Read Sony DXA-WZ7AV / MHC-WZ7AV Service Manual online
2
DXA-WZ7AV
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK
0
OR DOTTED LINE WITH
MARK
0
ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS
LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE
COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS
APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS
PUBLISHED BY SONY.
COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS
APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS
PUBLISHED BY SONY.
TABLE OF CONTENTS
1. GENERAL
·········································································· 3
2. DISASSEMBLY
························································· 5
2-1. Case ··············································································· 5
2-2. Switching Power, DC Fan (FAN301) ···························· 6
2-3. TC MAIN Board ··························································· 6
2-4. FRONT AMP Board, SURROUND AMP Board ·········· 7
2-5. Front (TC) Panel Assy ··················································· 7
2-6. Tape mechanism deck (CWM43RR23) ························ 8
2-7. Lid (TC) Assy, Holder (A) Assy, Holder (B) Assy ········ 8
2-2. Switching Power, DC Fan (FAN301) ···························· 6
2-3. TC MAIN Board ··························································· 6
2-4. FRONT AMP Board, SURROUND AMP Board ·········· 7
2-5. Front (TC) Panel Assy ··················································· 7
2-6. Tape mechanism deck (CWM43RR23) ························ 8
2-7. Lid (TC) Assy, Holder (A) Assy, Holder (B) Assy ········ 8
3. ELECTRICAL ADJUSTMENTS
································· 9
4. DIAGRAMS
······································································ 10
4-1. Block Diagrams ··························································· 11
4-2. Printed Wiring Board – TC MAIN Board – ················ 12
4-3. Schematic Diagram – TC MAIN Board (1/2) – ·········· 13
4-4. Schematic Diagram – TC MAIN Board (2/2) – ·········· 14
4-5. Printed Wiring Board – FRONT AMP Board – ·········· 15
4-6. Schematic Diagram – FRONT AMP Board – ············· 16
4-7. Printed Wiring Board – SURROUND AMP Board – · 17
4-8. Schematic Diagram – SURROUND AMP Board – ···· 18
4-2. Printed Wiring Board – TC MAIN Board – ················ 12
4-3. Schematic Diagram – TC MAIN Board (1/2) – ·········· 13
4-4. Schematic Diagram – TC MAIN Board (2/2) – ·········· 14
4-5. Printed Wiring Board – FRONT AMP Board – ·········· 15
4-6. Schematic Diagram – FRONT AMP Board – ············· 16
4-7. Printed Wiring Board – SURROUND AMP Board – · 17
4-8. Schematic Diagram – SURROUND AMP Board – ···· 18
5. EXPLODED VIEWS
5-1. Front Panel Section ····················································· 19
5-2. Chassis Section ···························································· 20
5-3. Tape Mechanism Deck Section (CWM43RR23) ········ 21
5-2. Chassis Section ···························································· 20
5-3. Tape Mechanism Deck Section (CWM43RR23) ········ 21
6. ELECTRICAL PARTS LIST
······································· 22
[When bringing in the equipment for service]
In case of repairing, please bring the entire system set([HCD-
WZ7AV, DXA-WZ7AV],except for the speaker) to the service
station.
WZ7AV, DXA-WZ7AV],except for the speaker) to the service
station.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of soldering iron around 270˚C
during repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
Unleaded solder
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40
• Unleaded solder melts at a temperature about 40
°C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350
°C.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow) than
ordinary solder so use caution not to let solder bridges occur such
as on IC pins, etc.
ordinary solder so use caution not to let solder bridges occur such
as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
also be added to ordinary solder.
MODEL IDENTIFICATION
— BACK PANEL —
PARTS No.
MODEL
Saudi Arabian model
Thai model
Singapore model
PARTS No.
4-244-468-4
s
4-244-468-5
s
4-244-468-6
s
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