HBD-EF1100 - Sony Audio Service Manual (repair manual)

hbd-ef1100 service manual
Model
HBD-EF1100
Pages
88
Size
5.77 MB
Type
PDF
Document
Service Manual
Brand
Device
Audio
File
hbd-ef1100.pdf
Date

Read Sony HBD-EF1100 Service Manual online

SERVICE MANUAL
Sony Corporation
Published by Sony EMCS (Malaysia) PG Tec
SPECIFICATIONS
BLU-RAY DISC/DVD RECEIVER
9-890-609-03
2013I80-1
© 
2013.09
AEP Model
Ver. 1.2  2013.09
•  HBD-EF1100 is the amplifi er, video, HDMI, BD/DVD/CD system, USB, LAN, 
Wireless LAN, Bluetooth, NFC and FM tuner section in BDV-EF1100.
Model Name Using Similar Mechanism
BDP-S3100
Mechanism Type
BPX-7
Optical Pick-up Block Name
KEM480AAA
Photo: HBD-EF1100
HBD-EF1100
Amplifi er Section
POWER OUTPUT (rated)
Front L/Front R: 
40 W + 40 W (at 3 ohms, 1 kHz,
 1% 
THD)
POWER OUTPUT (reference)
Front L/Front R: 
40 W (per channel at 3 ohms,
 1 
kHz)
Subwoofer: 
70 W (at 6 ohms, 80 Hz)
Inputs (Analog)
AUDIO IN 
Sensitivity: 2 V/700 mV
Inputs (Digital)
TV (Audio Return Channel/OPTICAL)
 
Supported formats: LPCM 2CH
 
(up to 48 kHz), Dolby Digital, DTS
HDMI Section
Connector Type 
(19pin)
BD/DVD/CD System
Signal format system  NTSC/PAL
USB Section
(USB) port: 
Type A (For connecting USB 
 
memory, memory card reader, 
 
digital still camera, and digital video 
 camera)
LAN Section
LAN (100) terminal  100BASE-TX Terminal
Wireless LAN Section
Standards Compliance
 
IEEE 802.11 b/g/n
Frequency and Channel
 
2.4 GHz band: channels 1–13
Bluetooth Section
Communication system
 
Bluetooth Specification version 3.0
Output 
Bluetooth Specification Power 
 Class 
2
Maximum communication range
 
Line of sight approx. 10 m
1)
Frequency band 
2.4 GHz band
Modulation method
 
FHSS (Freq Hopping Spread 
 Spectrum)
Compatible Bluetooth profiles
2)
 
A2DP 1.2 (Advanced Audio 
 Distribution 
Profile)
 
AVRCP 1.3 (Audio Video Remote 
 Control 
Profile)
Supported Codecs
3)
 SBC
4)
, AAC
Transmission range (A2DP)
 
20 Hz – 20,000 Hz (Sampling 
 
frequency 44.1 kHz, 48 kHz)
1)
The actual range will vary depending on factors 
 such as obstacles between devices, magnetic fields
 around a microwave oven, static electricity, cordless
 
phone, reception sensitivity, antenna’s perfor-
mance, operating system, software application, etc.
2)
Bluetooth standard profiles indicate the purpose of
 Bluetooth communication between devices.
3)
Codec: Audio signal compression and conversion 
 format
4)
Subband Codec
FM Tuner Section
System 
PLL quartz-locked digital synthesizer
Tuning range 
87.5 MHz - 108.0 MHz (50 kHz step)
Antenna (aerial)
 
