Read Sony HCD-DP900D / MHC-DP900D Service Manual online
HCD-DP900D
E Model
MINI HI-FI COMPONENT SYSTEM
— Continued on next page —
SPECIFICATIONS
• HCD-DP900D is the tuner, deck,
DVD and amplifier section in MHC-
DP900D.
DP900D.
Ver 1.5 2004.09
9-873-312-06
2004I02-1
© 2004.09
Sony Corporation
Audio Group
Published by Sony Engineering Corporation
Model Name Using Similar Mechanism
NEW
DVD
DVD Mechanism Type
CDM58D-DVBU9
Section
Base Unit Name
DVBU9
Optical Pick-up Name
KHM-240AAA/CLNP
Tape deck
Model Name Using Similar Mechanism
HCD-DP800AV
Section
Tape Transport Mechanism Type
TCM-230AWR41/MWR41
SERVICE MANUAL
Amplifier section
The following measured at AC 120, 220, 240 V,
50/60 Hz
DIN power output (rated) 130 + 130 watts
50/60 Hz
DIN power output (rated) 130 + 130 watts
(6 ohms at 1 kHz, DIN)
Continuous RMS power output (reference)
180 + 180 watts
(6 ohms at 1 kHz, 10% THD)
(6 ohms at 1 kHz, 10% THD)
Inputs
GAME IN:
GAME IN:
voltage 250 mV,
(phono jacks)
impedance 47 kilohms
MD (VIDEO) IN:
voltage 450 mV/250 mV,
(phono jacks)
impedance 47 kilohms
OPTICAL IN:
(Square optical connector jacks, front panel)
wavelength
(Square optical connector jacks, front panel)
wavelength
——
MIC:
sensitivity 1 mV,
(Except for North
impedance 10 kilohms
American and
European models)
(phone jack)
European models)
(phone jack)
Outputs
MD (VIDEO) OUT:
MD (VIDEO) OUT:
voltage 250 mV
(phono jacks)
impedance 1 kilohms
VIDEO OUT:
max. output level
(phono jack)
1 Vp-p, unbalanced, Sync
negative, load impedance
75 ohms
negative, load impedance
75 ohms
S-VIDEO OUT: Y:
1 Vp-p, unbalanced,
(4-pin/mini-DIN jack)
Sync negative,
C: 0.286Vp-p,
load impedance 75 ohms
C: 0.286Vp-p,
load impedance 75 ohms
PHONES:
accepts headphones of
(stereo mini jack)
8 ohms or more
SPEAKER:
accepts impedance of 6 to
16 ohms
16 ohms
SUB WOOFER:
Voltage 1 V,
impedance 1 kilohms
impedance 1 kilohms
2
HCD-DP900D
This appliance is classified as a CLASS 1 LASER product. The
CLASS 1 LASER PRODUCT MARKING is located on the rear
exterior.
CLASS 1 LASER PRODUCT MARKING is located on the rear
exterior.
Laser component in this product is capable
of emitting radiation exceeding the limit for
Class 1.
of emitting radiation exceeding the limit for
Class 1.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radiation
exposure.
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radiation
exposure.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of soldering iron around 270˚C
• Keep the temperature of soldering iron around 270˚C
during repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH
MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS
LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE
COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS
APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS
PUBLISHED BY SONY.
MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS
LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE
COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS
APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS
PUBLISHED BY SONY.
