Read Sony HCD-DX150 / HCD-DX170 / HCD-DX250 (serv.man2) Service Manual online
12
HCD-DX150/DX170/DX250
ELECTRICAL PARTS LIST
NOTE:
•
•
Due to standardization, replacements in the
parts list may be different from the parts
specified in the diagrams or the components
used on the set.
parts list may be different from the parts
specified in the diagrams or the components
used on the set.
•
-XX and -X mean standardized parts, so they
may have some difference from the original
one.
may have some difference from the original
one.
•
Items marked “*” are not stocked since they
are seldom required for routine service.
Some delay should be anticipated when
ordering these items.
are seldom required for routine service.
Some delay should be anticipated when
ordering these items.
•
RESISTORS
All resistors are in ohms.
METAL: Metal-film resistor.
METAL OXIDE: Metal oxide-film resistor.
F: nonflammable
All resistors are in ohms.
METAL: Metal-film resistor.
METAL OXIDE: Metal oxide-film resistor.
F: nonflammable
•
CAPACITORS
uF:
uF:
µF
•
COILS
uH:
uH:
µH
•
SEMICONDUCTORS
In each case, u:
In each case, u:
µ, for example:
uA. . :
µA. .,
uPA. . :
µPA. .,
uPB. . :
µPB. .,
uPC. . :
µPC. .,
uPD. . :
µPD. .
•
Abbreviation
AUS : Australian model.
CND : Canadian model.
E32
AUS : Australian model.
CND : Canadian model.
E32
: 110-240 V AC Area in E model.
EA
: Saudi Arabia model.
MX
: Mexican model.
SP
: Singapore model.
Ref. No.
Part No.
Description
Remark
Ref. No.
Part No.
Description
Remark
The components identified by mark 0 or
dotted line with mark 0 are critical for safety.
Replace only with part number specified.
dotted line with mark 0 are critical for safety.
Replace only with part number specified.
Les composants identifiés par une marque 0
sont critiques pour la sécurité.
Ne les remplacer que par une pièce portant le
numéro spécifié.
sont critiques pour la sécurité.
Ne les remplacer que par une pièce portant le
numéro spécifié.
When indicating parts by reference number,
please include the board name.
please include the board name.
A-1121-311-A MAIN BOARD, COMPLETE (DX150: US, CND)
A-1121-454-A MAIN BOARD, COMPLETE (DX170)
A-1121-472-A MAIN BOARD, COMPLETE (DX250)
A-1123-575-A MAIN BOARD, COMPLETE (AUS)
A-1124-191-A MAIN BOARD, COMPLETE (MX)
A-1121-454-A MAIN BOARD, COMPLETE (DX170)
A-1121-472-A MAIN BOARD, COMPLETE (DX250)
A-1123-575-A MAIN BOARD, COMPLETE (AUS)
A-1124-191-A MAIN BOARD, COMPLETE (MX)
A-1124-223-A MAIN BOARD, COMPLETE (EA)
A-1124-238-A MAIN BOARD, COMPLETE (E32)
A-1124-247-A MAIN BOARD, COMPLETE (SP)
A-1124-238-A MAIN BOARD, COMPLETE (E32)
A-1124-247-A MAIN BOARD, COMPLETE (SP)
*********************************
1-533-313-11 HOLDER, FUSE
7-685-647-79 SCREW +BVTP 3X10 TYPE2 IT-3
7-685-647-79 SCREW +BVTP 3X10 TYPE2 IT-3
< CAPACITOR >
C101
1-164-346-11 CERAMIC CHIP
1uF
16V
C102
1-164-346-11 CERAMIC CHIP
1uF
16V
C103
1-164-346-11 CERAMIC CHIP
1uF
16V
C104
1-164-346-11 CERAMIC CHIP
1uF