FM wire antenna (aerial)
General
Power requirements
 
220 V – 240 V AC, 50/60 Hz
Power consumption
 On: 
60 
W
 Standby: 
0.3 
W
Dimensions (w/h/d) (approx.)
 
430 mm × 50.5 mm × 296 mm incl. 
 projecting 
parts
Mass (approx.)  2.6 kg
Design and specifications are subject to change 
without notice.
• Standby power consumption 0.3W
• 
Over 85% power effi 
ciency of amplifi 
er block is
  achieved with the full digital amplifi er, S-Master.
HBD-EF1100
2
SAFETY-RELATED  COMPONENT  WARNING!
COMPONENTS  IDENTIFIED  BY  MARK  
0  OR  DOTTED  LINE  
WITH  MARK  
0  ON  THE  SCHEMATIC  DIAGRAMS  AND  IN  
THE  PARTS  LIST  ARE  CRITICAL  TO  SAFE  OPERATION.
REPLACE  THESE  COMPONENTS  WITH  SONY  PARTS 
 
WHOSE  PART  NUMBERS  APPEAR  AS  SHOWN  IN  THIS  
MANUAL  OR  IN  SUPPLEMENTS  PUBLISHED  BY  SONY.
•  This system incorporates with Dolby* Digital and the DTS** Digital Surround System.
  *  Manufactured under license from Dolby Laboratories. Dolby and the double-D symbol are 
trademarks of Dolby Laboratories.
  ** Manufactured under license under U.S. Patent Nos: 5,956,674; 5,974,380; 6,226,616; 
6,487,535; 7,212,872; 7,333,929; 7,392,195; 7,272,567 & other U.S. and worldwide patents 
issued & pending. DTS-HD, the Symbol, & DTS-HD and the Symbol together are regis-
tered trademarks of DTS, Inc. Product includes software. © DTS, Inc. All Rights Reserved.
•  This system incorporates High-Defi 
nition Multimedia Interface (HDMI
TM
) technology.
The terms HDMI and HDMI High-Defi nition Multimedia Interface, and the HDMI Logo are 
trademarks or registered trademarks of HDMI Licensing LLC in the United States and other 
countries.
•  Java is a trademark of Oracle and/or its affi liates.
•  “DVD logo” is a trademark of DVD Format/ Logo Licensing Corporation.
•  “Blu-ray Disc”, “Blu-ray”, “Blu-ray 3D”, “BD-LIVE”, “BONUSVIEW”, and logos are trade-
marks of the Blu-ray Disc Association.
•  “Blu-ray Disc”, “DVD+RW”, “DVD-RW”, “DVD+R”, “DVD-R”, “DVD VIDEO”, and “CD” 
logos are trademarks.
•  “BRAVIA” is a trademark of Sony Corporation.
•  “AVCHD 3D/Progressive” and the “AVCHD 3D/Progressive” logo are trademarks of Panasonic 
Corporation and Sony Corporation.
• 
 , “XMB”, and “xross media bar” are trademarks of Sony Corporation and Sony Computer 
Entertainment Inc.
•  “Playstation” is a registered trademark of Sony Computer Entertainment Inc.
•  “Sony Entertainment Network logo” and “Sony Entertainment Network” are trademarks of Sony 
Corporation.
•  Music and video recognition technology and related data are provided by Gracenote
®
.
 
Gracenote is the industry standard in music recognition technology and related content delivery. 
For more information, please visit www.gracenote.com.
 
CD, DVD, Blu-ray Disc, and music and video-related data from Gracenote, Inc., copyright © 
2000-present Gracenote.
 
Gracenote Software, copyright © 2000-present Gracenote. One or more patents owned by 
Gracenote apply to this product and service. See the Gracenote website for a nonexhaustive 
list of applicable Gracenote patents. Gracenote, CDDB, MusicID, MediaVOCS, the Gracenote 
logo and logotype, and the “Powered by Gracenote” logo are either a registered trademarks or 
a trademarks of Gracenote, Inc. in the United States and/or other countries.
 
