located on the rear
exterior.
Laser component in this product is capable
of emitting radiation exceeding the limit for
Class 1.
of emitting radiation exceeding the limit for
Class 1.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radiation
exposure.
other than those specified herein may result in hazardous radiation
exposure.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of soldering iron around 270˚C
during repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK
0
OR DOTTED LINE WITH
MARK
0
ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS
LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE
COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS
APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS
PUBLISHED BY SONY.
COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS
APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS
PUBLISHED BY SONY.
TABLE OF CONTENTS
1. SERVICE NOTE
······························································· 3
2. GENERAL
·········································································· 4
3. DISASSEMBLY
3-1.
Disassembly Flow ······························································ 6
3-2.
Upper Case (Top) ······························································· 7
3-3.
Loading Panel Assy ···························································· 7
3-4.
Front Panel Section,
CD Mechanism Deck (CDM58-K2BD38) ························· 8
CD Mechanism Deck (CDM58-K2BD38) ························· 8
3-5.
Tape Mechanism Deck (TCM-230AWP11) ······················· 8
3-6.
Panel Board ········································································ 9
3-7.
Trans Board ········································································ 9
3-8.
MAIN Board, AMP Board ··············································· 10
3-9.
Leaf SW Board, Head (A) Board, Head (B) Board ·········· 10
3-10. Base Unit (BU-K2BD38) ················································· 11
3-11. Driver Board, Motor Board, Sensor Board ······················ 11
3-11. Driver Board, Motor Board, Sensor Board ······················ 11
4. TEST MODE
···································································· 12
5. MECHANICAL ADJUSTMENTS
····························· 16
6. ELECTRICAL ADJUSTMENTS
······························· 16
7. DIAGRAMS
7-1.
Circuit Boards Location ··················································· 21
7-2.
Block Diagrams ································································ 22
7-3.
Printed Wiring Board – BD Section – ······························ 24
7-4.
Schematic Diagram – BD Section – ································· 25
7-5.
Printed Wiring Board – Main Section – ··························· 26
7-6.
Schematic Diagram – Main (1/3) Section – ····················· 27
7-7.
Schematic Diagram – Main (2/3) Section – ····················· 28
7-8.
Schematic Diagram – Main (3/3) Section – ····················· 29
7-9.
Printed Wiring Board – Power AMP Section – ················ 30
7-10. Schematic Diagram – Power AMP Section – ··················· 31
7-11. Printed Wiring Board – Panel Section – ··························· 32
7-12. Schematic Diagram – Panel Section – ····························· 33
7-13. Printed Wiring Board – Leaf SW Section – ···················· 34
7-14. Schematic Diagram – Leaf SW Section – ························ 35
7-15. Printed Wiring Board – Driver Section – ························· 36
7-16. Schematic Diagram – Driver Section – ···························· 37
7-17. Printed Wiring Board – Trans Section – ··························· 38
7-18. Schematic Diagram – Trans Section – ····························· 39
7-19. IC Pin Function Description ············································· 40
7-20. IC Block Diagrams ··························································· 42
7-11. Printed Wiring Board – Panel Section – ··························· 32
7-12. Schematic Diagram – Panel Section – ····························· 33
7-13. Printed Wiring Board – Leaf SW Section – ···················· 34
7-14. Schematic Diagram – Leaf SW Section – ························ 35
7-15. Printed Wiring Board – Driver Section – ························· 36
7-16. Schematic Diagram – Driver Section – ···························· 37
7-17. Printed Wiring Board – Trans Section – ··························· 38
7-18. Schematic Diagram – Trans Section – ····························· 39
7-19. IC Pin Function Description ············································· 40
7-20. IC Block Diagrams ··························································· 42
8. EXPLODED VIEWS
8-1.
Main Section ····································································· 45
8-2.
Panel Section ···································································· 46
8-3.
Main Board Section ·························································· 47
8-4.
CD Mechanism Deck Section (CDM58-K2BD38) ·········· 48
8-5.
Base Unit Section (BU-K2BD38) ···································· 49
8-6.
Tape Mechanism Deck Section-1 (TCM-230PWR11) ····· 50
8-7.
Tape Mechanism Deck Section-2 (TCM-230PWR11) ····· 51
9. ELECTRICAL PARTS LIST
······································· 52
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