HCD-BX20I, HCD-BX50BTI - Sony Audio Service Manual (repair manual)

hcd-bx20i, hcd-bx50bti service manual
Model
HCD-BX20I HCD-BX50BTI
Pages
70
Size
4.94 MB
Type
PDF
Document
Service Manual
Brand
Device
Audio
File
hcd-bx20i-hcd-bx50bti.pdf
Date

Read Sony HCD-BX20I / HCD-BX50BTI Service Manual online

SERVICE MANUAL
Sony Corporation
Published by Sony Techno Create Corporation
HCD-BX20i/BX50BTi
SPECIFICATIONS
COMPACT DISC RECEIVER
9-889-020-06
2013B33-1
© 
2013.02
US Model
Canadian Model
HCD-BX20i/BX50BTi
AEP Model
Australian Model
Singapore Model
HCD-BX20i
Ver. 1.5  2013.02
Model Name Using Similar Mechanism
HCD-BX5BT/EC68
Base Unit Name
BU-K6BD90-WOD
Optical Pick-up Block Name
KSM-213DCP
•  HCD-BX20i is the amplifi er, CD player, tuner and 
iPod section in CMT-BX20i.
•  HCD-BX50BTi is the amplifi er, bluetooth, CD player, 
tuner and iPod section in CMT-BX50BTi.
Photo: HCD-BX20i
– Continued on next page –
• The Bluetooth word mark and logos are owned by the Bluetooth SIG, Inc. 
and any use of such marks by Sony Corporation is under license. Other 
trademarks and trade names are those of their respective owners.
• MPEG Layer-3 audio coding technology and patents licensed from 
Fraunhofer IIS and Thomson.
• iPod is a trademark of Apple Inc., registered in the U.S. and other countries.
Mainunit
AUDIO POWER SPECIFICATIONS
POWER OUTPUT AND TOTAL HARMONIC DISTORTION:
(The United States model only)
With 6 ohm loads, both channels driven, from 120 – 
10,000Hz; rated 25 watts 
per channel minimum RMS power, with no more than 10% total harmonic 
distortion from 250 milliwatts to rated output.
DIN power output (rated): 
18 + 18 W (6 ohms at 1 kHz, DIN) 
Continuous RMS power output (reference): 25 + 25 W (6 ohms at 1 kHz, 
10% THD)
Inputs
Inputs
Amplifier section (BX20i: US, Canadian, Australian and Singapore models)
Amplifier section (BX50BTi)
AUDIO IN (stereo mini jack): voltage 250 mV, impedance 47 kilohms
Outputs
Outputs
Bluetooth section (BX50BTi)
PHONES (stereo mini jack): accepts headphones of 8 ohms or more
SPEAKER: accepts impedance of 6 to 16 ohms
CD player section
System: Compact disc and digital audio system
Laser Diode Properties
Emission Duration: Continuous
Laser Output*: Less than 44.6μW
* This output is the value measurement at a distance of 200mm from the 
objective lens surface on the Optical Pick-up Block with 7mm aperture.
Frequency response: 20 Hz – 20 kHz
Signal-to-noise ratio: More than 90 dB
Dynamic range: More than 90 dB
Continuous RMS power output (reference): 25 + 25 watts (6 ohms at 
1 kHz, 10% THD)
AUDIO IN (stereo mini jack): voltage250mV, impedance 47 kilohms
PHONES (stereo mini jack): accepts headphones of 8 ohms or more
SPEAKER: accepts impedance of 6 ohms
Communication system: Bluetooth Standard version 2.0
Output: Bluetooth Standard Power Class 2
Maximum communication range: Line of sight approx. 10 m
1)
Frequency band: 2.4 GHz band (2.4000 GHz – 2.4835GHz)
Modulation method: FHSS
Compatible Bluetooth profiles 
2)
:
A2DP (Advanced Audio Distribution Profile)
AVRCP (Audio Video Remote Control Profile)
1)
The actual range will vary depending on factors such as obstacles 
between devices, magnetic filds around a microwave oven, static 
electricity, reception sensitivity, antenna’s performance, operating 
system, software application, etc.
2)
Bluetooth standard profiles indicate the purpose of Bluetooth 
communication between devices.
Supported codecs:
Receive: SBC (Sub Band Codec), MP3
Transmit: SBC (Sub Band Codec)
Amplifier section (BX20i: AEP model)
DIN power output (rated): 
18 + 18 W (6 ohms at 1 kHz, DIN) 
Continuous RMS power output (reference): 25 + 25 W (6 ohms at 1 kHz, 
10% THD)
Music power output (reference): 38 + 38 W (6 ohms at 1 kHz, 10% THD)
Inputs
AUDIO IN (stereo mini jack): voltage 250 mV, impedance 47 kilohms
Outputs
PHONES (stereo mini jack): accepts headphones of 8 ohms or more
SPEAKER: accepts impedance of 6 to 16 ohms
HCD-BX20i/BX50BTi
2
Notes on chip component replacement
• 
Never reuse a disconnected chip component.
• 
Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
Flexible Circuit Board Repairing
• 
Keep the temperature of soldering iron around 270 °C during 
repairing.
• 
Do not touch the soldering iron on the same conductor of the 
circuit board (within 3 times).
• 
Be careful not to apply force on the conductor when soldering 
or unsoldering.
SAFETY-RELATED COMPONENT WARNING!
COMPONENTS  IDENTIFIED  BY  MARK 
0 OR  DOTTED  LINE  
WITH  MARK 
0 ON  THE  SCHEMATIC  DIAGRAMS  AND  IN  
THE  PARTS  LIST  ARE  CRITICAL  TO  SAFE  OPERATION.
REPLACE  THESE  COMPONENTS  WITH  SONY  PARTS 
 