• Wi-Fi
®
, Wi-Fi Protected Access
®
 and Wi-Fi Alliance
®
 are registered marks of the Wi-Fi 
Alliance.
•  Wi-Fi CERTIFIED™, WPA™, WPA2™ and Wi-Fi Protected Setup™ are marks of the Wi-Fi 
Alliance.
•  The N Mark is a trademark or registered trademark of NFC Forum, Inc. in the United States and 
in other countries.
•  Android is a trademark of Google Inc.
• The 
Bluetooth
®
 word mark and logos are registered trademarks owned by Bluetooth SIG, Inc. 
and any use of such marks by Sony Corporation is under license. Other trademarks and trade 
names are those of their respective owners.
•  MPEG Layer-3 audio coding technology and patents licensed from Fraunhofer IIS and 
Thomson.
•  This product incorporates proprietary technology under license from Verance Corporation and 
is protected by U.S. Patent 7,369,677 and other U.S. and worldwide patents issued and pending 
as well as copyright and trade secret protection for certain aspects of such technology. Cinavia 
is a trademark of Verance Corporation. Copyright 2004-2010 Verance Corporation. All rights 
reserved by Verance. Reverse engineering or disassembly is prohibited.
•  Windows Media is either a registered trademark or trademark of Microsoft Corporation in the 
United States and/or other countries.
 
This product is protected by certain intellectual property rights of Microsoft Corporation. Use 
or distribution of such technology outside of this product is prohibited without a license from 
Microsoft or an authorized Microsoft subsidiary.
  Content owners use Microsoft
®
 PlayReady™ content access technology to protect their 
intellectual property, including copyrighted content. This device uses PlayReady technology to 
access PlayReady-protected content and/or WMDRM-protected content. If the device fails to 
properly enforce restrictions on content usage, content owners may require Microsoft to revoke 
the device’s ability to consume PlayReady-protected content. Revocation should not affect un-
protected content or content protected by other content access technologies. Content owners may 
require you to upgrade PlayReady to access their content. If you decline an upgrade, you will not 
be able to access content that requires the upgrade.
•  DLNA™, the DLNA Logo and DLNA CERTIFIED™ are trademarks, service marks, or 
certifi cation marks of the Digital Living Network Alliance.
• Opera
®
 Devices SDK from Opera Software ASA. Copyright 1995-2013 Opera Software ASA. 
All rights reserved.
 
