HCD-DP800AV, MHC-DP800AV - Sony Audio Service Manual (repair manual). Page 3

3

This appliance is classified as a CLASS 1 LASER product. The
CLASS 1 LASER PRODUCT MARKING is located on the rear
exterior.

Laser component in this product is capable
of emitting radiation exceeding the limit for
Class 1.

CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radiation
exposure.

Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be

damaged by heat.

Flexible Circuit Board Repairing
• Keep the temperature of soldering iron around 270˚C

during repairing.

• Do not touch the soldering iron on the same conductor of the

circuit board (within 3 times).

• Be careful not to apply force on the conductor when soldering

or unsoldering.

— BACK PANEL —

• Abbreviation

CND : Canadian model
MX

: Mexican model

KR

: Korea model

AR

: Argentine model

AUS

: Australian model

PARTS No.

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6-1. Circuit Board Location ················································· 23
6-2. Block Diagrams ···························································· 24
6-3. Schematic Diagram     BD Section ······························· 26
6-4. Printed Wiring Board     BD Section ···························· 27
6-5. Printed Wiring Board     Main Section ························· 28
6-6. Schematic Diagram     Main Section (1/3) ··················· 29
6-7. Schematic Diagram     Main Section (2/3) ··················· 30
6-8. Schematic Diagram     Main Section (3/3) ··················· 31
6-9. Printed Wiring Board     DSP Section ·························· 32
6-10. Schematic Diagram     DSP Section (1/2) ··················· 33
6-11. Schematic Diagram     DSP Section (2/2) ··················· 34
6-12. Printed Wiring Board     OPT Section ························ 35
6-13. Schematic Diagram     OPT Section ··························· 35
6-14. Printed Wiring Board     Front Amp Section ··············· 36
6-15. Schematic Diagram     Front Amp Section ················· 37
6-16. Schematic Diagram     Surround Amp Section ··········· 38
6-17. Printed Wiring Board     Surround Amp Section ········ 39
6-18. Printed Wiring Board     Panel Section ······················· 40
6-19. Schematic Diagram     Panel Section (1/2) ················· 41
6-20. Schematic Diagram     Panel Section (2/2) ················· 42
6-21. Printed Wiring Board     Leaf SW Section ·················· 43
6-22. Schematic Diagram     Leaf SW Section ····················· 43
6-23. Printed Wiring Board     Driver Section ······················ 44
6-24. Schematic Diagram     Driver Section ························ 44
6-25. Printed Wiring Board     Trans Section ······················· 45
6-26. Schematic Diagram     Trans Section ·························· 46
6-27. IC Pin Function Description ······································· 47
6-28. IC Block Diagrams ····················································· 54

7-1. Main Section ································································· 58
7-2. Front Panel Section ······················································· 59
7-3. Chassis Section ····························································· 60
7-4. Tape Mechanism Deck Section-1 (TCM-230MWR41) 61
7-5. Tape Mechanism Deck Section-2 (TCM-230AWR41) 62
7-6. CD Mechanism Deck Section (CDM58E-30BD60) ···· 63
7-7. Base Unit Section (BU-30BD60) ································· 64

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AEP model

CND model

AUS model

KR model

MX model

AR model

4-231-894-0s

4-231-894-1s

4-231-894-2s

4-231-894-3s

4-231-894-4s

4-231-894-5s