WHOSE  PART  NUMBERS  APPEAR  AS  SHOWN  IN  THIS  
MANUAL  OR  IN  SUPPLEMENTS  PUBLISHED  BY  SONY.
ATTENTION  AU  COMPOSANT  AYANT  RAPPORT  
À  LA  SÉCURITÉ!
LES  COMPOSANTS  IDENTIFIÉS  PAR  UNE  MARQUE  
0  SUR  
LES  DIAGRAMMES  SCHÉMATIQUES  ET  LA  LISTE  DES  
PIÈCES  SONT  CRITIQUES  POUR  LA  SÉCURITÉ  DE  FONC-
TIONNEMENT.  NE  REMPLACER  CES  COMPOSANTS  QUE  
PAR  DES  PIÈCES  SONY  DONT  LES  NUMÉROS  SONT  DON-
NÉS  DANS  CE  MANUEL  OU  DANS  LES  SUPPLÉMENTS  
PUBLIÉS  PAR  SONY.
CAUTION
Use of controls or adjustments or performance of procedures other than 
those specifi ed herein may result in hazardous radiation exposure.
This appliance is classifi ed as a 
CLASS 1 LASER product.
This marking is located on the 
rear or bottom exterior.
Ver. 1.4
iPod section
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Tunersection
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FM tuner section:
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Tuning range: 531   1,602 kHz (with 9 kHz tuning interval)
HCD-BX20i/BX50BTi
3
1. 
SERVICING  NOTES
  .............................................   4
2. GENERAL
  ..................................................................   6
3. DISASSEMBLY
3-1. Disassembly 
Flow 
...........................................................  10
3-2.  Panel (Side L/R) ..............................................................   11
3-3.  Top Panel Block ..............................................................   11
3-4.  TOP KEY Board, IP Board, Panel Top (IP) ....................   12
3-5.  Front Panel Block ...........................................................   12
3-6.  Rear Panel Block ............................................................   13
3-7. Panel 
(Rear) 
....................................................................  13
3-8.  AMP Board Block ...........................................................   14
3-9.  POWER Board Block .....................................................   14
3-10. MAIN Board ...................................................................   15
3-11.  Loading Mechanism Block .............................................   15
3-12. Base Unit .........................................................................   16
3-13. Belt ..................................................................................   16
3-14.  OP Base Assy (KSM-213D) ...........................................   17
4. 
TEST  MODE 
 ............................................................   18
5. 
ELECTRICAL  CHECKS 
 ......................................   20
6. DIAGRAMS
6-1.  Block Diagram - CD SERVO Section - ..........................   21
6-2. Block 
Diagram 
 
- iPod, TUNER, BLUETOOTH Section - ......................   22
6-3.  Block Diagram - MAIN Section - ...................................   23
6-4. Block 
Diagram 
 
- PANEL, POWER SUPPLY Section - ...........................   24
6-5.  Printed Wiring Boards - CD Section - ............................   26
6-6.  Schematic Diagram - CD Board - ...................................   27
6-7. Printed 
Wiring 
Boards 
 
- BLUETOOTH Section (BX50BTi) - ............................   28
6-8. Schematic 
Diagram 
 
- BLUETOOTH Section (BX50BTi) - ............................   29
6-9.  Printed Wiring Board - IP Board - ..................................   30
6-10.  Schematic Diagram - IP Board - .....................................   31
6-11.  Printed Wiring Boards - MAIN Section - .......................   32
6-12.  Schematic Diagram - MAIN Section (1/3) - ...................   33
6-13.  Schematic Diagram - MAIN Section (2/3) - ...................   34
6-14.  Schematic Diagram - MAIN Section (3/3) - ...................   35
6-15. Printed Wiring Boards 
 