•  All other trademarks are trademarks of their respective owners.
•  Other system and product names are generally trademarks or registered trademarks of the 
manufacturers. ™ and ® marks are not indicated in this document.
CAUTION
Use of controls or adjustments or performance of procedures 
other than those specifi ed herein may result in hazardous radia-
tion exposure.
End User License Information 
Gracenote
®
 End User License Agreement 
This application or device contains software from Gracenote, Inc. of Emeryville, California 
(“Gracenote”). The software from Gracenote (the “Gracenote Software”) enables this application 
to perform disc and/or fi le  identifi cation and obtain music-related information, including name, 
artist, track, and title information (“Gracenote Data”) from online servers or embedded databases 
(collectively, “Gracenote Servers”) and to perform other functions. You may use Gracenote Data 
only by means of the intended End-User functions of this application or device.
You agree that you will use Gracenote Data, the Gracenote Software, and Gracenote Servers for 
your own personal non-commercial use only. You agree not to assign, copy, transfer or transmit 
the Gracenote Software or any Gracenote Data to any third party. YOU AGREE NOT TO USE 
OR EXPLOIT GRACENOTE DATA, THE GRACENOTE SOFTWARE, OR GRACENOTE 
SERVERS, EXCEPT AS EXPRESSLY PERMITTED HEREIN.
You agree that your non-exclusive license to use the Gracenote Data, the Gracenote Software, 
and Gracenote Servers will terminate if you violate these restrictions. If your license terminates, 
you agree to cease any and all use of the Gracenote Data, the Gracenote Software, and Gracenote
Servers. Gracenote reserves all rights in Gracenote Data, the Gracenote Software, and the Gracenote
Servers, including all ownership rights. Under no circumstances will Gracenote become liable for 
any payment to you for any information that you provide. You agree that Gracenote, Inc. may enforce
its rights under this Agreement against you directly in its own name.
The Gracenote service uses a unique identifi er to track queries for statistical purposes. The purpose 
of a randomly assigned numeric identifi er is to allow the Gracenote service to count queries without 
knowing anything about who you are. For more information, see the web page for the Gracenote 
Privacy Policy for the Gracenote service.
The Gracenote Software and each item of Gracenote Data are licensed to you “AS IS.” Gracenote
makes no representations or warranties, express or implied, regarding the accuracy of any Gracenote
Data from in the Gracenote Servers. Gracenote reserves the right to delete data from the 
Gracenote Servers or to change data categories for any cause that Gracenote deems suffi cient. 
No warranty is made that the Gracenote Software or Gracenote Servers are error-free or that
functioning of Gracenote Software or Gracenote Servers will be uninterrupted. Gracenote is not 
obligated to provide you with new enhanced or additional data types or categories that Gracenote
may provide in the future and is free to discontinue its services at any time.
GRACENOTE DISCLAIMS ALL WARRANTIES EXPRESS OR IMPLIED, INCLUDING, 
BUT NOT LIMITED TO, IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR 
A PARTICULAR PURPOSE, TITLE, AND NON-INFRINGEMENT. GRACENOTE DOES 
NOT WARRANT THE RESULTS THAT WILL BE OBTAINED BY YOUR USE OF THE 
GRACENOTE SOFTWARE OR ANY GRACENOTE SERVER. IN NO CASE WILL 
GRACENOTE BE LIABLE FOR ANY CONSEQUENTIAL OR INCIDENTAL DAMAGES OR 
FOR ANY LOST PROFITS OR LOST REVENUES.
© Gracenote, Inc. 2009
HBD-EF1100
3
SAFETY  CHECK-OUT
After correcting the original service problem, perform the follow-
ing safety check before releasing the set to the customer:
Check the antenna terminals, metal trim, “metallized” knobs, 
screws, and all other exposed metal parts for AC leakage.
Check leakage as described below.
LEAKAGE  TEST
The AC leakage from any exposed metal part to earth ground and 
from all exposed metal parts to any exposed metal part having a 
return to chassis, must not exceed 0.5 mA (500 microamperes.). 
Leakage current can be measured by any one of three methods.
1.  A commercial leakage tester, such as the Simpson 229 or RCA 
WT-540A. Follow the manufacturers’ instructions to use these 
instruments.
2.  A battery-operated AC milliammeter. The Data Precision 245 
digital multimeter is suitable for this job.
3.  Measuring the voltage drop across a resistor by means of a 
VOM or battery-operated AC voltmeter. The “limit” indication 
is 0.75 V, so analog meters must have an accurate low-voltage 
scale. The Simpson 250 and Sanwa SH-63Trd are examples 
of a passive VOM that is suitable. Nearly all battery operated 
digital multimeters that have a 2 V AC range are suitable. (See 
Fig. A)
1.5 k
Ω
0.15 
μF
AC
voltmeter
(0.75 V)
To Exposed Metal
Parts on Set
Earth Ground
Fig. A.  Using an AC voltmeter to check AC leakage.