DVD player section
Laser
Semiconductor laser
(DVD:
(DVD:
λ =650 nm,
CD:
λ =780 nm)
Emission duration:
continuous
continuous
Frequency response
DVD (PCM 48 kHz):
2 Hz – 22 kHz = (
2 Hz – 22 kHz = (
±1 dB)
CD: 2Hz – 20 kHz =
(
(
±1 dB)
Signal-to-noise ratio
More than 90 dB
Dynamic range
More than 90 dB
Video color system format
NTSC, PAL
DIGITAL OUT OPTICAL
(Square optical connector jack, rear panel)
Wavelength
(Square optical connector jack, rear panel)
Wavelength
660 nm
Tape player section
Recording system
4-track 2-channel stereo
Frequency response
40 – 13,000 Hz (
±3 dB),
(DOLBY NR OFF)
using Sony TYPE I
cassette,
40 – 14,000 Hz (
cassette,
40 – 14,000 Hz (
±3 dB),
using Sony TYPE II
cassette
cassette
Tuner section
FM stereo, FM/AM superheterodyne tuner
FM tuner section
Tuning range
87.5 – 108.0 MHz
Antenna
FM lead antenna
Antenna terminals
75 ohm unbalanced
Intermediate frequency
10.7 MHz
AM tuner section
Tuning range
531 – 1,602 kHz
(with the interval set at 9 kHz)
530 – 1,710 kHz
(with the interval set at 10 kHz)
(with the interval set at 9 kHz)
530 – 1,710 kHz
(with the interval set at 10 kHz)
Antenna
AM loop antenna
Antenna terminals
External antenna terminal
Intermediate frequency
450 kHz
General
Power requirements
Mexican model:
Mexican model:
120 V AC, 60 Hz
Thailand model:
220 V AC, 50/60 Hz
Other models:
120 V, 220 V or
230 – 240 V AC,
50/60 Hz
Adjustable with voltage
selector
230 – 240 V AC,
50/60 Hz
Adjustable with voltage
selector
Power consumption
210watts
Dimensions (w/h/d)
Approx. 280 x 360 x 365mm
Mass
Approx. 12.5 kg
Supplied accessories:
AM loop antenna (1)
FM lead antenna (1)
Remote commander (1)
Batteries (2)
Video cable (1)
Front speaker pads (8)
FM lead antenna (1)
Remote commander (1)
Batteries (2)
Video cable (1)
Front speaker pads (8)
Design and specifications are subject to change without notice.
3
HCD-DP900D
MODEL IDENTIFICATION
— BACK PANEL —
• Abbreviation
SP
: Singapore model
MY
: Malaysia model
TH
: Thai model
MX
: Mexican model
PARTS No.
MODEL
E model
MX model
SP, MY model
TH model
PARTS No.
4-236-825-0
s
4-236-825-1
s
4-236-825-2
s
4-236-825-3
s
TABLE OF CONTENTS
1. GENERAL
·········································································· 5
2. DISASSEMBY
··································································· 6
3. TEST MODE
···································································· 13
4. MECHANICAL ADJUSTMENTS
····························· 16
5. ELECTRICAL ADJUSTMENTS
······························· 17
6. DIAGRAMS
6-1. Circuit Board Location ················································· 21
6-2. Block Diagrams ···························································· 23
6-3. Printed Wiring Board RF-240 Section ······················ 26
6-4. Schematic Diagram RF-240 Section ························ 27
6-5. Printed Wiring Board MB Section ···························· 28
6-6. Schematic Diagram MB Section (1/5) ······················ 30
6-7. Schematic Diagram MB Section (2/5) ······················ 31
6-8. Schematic Diagram MB Section (3/5) ······················ 32
6-9. Schematic Diagram MB Section (4/5) ······················ 33
6-10.Schematic Diagram MB Section (5/5) ····················· 34
6-11. Schematic Diagram Driver Section ························ 35
6-12. Printed Wiring Board Driver Section ······················ 35
6-13.Printed Wiring Board Main Section ························· 36
6-14.Schematic Diagram Main Section (1/3) ··················· 37
6-15.Schematic Diagram Main Section (2/3) ··················· 38
6-16.Schematic Diagram Main Section (3/3) ··················· 39
6-17.Printed Wiring Board DSP Section ·························· 40
6-18. Schematic Diagram DSP Section (1/2) ··················· 41
6-19. Schematic Diagram DSP Section (2/2) ··················· 42
6-20. Printed Wiring Board OPT/VIDEO Section ··········· 43
6-21. Schematic Diagram OPT/VIDEO Section ·············· 43
6-22. Printed Wiring Board Front Amp Section ··············· 44
6-23. Schematic Diagram Front Amp Section ················· 45
6-24. Schematic Diagram Surround Amp Section ··········· 46
6-25. Printed Wiring Board Surround Amp Section ········ 47