- HEADPHONE/AMP Section - .....................................   36
6-16.  Schematic Diagram - HEADPHONE/AMP Section - ....   37
6-17.  Printed Wiring Boards - PANEL Section - .....................   38
6-18.  Schematic Diagram - PANEL Section - ..........................   39
6-19.  Printed Wiring Board - POWER Board - ........................   40
6-20.  Schematic Diagram - POWER Board - ..........................   41
7. 
EXPLODED  VIEWS
7-1. Panel 
Section 
...................................................................  50
7-2.  Top Panel Section ...........................................................   51
7-3.  Front Panel Section .........................................................   52
7-4.  MAIN Board Section ......................................................   53
7-5.  POWER Board Section ...................................................   54
7-6.  Loading Mechanism Section ..........................................   55
7-7.  Base Unit Section (BU-K6BD90-WOD)  .......................   56
8. 
ELECTRICAL  PARTS  LIST
  ..............................   57
TABLE  OF  CONTENTS
SAFETY  CHECK-OUT
After correcting the original service problem, perform the follow-
ing safety check before releasing the set to the customer:
Check the antenna terminals, metal trim, “metallized” knobs, 
screws, and all other exposed metal parts for AC leakage.
Check leakage as described below.
LEAKAGE  TEST
The AC leakage from any exposed metal part to earth ground and 
from all exposed metal parts to any exposed metal part having a 
return to chassis, must not exceed 0.5 mA (500 microamperes.). 
Leakage current can be measured by any one of three methods.
1.  A commercial leakage tester, such as the Simpson 229 or RCA 
WT-540A. Follow the manufacturers’ instructions to use these 
instruments.
2.  A battery-operated AC milliammeter. The Data Precision 245 
digital multimeter is suitable for this job.
3.  Measuring the voltage drop across a resistor by means of a 
VOM or battery-operated AC voltmeter. The “limit” indication 
is 0.75 V, so analog meters must have an accurate low-voltage 
scale. The Simpson 250 and Sanwa SH-63Trd are examples 
of a passive VOM that is suitable. Nearly all battery operated 
digital multimeters that have a 2 V AC range are suitable.  (See 
Fig. A)
Fig. A.  Using an AC voltmeter to check AC leakage.
1.5 k
Ω
0.15 
μF
AC
voltmeter
(0.75 V)
To Exposed Metal
Parts on Set
Earth Ground
HCD-BX20i/BX50BTi
4
NOTES ON HANDLING THE OPTICAL PICK-UP 
BLOCK   OR  BASE  UNIT
The laser diode in the optical pick-up block may suffer electro-
static break-down because of the potential difference generated by 
the charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also 
use the procedure in the printed matter which is included in the 
repair parts.
The fl exible board is easily damaged and should be handled with 
care.
NOTES  ON  LASER  DIODE  EMISSION  CHECK
The laser beam on this model is concentrated so as to be focused 
on the disc refl ective surface by the objective lens in the optical 
pickup block. Therefore, when checking the laser diode emission, 
observe from more than 30 cm away from the objective lens.
UNLEADED  SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with 
the lead free mark due to their particular size)
 : LEAD  FREE  MARK
Unleaded solder has the following characteristics.
•  Unleaded solder melts at a temperature about 40 °C higher 
than ordinary solder.
 
Ordinary soldering irons can be used but the iron tip has to be 
applied to the solder joint for a slightly longer time.
 
Soldering irons using a temperature regulator should be set to 
about 350 °C.
Caution:  The printed pattern (copper foil) may peel away if the 
heated tip is applied for too long, so be careful!
• Strong 
viscosity
 
Unleaded solder is more viscous (sticky, less prone to fl ow) 
than ordinary solder so use caution not to let solder bridges 
occur such as on IC pins, etc.
•  Usable with ordinary solder
 
It is best to use only unleaded solder but unleaded solder may 
also be added to ordinary solder.
SECTION  1
SERVICING  NOTES
ANTITHEFT  UNLOCK  MODE
Procedure:
1.  Press the [
?/1
] button to turn the power on.
2.  Press the [FUNCTION] button to select “CD”.
3.  Press two buttons of [
x/
CANCEL] and [
A
] for 5 seconds.
4.  The message “UNLOCKED” is displayed on the fl uorescent 
indicator tube and the disc tray is unlocked.
Note:  When “LOCKED” is displayed, the tray lock is not released by 
turning power on/off with the [
?/1] button.
NOTE  OF  REPLACING  THE  IC904  ON  THE  BT BOARD
IC904 on the BT board cannot exchange with single. When IC904 
on the BT board is damaged, exchange the entire mounted board.
Model
Part No.
HCD-BX20i: US model
3-293-462-0
[]
HCD-BX20i: Canadian model
3-293-463-0
[]
HCD-BX50BTi: US model
3-293-464-0
[]
HCD-BX50BTi: Canadian model
3-293-465-0
[]
HCD-BX20i: Australian model
3-295-838-0
[]
HCD-BX20i: Singapore model
3-296-979-0
[]
HCD-BX20i: AEP model
4-154-084-0
[]
MODEL  IDENTIFICATION
Part No.
– Rear View – (Except Singapore model)
Ver. 1.4
– Bottom View – (Singapore model)
Part No.
Page of 70

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