NOTES  ON  CHIP  COMPONENT  REPLACEMENT
• 
Never reuse a disconnected chip component.
• 
Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
FLEXIBLE  CIRCUIT  BOARD  REPAIRING
• 
Keep the temperature of soldering iron around 270 °C during 
repairing.
• 
Do not touch the soldering iron on the same conductor of the 
circuit board (within 3 times).
• 
Be careful not to apply force on the conductor when soldering 
or unsoldering.
HBD-EF1100
4
1. 
SERVICING  NOTES
 ..............................................   5
2. DISASSEMBLY
2-1. Disassembly 
Flow 
...........................................................  13
2-2.  How To Bend FFC ..........................................................   14
2-3. Case 
.................................................................................  15
2-4. Panel 
Loading 
Assy 
........................................................  15
2-5.  Front Panel Assy (EJ0M) ................................................   16
2-6.  BD Drive (BPX-7) ..........................................................   16
2-7.  POWER KEY Board, WLAN/BT COMBO Card,
PANEL Board .................................................................   17
2-8. MB1002 
Board 
...............................................................  18
2-9. AMP 
Board 
.....................................................................  18
2-10.  Switching Regulator (SWR1) .........................................   19
2-11.  Optical Pick-up Block (KEM480AAA),
 Wire 
(Flat 
Type) 
..............................................................  
20
3. 
TEST  MODE
 .............................................................   21
4. 
ELECTRICAL  CHECK
 ..........................................   32
5. TROUBLESHOOTING
 ...........................................   33
6. DIAGRAMS
6-1.  Block Diagram - SERVO Section - ................................   37
6-2.  Block Diagram - MEMORY/HDMI Section - ................   38
6-3.  Block Diagram - MAIN Section - ...................................   39
6-4.  Block Diagram - AMP Section - .....................................   40
6-5.  Block Diagram - POWER SUPPLY Section - ................   41
6-6. Printed 
Wiring 
Board 
- MB1002 Board (Component Side) - ............................   43
6-7. Printed 
Wiring 
Board 
- MB1002 Board (Conductor Side) - ..............................   44
6-8.  Schematic Diagram - MB1002 Board (1/6) - .................   45
6-9.  Schematic Diagram - MB1002 Board (2/6) - .................   46
6-10.  Schematic Diagram - MB1002 Board (3/6) - .................   47
6-11.  Schematic Diagram - MB1002 Board (4/6) - .................   48
6-12.  Schematic Diagram - MB1002 Board (5/6) - .................   49
6-13.  Schematic Diagram - MB1002 Board (6/6) - .................   50
6-14. Printed Wiring Board 
- AMP Board (Component Side) - ..................................   51
6-15. Printed Wiring Board 
- AMP Board (Conductor Side) - ....................................   52
6-16.  Schematic Diagram - AMP Board (1/2) - .......................   53
6-17.  Schematic Diagram - AMP Board (2/2) - .......................   54
TABLE  OF  CONTENTS
6-18.  Printed Wiring Board - PANEL Board - .........................   55
6-19.  Schematic Diagram - PANEL Board - ............................   56
6-20.  Printed Wiring Board - POWER KEY Board -...............   57
6-21.  Schematic Diagram - POWER KEY Board - .................   57
7. 
EXPLODED  VIEWS
7-1. Case 
Section 
....................................................................  74
7-2.  Front Panel Section .........................................................   75
7-3.  Chassis Bottom Section ..................................................   76
7-4. Chassis 
Section 
...............................................................  77
7-5.  BD Drive Section (BPX-7) .............................................   78
8. 
ELECTRICAL  PARTS  LIST
  ..............................   79
This appliance is classified as a 
CLASS 3R LASER product. 
Visible and invisible laser radiation 
is emitted when the laser protective 
housing is opened, so be sure to 
avoid direct eye exposure.
This appliance is classified as a 
CLASS 1 LASER product. This 
marking is located on the rear 
exterior.
The nameplate is located on the 
bottom exterior.
This marking is located on the laser 
protective housing inside the 
enclosure.
Page of 88
Display

Download Sony HBD-EF1100 Service Manual (Repair Manual)

Here you can read online and download Sony HBD-EF1100 Service Manual in PDF. HBD-EF1100 service manual will guide through the process and help you recover, restore, fix, disassemble and repair Sony HBD-EF1100 Audio. Information contained in service manuals typically includes schematics / circuit diagrams, wiring diagrams, block diagrams, printed wiring boards, exploded views, parts list, disassembly / assembly, pcb.