Read Sony HBD-F300 / HBD-F310 Service Manual online
HBD-F300/F310
2
SAFETY-RELATED COMPONENT WARNING!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS
WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher
• Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong
viscosity
Unleaded solder is more viscous (sticky, less prone to fl ow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
also be added to ordinary solder.
NOTES ON CHIP COMPONENT REPLACEMENT
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
FLEXIBLE CIRCUIT BOARD REPAIRING
• Keep the temperature of soldering iron around 270 °C during
• Keep the temperature of soldering iron around 270 °C during
repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
Laser component in this product is capable of emitting radiation
exceeding the limit for Class 1.
exceeding the limit for Class 1.
This appliance is classifi ed as
a CLASS 1 LASER product.
This marking is located on the
rear or bottom exterior.
a CLASS 1 LASER product.
This marking is located on the
rear or bottom exterior.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specifi ed herein may result in hazardous radia-
tion exposure.
Use of controls or adjustments or performance of procedures
other than those specifi ed herein may result in hazardous radia-
tion exposure.
SPECIAL COMPONENT NOTICE
The components identifi ed by mark 9 contain confi dential infor-
mation.
Strictly follow the instructions whenever the components are re-
paired and/or replaced.
The components identifi ed by mark 9 contain confi dential infor-
mation.
Strictly follow the instructions whenever the components are re-
paired and/or replaced.
TABLE OF CONTENTS
1.
SERVICE NOTE
1-1. Remove the Disc ............................................................. 3
2. DISASSEMBLY
2-1. Back Cabinet Assy ......................................................... 4
2-2. Metal Back Cover ........................................................... 5
2-3. Audio Board .................................................................... 5
2-4. DVD Loader Assy ........................................................... 6
2-5. LED
2-2. Metal Back Cover ........................................................... 5
2-3. Audio Board .................................................................... 5
2-4. DVD Loader Assy ........................................................... 6
2-5. LED
Board
...................................................................... 6
3. DIAGRAMS
3-1. Block
Diagram
................................................................ 9
3-2. Printed Wiring Board –Audio Section– .......................... 10
3-3. Schematic Diagram –Audio Section– ............................. 11
3-4. Printed Wiring Board –Main Section– ............................ 12
3-5. Schematic Diagram –Main Section– .............................. 13
3-6. Printed Wiring Boards –Panel Section– .......................... 14
3-7. Schematic Diagram –Panel Section– .............................. 15
3-8. Printed Wiring Board –Power Section– .......................... 16
3-9. Schematic Diagram –Power Section– ............................. 17
3-3. Schematic Diagram –Audio Section– ............................. 11
3-4. Printed Wiring Board –Main Section– ............................ 12
3-5. Schematic Diagram –Main Section– .............................. 13
3-6. Printed Wiring Boards –Panel Section– .......................... 14
3-7. Schematic Diagram –Panel Section– .............................. 15
3-8. Printed Wiring Board –Power Section– .......................... 16
3-9. Schematic Diagram –Power Section– ............................. 17
4.
EXPLODED VIEWS
4-1. Rear Panel Section .......................................................... 19
4-2. Front Panel Section ......................................................... 20
4-2. Front Panel Section ......................................................... 20
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