HCD-BX77DBI - Sony Audio Service Manual (repair manual). Page 2

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HCD-BX77DBi
2
1. 
SERVICING  NOTES
 ..............................................   3
2. DISASSEMBLY
2-1. Disassembly 
Flow 
...........................................................   4
2-2.  Panel (Side L/R) ..............................................................   5
2-3.  Top Panel Block ..............................................................   5
2-4.  TOP KEY Board, IP Board, Panel Top (IP) ....................   6
2-5.  Front Panel Block ...........................................................   6
2-6.  Rear Panel Block ............................................................   7
2-7. Panel 
(Rear) 
....................................................................   7
2-8.  AMP Board Block ...........................................................   8
2-9.  POWER Board Block .....................................................   8
2-10. MAIN Board ...................................................................   9
2-11.  DAB Board, Module (DAB Tuner) ................................   9
2-12.  Loading Mechanism Block .............................................   10
2-13. Base Unit .........................................................................   10
2-14. Belt ..................................................................................   11
2-15.  Optical Pick-Up Block (KSM-213DCP) ........................   11
3. 
TEST  MODE 
 ............................................................   12
4. 
ELECTRICAL  CHECKS 
 ......................................   14
5. DIAGRAMS
5-1.  Block Diagram - CD SERVO Section - ..........................   15
5-2.  Block Diagram - iPod, TUNER, DAB Section - ............   16
5-3.  Block Diagram - MAIN Section - ...................................   17
5-4. Block 
Diagram 
- PANEL, POWER SUPPLY Section - ...........................   18
5-5.  Printed Wiring Boards - CD Section - ............................   20
5-6.  Schematic Diagram - CD Board - ...................................   21
5-7.  Printed Wiring Board - DAB Board - .............................   22
5-8.  Schematic Diagram - DAB Board - ................................   23
5-9.  Printed Wiring Board - IP Board - ..................................   24
5-10.  Schematic Diagram - IP Board - .....................................   25
5-11.  Printed Wiring Boards - MAIN Section - .......................   26
5-12.  Schematic Diagram - MAIN Section (1/3) - ...................   27
5-13.  Schematic Diagram - MAIN Section (2/3) - ...................   28
5-14.  Schematic Diagram - MAIN Section (3/3) - ...................   29
5-15. Printed Wiring Boards 
- AMP, HEADPHONE Section - ....................................   30
5-16.  Schematic Diagram - AMP, HEADPHONE Section - ....   31
5-17.  Printed Wiring Boards - PANEL Section - .....................   32
5-18.  Schematic Diagram - PANEL Section - ..........................   33
5-19.  Printed Wiring Board - POWER Board - ........................   34
5-20.  Schematic Diagram - POWER Board - ..........................   35
6. 
EXPLODED  VIEWS
6-1. Panel 
Section 
...................................................................  43
6-2.  Top Panel Section ...........................................................   44
6-3.  Front Panel Section .........................................................   45
6-4.  MAIN Board Section ......................................................   46
6-5.  POWER Board Section ...................................................   47
6-6.  Loading Mechanism Section ..........................................   48
6-7.  Base Unit Section (BU-K6BD90-WOD) ........................   49
7. 
ELECTRICAL  PARTS  LIST
  ..............................   50
Accessories are given in the last of the electrical parts list.
TABLE  OF  CONTENTS
NOTES  ON  CHIP  COMPONENT  REPLACEMENT
•  Never reuse a disconnected chip component.
•  Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
FLEXIBLE  CIRCUIT  BOARD  REPAIRING
•  Keep the temperature of soldering iron around 270 °C during 
repairing.
•  Do not touch the soldering iron on the same conductor of the 
circuit board (within 3 times).
•  Be careful not to apply force on the conductor when soldering 
or unsoldering.
SAFETY-RELATED  COMPONENT  WARNING!
COMPONENTS  IDENTIFIED  BY  MARK  
0  OR  DOTTED  LINE  
WITH  MARK  
0  ON  THE  SCHEMATIC  DIAGRAMS  AND  IN  
THE  PARTS  LIST  ARE  CRITICAL  TO  SAFE  OPERATION.
REPLACE  THESE  COMPONENTS  WITH  SONY  PARTS 
 
WHOSE  PART  NUMBERS  APPEAR  AS  SHOWN  IN  THIS  
MANUAL  OR  IN  SUPPLEMENTS  PUBLISHED  BY  SONY.
This appliance is classified 
as a CLASS 1 LASER 
product. This marking 
is located on the rear 
exterior.
iPod section
Compatible iPod models:
iPod touch
iPod nano 3rd 
generation 
(video)
iPod classic
iPod nano 2nd 
generation 
(aluminum)
iPod 5th 
generation 
(video)
iPod nano 1st 
generation
iPod 4th 
generation 
(color display)
iPod 4th 
generation
iPod mini
General
Power requirements: 230 V AC, 50/60 Hz
Power consumption: 63 watts
Dimensions (w/h/d) (excl. speakers): Approx. 215 mm × 140 mm × 298 mm
Mass (excl. speakers): Approx. 3.9 kg
Design and specifications are subject to change without notice.
CAUTION
Use of controls or adjustments or performance of procedures 
other than those specifi ed herein may result in hazardous radia-
tion exposure.
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