6-26. Printed Wiring Board Panel Section ······················· 48
6-27. Schematic Diagram Panel Section (1/2) ················· 49
6-28. Schematic Diagram Panel Section (2/2) ················· 50
6-29. Printed Wiring Board Leaf SW Section ·················· 51
6-30. Schematic Diagram Leaf SW Section ····················· 51
6-31. Printed Wiring Board Trans Section ······················· 52
6-32. Schematic Diagram Trans Section ·························· 53
6-33. IC Pin Function Description ······································· 54
6-34. IC Block Diagrams ····················································· 61
6-2. Block Diagrams ···························································· 23
6-3. Printed Wiring Board RF-240 Section ······················ 26
6-4. Schematic Diagram RF-240 Section ························ 27
6-5. Printed Wiring Board MB Section ···························· 28
6-6. Schematic Diagram MB Section (1/5) ······················ 30
6-7. Schematic Diagram MB Section (2/5) ······················ 31
6-8. Schematic Diagram MB Section (3/5) ······················ 32
6-9. Schematic Diagram MB Section (4/5) ······················ 33
6-10.Schematic Diagram MB Section (5/5) ····················· 34
6-11. Schematic Diagram Driver Section ························ 35
6-12. Printed Wiring Board Driver Section ······················ 35
6-13.Printed Wiring Board Main Section ························· 36
6-14.Schematic Diagram Main Section (1/3) ··················· 37
6-15.Schematic Diagram Main Section (2/3) ··················· 38
6-16.Schematic Diagram Main Section (3/3) ··················· 39
6-17.Printed Wiring Board DSP Section ·························· 40
6-18. Schematic Diagram DSP Section (1/2) ··················· 41
6-19. Schematic Diagram DSP Section (2/2) ··················· 42
6-20. Printed Wiring Board OPT/VIDEO Section ··········· 43
6-21. Schematic Diagram OPT/VIDEO Section ·············· 43
6-22. Printed Wiring Board Front Amp Section ··············· 44
6-23. Schematic Diagram Front Amp Section ················· 45
6-24. Schematic Diagram Surround Amp Section ··········· 46
6-25. Printed Wiring Board Surround Amp Section ········ 47
6-26. Printed Wiring Board Panel Section ······················· 48
6-27. Schematic Diagram Panel Section (1/2) ················· 49
6-28. Schematic Diagram Panel Section (2/2) ················· 50
6-29. Printed Wiring Board Leaf SW Section ·················· 51
6-30. Schematic Diagram Leaf SW Section ····················· 51
6-31. Printed Wiring Board Trans Section ······················· 52
6-32. Schematic Diagram Trans Section ·························· 53
6-33. IC Pin Function Description ······································· 54
6-34. IC Block Diagrams ····················································· 61
7. EXPLODED VIEWS
7-1. Main Section ································································· 65
7-2. Front Panel Section ······················································· 66
7-3. Chassis Section ····························································· 67
7-4. Tape Mechanism Deck Section-1 (TCM-230MWR41) 68
7-5. Tape Mechanism Deck Section-2 (TCM-230AWR41) 69
7-6. DVD Mechanism Deck Section (CDM58D-DVBU9) · 70
7-2. Front Panel Section ······················································· 66
7-3. Chassis Section ····························································· 67
7-4. Tape Mechanism Deck Section-1 (TCM-230MWR41) 68
7-5. Tape Mechanism Deck Section-2 (TCM-230AWR41) 69
7-6. DVD Mechanism Deck Section (CDM58D-DVBU9) · 70
8. ELECTRICAL PARTS LIST
······································· 71
Self-diagnosis function
(When letters/numbers appear in the display)
When the self-diagnosis function is activated to prevent the system from
malfunctioning, a five-character service number (e.g., C 13 00) with a
combination of a letter and digits appears on the screen. In this case,
check the following table.
malfunctioning, a five-character service number (e.g., C 13 00) with a
combination of a letter and digits appears on the screen. In this case,
check the following table.
