Read Sony DAV-TZ135 / HBD-TZ135 Service Manual online
SERVICE MANUAL
Sony Corporation
Published by Sony Techno Create Corporation
HBD-TZ135
SPECIFICATIONS
DVD RECEIVER
9-893-082-04
2012H33-1
©
2012.08
Canadian Model
AEP Model
UK Model
E Model
Australian Model
Chinese Model
Ver. 1.3 2012.08
• HBD-TZ135 is the amplifi er, DVD/CD and tuner
section in DAV-TZ135.
Model Name Using Similar Mechanism
HBD-TZ130
DVD Drive Mechanism Type
CDM85
Optical Pick-up Name
KHM-313
This system incorporates with Dolby* Digital and Dolby Pro Logic
adaptive matrix surround decoders.
* Manufactured under license from Dolby Laboratories.
adaptive matrix surround decoders.
* Manufactured under license from Dolby Laboratories.
Dolby, Pro Logic, and the double-D symbol are trademarks of
Dolby Laboratories.
Dolby Laboratories.
This system incorporates High-Defi nition Multimedia Interface
(HDMI™) technology.
HDMI, the HDMI logo and High-Defi nition Multimedia Interface are
trademarks or registered trademarks of HDMI Licensing LLC.
“BRAVIA” is a trademark of Sony Corporation.
MPEG Layer-3 audio coding technology and patents licensed from
Fraunhofer IIS and Thomson.
Windows Media is a registered trademark of Microsoft Corporation in
the United States and/or other countries.
(HDMI™) technology.
HDMI, the HDMI logo and High-Defi nition Multimedia Interface are
trademarks or registered trademarks of HDMI Licensing LLC.
“BRAVIA” is a trademark of Sony Corporation.
MPEG Layer-3 audio coding technology and patents licensed from
Fraunhofer IIS and Thomson.
Windows Media is a registered trademark of Microsoft Corporation in
the United States and/or other countries.
– Continued on next page –
Amplifi er Section
POWER OUTPUT (rated):
Front L + Front R
POWER OUTPUT (rated):
Front L + Front R
32 W + 32 W (at 3
ohms, 1 kHz, 1% THD)
POWER OUTPUT (reference):
Front L/Front R/
Surround
L/Surround
R: 43 watts (per channel
at 3 ohms, 1 kHz)
Center: 89 watts (per
channel at 6 ohms, 1 kHz)
Subwoofer: 89 watts (at
6 ohms, 100 Hz)
Inputs
TV/CABLE :
TV/CABLE :
Pin jack
CD/DVD System
Laser Diode Properties
Emission
Laser Diode Properties
Emission
Duration:
Continuous
Laser Output*: Less
than
1,000
W
* This output is the value measurement at a dis-
tance of 200 mm from the objective lens sur-
face on the Optical Pick-up Block with 7 mm
aperture.
face on the Optical Pick-up Block with 7 mm
aperture.
USB Section
(USB) port:
Maximum current:
500 mA
Tuner Section
System PLL
System PLL
quartz-locked
digital
synthesizer
Tuning range
North American models:
North American models:
87.5 MHz - 108.0 MHz
(100 kHz step)
Other models:
87.5 MHz - 108.0 MHz
(50 kHz step)
Antenna (aerial) terminals
75 ohms, unbalanced
Intermediate frequency
10.7
10.7
MHz
HBD-TZ135
2
Video Section
Outputs
Outputs
VIDEO: Pin jack
HDMI OUT: HDMI
19-pin
General
Power requirements
North American and Mexican models:
Power requirements
North American and Mexican models:
120 V AC, 60 Hz
Latin American models:
110 V - 240 V AC,
50/60
Hz
Argentine models:
220 V - 240 V AC,
50/60
Hz
Brazilian models:
127 V - 240 V AC,
50/60
Hz
Other models:
220 V - 240 V AC,
50/60
Hz
Power consumption
On: 67 W
Standby:
<1
W*
* Valid when the system is in the following status:
– [Control for HDMI] is set to [Off].
Dimensions (approx.) 360 mm × 56 mm ×
– [Control for HDMI] is set to [Off].
Dimensions (approx.) 360 mm × 56 mm ×
342 mm (14
1
/
4
in ×
2
1
/
4
in × 13
1
/
2
in) (w/h/d)
incl. projecting parts
Mass (approx.)
2.6 kg (5 lb. 12 oz.)
Design and specifi cations are subject to
change without notice.
change without notice.
Ver. 1.1
SAFETY-RELATED COMPONENT WARNING!
COMPONENTS IDENTIFIED BY MARK
0 OR DOTTED LINE
WITH MARK
0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS
REPLACE THESE COMPONENTS WITH SONY PARTS
WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ!
LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE
0 SUR
LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES
PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE FONC-
TIONNEMENT. NE REMPLACER CES COMPOSANTS QUE
PAR DES PIÈCES SONY DONT LES NUMÉROS SONT DON-
NÉS DANS CE MANUEL OU DANS LES SUPPLÉMENTS
PUBLIÉS PAR SONY.
PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE FONC-
TIONNEMENT. NE REMPLACER CES COMPOSANTS QUE
PAR DES PIÈCES SONY DONT LES NUMÉROS SONT DON-
NÉS DANS CE MANUEL OU DANS LES SUPPLÉMENTS
PUBLIÉS PAR SONY.
SPECIAL COMPONENT NOTICE
The components identifi ed by mark
The components identifi ed by mark
9 contain confi dential infor-
mation.
Strictly follow the instructions whenever the components are re-
paired and/or replaced.
Strictly follow the instructions whenever the components are re-
paired and/or replaced.
NOTICE POUR COMPOSANTS SPÉCIAUX
Les composants identifi és par la marque
Les composants identifi és par la marque
9 contiennent des infor-
mations confi dentielles.
Suivre scrupuleusement les instructions chaque fois qu’un compo-
sant est remplacé et / ou réparé.
Suivre scrupuleusement les instructions chaque fois qu’un compo-
sant est remplacé et / ou réparé.
HBD-TZ135
3
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher
• Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong
viscosity
Unleaded solder is more viscous (sticky, less prone to fl ow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
•
Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
also be added to ordinary solder.
NOTES ON CHIP COMPONENT REPLACEMENT
•
•
Never reuse a disconnected chip component.
•
Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
aged by heat.
FLEXIBLE CIRCUIT BOARD REPAIRING
•
•
Keep the temperature of soldering iron around 270 °C during
repairing.
repairing.
•
Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
circuit board (within 3 times).
•
Be careful not to apply force on the conductor when soldering
or unsoldering.
or unsoldering.
For European, Chinese and Mexican models:
Laser component in this product is capable of emitting radiation
exceeding the limit for Class 1.
exceeding the limit for Class 1.
This appliance is classifi ed as
a CLASS 1 LASER product.
This marking is located on the
rear exterior of unit.
a CLASS 1 LASER product.
This marking is located on the
rear exterior of unit.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specifi ed herein may result in hazardous radia-
tion exposure.
Use of controls or adjustments or performance of procedures
other than those specifi ed herein may result in hazardous radia-
tion exposure.
• Abbreviation
AR :
AR :
Argentina
model
AUS :
Australian
model
BR
: Brazilian model
CH
: Chinese model
CND : Canadian model
E3
E3
: 240V AC area in E model
E12
: 220 – 240V AC area in E model
E32
: 110 – 240V AC area in E model
MX
: Mexican model
PH
: Philippines model
RU
: Russian model
SAF
: South African model
SP
: Singapore model
TH :
Thai
model
Model
Part No.
MX model
GSE200276-0019
SP model
GSE200276-0020
AEP, UK model
GSE200276-0021
RU model
GSE200276-0022
AUS model
GSE200276-0023
TH model
GSE200276-0024
CH model
GSE200276-0025
E32 model
GSE200276-0026
CND model
GSE200276-0028
E3, SAF model
GSE200276-0029
E12 model
GSE200276-0030
PH model
GSE200276-0031
AR model
GSE200276-0032
BR model
GSE200276-0033
MODEL IDENTIFICATION
– Back Cabinet –
– Back Cabinet –
Parts No.
Ver. 1.1
HBD-TZ135
4
TABLE OF CONTENTS
1.
SERVICING NOTES
............................................. 5
2. DISASSEMBLY
2-1. Top Cover ....................................................................... 9
2-2. Door
2-2. Door
................................................................................ 10
2-3. Front Cabinet Section ..................................................... 10
2-4. CONTROL Board, STANDBY Board ............................ 11
2-5. USB
2-4. CONTROL Board, STANDBY Board ............................ 11
2-5. USB
Board
...................................................................... 11
2-6. MAIN
Board
................................................................... 12
2-7. POWER
Board
................................................................ 12
2-8. DVD Mechanism Deck Section ...................................... 13
2-9. Optical
2-9. Optical
Pick-up
............................................................... 13
3. DIAGRAMS
3-1. Block
Diagram
................................................................ 15
3-2. Printed Wiring Board –Main Section (1/2)– ................... 16
3-3. Printed Wiring Board –Main Section (2/2)– ................... 17
3-3. Printed Wiring Board –Main Section (2/2)– ................... 17
3-4. Schematic Diagram –Main Section (1/2)– ...................... 18
3-5. Schematic Diagram –Main Section (2/2)– ...................... 19
3-6. Printed Wiring Boards –Display Section– ...................... 20
3-7. Schematic Diagram –Display Section– .......................... 21
3-8. Printed Wiring Board –Power Section– .......................... 22
3-9. Schematic Diagram –Power Section– ............................. 23
3-5. Schematic Diagram –Main Section (2/2)– ...................... 19
3-6. Printed Wiring Boards –Display Section– ...................... 20
3-7. Schematic Diagram –Display Section– .......................... 21
3-8. Printed Wiring Board –Power Section– .......................... 22
3-9. Schematic Diagram –Power Section– ............................. 23
4.
EXPLODED VIEWS
4-1. Overall
Section
............................................................... 24
4-2. Front Cabinet Section ..................................................... 25
4-3. Chassis
4-3. Chassis
Section
............................................................... 26
4-4. DVD Mechanism Deck Section ...................................... 27
5.
ELECTRICAL PARTS LIST
.............................. 28
Ver. 1.3
