Read Sony HBD-E770W Service Manual online
HBD-E770W
8
NOTE THE BD DRIVE (BPX-5) PARTS REPLACING
The mechanism blocks except optical device of BD drive (BPX-5)
are chiefl y composed of the following parts.
•
The mechanism blocks except optical device of BD drive (BPX-5)
are chiefl y composed of the following parts.
•
CHUCK HOLDER ASSY
•
LOADING ASSY
•
HOLDER, FFC (REAR)
These parts are produced by two venders, it is not compatible.
Therefore, CHUCK HOLDER ASSY and LOADING ASSY are
supplied by one pair as repair parts. Please exchange both CHUCK
HOLDER ASSY and LOADING ASSY at the same time.
Therefore, CHUCK HOLDER ASSY and LOADING ASSY are
supplied by one pair as repair parts. Please exchange both CHUCK
HOLDER ASSY and LOADING ASSY at the same time.
HOLDER FFC (REAR) need not be exchanged at the same time.
Note: The laser caution label is not pasted to LOADING FOR SERVICE
(Part No. A-1750-926-A). Please peel off an original laser caution
label, and paste it to LOADING FOR SERVICE when you use
LOADING FOR SERVICE.
label, and paste it to LOADING FOR SERVICE when you use
LOADING FOR SERVICE.
LASER CAUTION LABEL
CHUCK HOLDER ASSY
LOADING ASSY
LOADING FOR SERVICE
HOLDER, FFC (REAR)
NOTE OF REPLACING THE THE IC3100 AND IC3200
ON THE MAIN BOARD AND THE COMPLETE MAIN
BOARD
When IC3100 and IC3200 on the MAIN board and the complete
MAIN board are replaced, it is necessary to spread the compound
(THERMAL COMPOUND (G747)) (Part No. J-2501-221-A ) be-
tween parts and heat sink.
Spread the compound referring to the fi gure below.
ON THE MAIN BOARD AND THE COMPLETE MAIN
BOARD
When IC3100 and IC3200 on the MAIN board and the complete
MAIN board are replaced, it is necessary to spread the compound
(THERMAL COMPOUND (G747)) (Part No. J-2501-221-A ) be-
tween parts and heat sink.
Spread the compound referring to the fi gure below.
– MAIN Board (Component Side) –
IC3200
IC3100
IC3100
IC3200
NOTE OF REPLACING THE CASE
“3D logo mark” is added from the midway production to the case.
Please exchange cases after confi rming the presence of “3D logo mark”.
“3D logo mark” is added from the midway production to the case.
Please exchange cases after confi rming the presence of “3D logo mark”.
Former: There is no 3D logo mark.
New:
New:
There is 3D logo mark.
Ver. 1.1
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