First three
characters of
the service
number
characters of
the service
number
C 13
C 31
E XX
(XX is a number)
(XX is a number)
C:13:00
Cause and/or Corrective
Action
Action
The disc is dirty
,Clean the disc with a soft
cloth (page 54).
,Clean the disc with a soft
cloth (page 54).
The disc is not inserted correctly.
,Re-insert the disc correctly.
To prevent a malfunction, the
system has performed the self-diagnosis
function.
,Contact your nearest Sony
dealer or local authorized
Sony service facility and give
the 5-character service
number.
Example: E 61 10
,Re-insert the disc correctly.
To prevent a malfunction, the
system has performed the self-diagnosis
function.
,Contact your nearest Sony
dealer or local authorized
Sony service facility and give
the 5-character service
number.
Example: E 61 10
Ver 1.2 2002.07
4
HCD-DP900D
Ver 1.5
SERVICE POSITION
Jig (J-2501-155-A)
to RF240 board : CN004
to RF240 board : CN004
Jig (J-2501-199-A)
to RF240 board : CN002
to RF240 board : CN002
MB board
CHANGE OF OPTICAL PICK-UP
Optical Pick-up has been replaced from KHM-240AAA (TYPE A) to KHM-270AAA (TYPE B) from the middle of production.
In parallel with that, certain parts of MB board have been changed.
Optical Pick-up has been replaced from KHM-240AAA (TYPE A) to KHM-270AAA (TYPE B) from the middle of production.
In parallel with that, certain parts of MB board have been changed.
TYPE A/B DISCRIMINATION
SILVER: KHM-240AAA (TYPE A)
BLACK: KHM-270AAA (TYPE B)
BLACK: KHM-270AAA (TYPE B)
optical device
PARTS LIST OF EACH MODEL
MB BOARD
REF
TYPE A
TYPE B
KHM-240AAA
KHM-270AAA
R076
1-216-837-11 METAL CHIP
22K
5%
1/10W
No Mount
R077
1-216-815-11 METAL CHIP
330
5%
1/10W
1-216-833-11 METAL CHIP
10K
5%
1/10W
R079
1-216-801-11 METAL CHIP
22
5%
1/10W
1-216-845-11 METAL CHIP
100K
5%
1/10W
NOTES ON MB BOARD EXCHANGE
If a MB board is exchanged, “DRIVE AUTO ADJUSTMENT’’ may
be unable to be performed. In this case, initialize a memory in the
following procedure.
1.
be unable to be performed. In this case, initialize a memory in the
following procedure.
1.
Starting Test Mode (See Supplement-1 page2).
2.
Press the 2 button of remote commander to set the Drive
Manual Operation (See Supplement-1 page 8).
Manual Operation (See Supplement-1 page 8).
3.
Press the 6 button of remote commander to set the Memory
Check (See Supplement-1 page 10).
Check (See Supplement-1 page 10).
4.
Press the [CLEAR] button of remote commander to initialize a
memory.
memory.
• DISC TRAY LOCK
The disc tray lock function for the antitheft of an demonstration
disc in the store is equipped.
disc in the store is equipped.
Releasing Procedure :
1.
1.
Press three buttons of PLAY MODE , x and m
simultaneously.
simultaneously.
2.
The message “UNLOCKED” is displayed and the tray is
unlocked.
unlocked.
Note : When “LOCKED” is displayed, the tray lock is not released
by turning power on/off with the POWER button.