16V
C105
1-164-346-11 CERAMIC CHIP
1uF
16V
C106
1-164-346-11 CERAMIC CHIP
1uF
16V
C107
1-164-346-11 CERAMIC CHIP
1uF
16V
(DX170/DX250)
C108
1-100-566-91 CERAMIC CHIP
0.1uF
10%
25V
C109
1-100-566-91 CERAMIC CHIP
0.1uF
10%
25V
C111
1-164-346-11 CERAMIC CHIP
1uF
16V
C112
1-164-346-11 CERAMIC CHIP
1uF
16V
C113
1-164-346-11 CERAMIC CHIP
1uF
16V
C114
1-164-346-11 CERAMIC CHIP
1uF
16V
C115
1-164-346-11 CERAMIC CHIP
1uF
16V
C116
1-164-346-11 CERAMIC CHIP
1uF
16V
C117
1-164-346-11 CERAMIC CHIP
1uF
16V
(DX170/DX250)
C119
1-162-927-11 CERAMIC CHIP
100PF
5%
50V
C120
1-126-947-11 ELECT
47uF
20%
10V
C131
1-164-156-11 CERAMIC CHIP
0.1uF
25V
C132
1-164-156-11 CERAMIC CHIP
0.1uF
25V
C133
1-164-156-11 CERAMIC CHIP
0.1uF
25V
C134
1-164-156-11 CERAMIC CHIP
0.1uF
25V
C135
1-164-156-11 CERAMIC CHIP
0.1uF
25V
C136
1-164-156-11 CERAMIC CHIP
0.1uF
25V
C137
1-164-156-11 CERAMIC CHIP
0.1uF
25V
(DX170/DX250)
C141
1-164-156-11 CERAMIC CHIP
0.1uF
25V
C142
1-164-156-11 CERAMIC CHIP
0.1uF
25V
C143
1-164-156-11 CERAMIC CHIP
0.1uF
25V
C144
1-164-156-11 CERAMIC CHIP
0.1uF
25V
C145
1-164-156-11 CERAMIC CHIP
0.1uF
25V
C146
1-164-156-11 CERAMIC CHIP
0.1uF
25V
C147
1-164-156-11 CERAMIC CHIP
0.1uF
25V
(DX170/DX250)
C151
1-115-185-11 CERAMIC CHIP
0.033uF
10%
50V
C152
1-115-185-11 CERAMIC CHIP
0.033uF
10%
50V
C153
1-115-185-11 CERAMIC CHIP
0.033uF
10%
50V
C154
1-115-185-11 CERAMIC CHIP
0.033uF
10%
50V
C155
1-115-185-11 CERAMIC CHIP
0.033uF
10%
50V
C156
1-115-185-11 CERAMIC CHIP
0.033uF
10%
50V
C157
1-115-185-11 CERAMIC CHIP
0.033uF
10%
50V
(DX170/DX250)
C161
1-125-898-91 CERAMIC CHIP
0.22uF
10%
50V
C162
1-125-898-91 CERAMIC CHIP
0.22uF
10%
50V
C163
1-125-898-91 CERAMIC CHIP
0.22uF
10%
50V
C164
1-125-898-91 CERAMIC CHIP
0.22uF
10%
50V
C165
1-125-898-91 CERAMIC CHIP
0.22uF
10%
50V
C166
1-125-898-91 CERAMIC CHIP
0.22uF
10%
50V
C167
1-125-898-91 CERAMIC CHIP
0.22uF
10%
50V
(DX170/DX250)
C171
1-125-898-91 CERAMIC CHIP
0.22uF
10%
50V
C172
1-125-898-91 CERAMIC CHIP
0.22uF
10%
50V
C173
1-125-898-91 CERAMIC CHIP
0.22uF
10%
50V
C174
1-125-898-91 CERAMIC CHIP
0.22uF
10%
50V
C175
1-125-898-91 CERAMIC CHIP
0.22uF
10%
50V
C176
1-125-898-91 CERAMIC CHIP
0.22uF
10%
50V
C177
1-125-898-91 CERAMIC CHIP
0.22uF
10%
50V
(DX170/DX250)
C181
1-115-185-11 CERAMIC CHIP
0.033uF
10%
50V
C182
1-115-185-11 CERAMIC CHIP
0.033uF
10%
50V
C183
1-115-185-11 CERAMIC CHIP
0.033uF
10%
50V
C184
1-115-185-11 CERAMIC CHIP
0.033uF
10%
50V
C185
1-115-185-11 CERAMIC CHIP
0.033uF
10%
50V
C186
1-115-185-11 CERAMIC CHIP
0.033uF
10%
50V
C187
1-115-185-11 CERAMIC CHIP
0.033uF
10%
50V
(DX170/DX250)
C188
1-164-156-11 CERAMIC CHIP
0.1uF
25V
C189
1-164-156-11 CERAMIC CHIP
0.1uF
25V
C190
1-164-156-11 CERAMIC CHIP
0.1uF
25V
C191
1-107-898-11 ELECT
2200uF
20%
35V
C192
1-107-898-11 ELECT
2200uF
20%
35V
C193
1-107-898-11 ELECT
2200uF
20%
35V
C194
1-107-898-11 ELECT
2200uF
20%
35V
C195
1-107-898-11 ELECT
2200uF
20%
35V
MAIN
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