Read Sony DAV-SR4W / HCD-SR4W Service Manual online
SERVICE MANUAL
Sony Corporation
Audio Group
Published by Sony Engineering Corporation
Published by Sony Engineering Corporation
AEP Model
UK Model
E Model
Australian Model
Chinese Model
SACD/DVD RECEIVER
9-879-095-04
2005H16-1
© 2005.08
© 2005.08
Ver. 1.3 2005.08
SPECIFICATIONS
HCD-SR4W
HCD-SR4W is the amplifier, DVD/
SACD and tuner section in DAV-SR4W.
SACD and tuner section in DAV-SR4W.
Model Name Using Similar Mechanism
HCD-SR1
Mechanism Type
CDM80A-DVBU24
Optical Pick-up Name
DBU-1
Amplifier section
Stereo mode (rated)
65 W + 65 W (4 ohms at
1 kHz, DIN)
1 kHz, DIN)
Surround mode
Front:
114
W +
114
W
(reference)
(with SS-TS21)
music power output
Center*:
114
W
(with SS-CT33)
Surround*:
Surround*:
114
W +
114
W
(with SA-TS22W,
Subwoofer*:
115
W
× 2
(with SS-WS12)
* Depending on the sound field settings and the source
,
there may be no sound output.
Inputs
VIDEO/TV/SAT:
Sensitivity: 250 mV/
450 mV/450 mV
450 mV/450 mV
Impedance: 50 kilohms
Output
SURROUND BACK
Voltage: 2V
Impedance: 1 kilohms
Voltage: 2V
Impedance: 1 kilohms
Phones
Accepts low-and high-
impedance headphones.
impedance headphones.
Super Audio CD/DVD system
Laser
Semiconductor laser
(Super Audio CD/DVD:
(Super Audio CD/DVD:
λ
= 650 nm)
(CD:
(CD:
λ = 780 nm)
Emission duration:
continuous
continuous
Signal format system
PAL/NTSC
Frequency response (at 2 CH STEREO mode)
DVD (PCM): 2 Hz to 22
kHz (
kHz (
±1.0 dB)
CD: 2 Hz to 20 kHz (
±1.0
dB)
Harmonic distortion
Less than 0.03 %
Tuner section
System
PLL quartz-locked digital
synthesizer system
synthesizer system
FM tuner section
Tuning range
Tuning range
87.5 – 108.0 MHz (50 kHz
step)
step)
Antenna (aerial)
FM wire antenna (aerial)
Antenna (aerial) terminals
75 ohms, unbalanced
Intermediate frequency
10.7 MHz
AM tuner section
Tuning range
European, Russian models:531 – 1,602 kHz (with the
Tuning range
European, Russian models:531 – 1,602 kHz (with the
interval set at 9 kHz)
531 – 1,602 kHz (with the
interval set at 9 kHz)
531 – 1,602 kHz (with the
interval set at 9 kHz)
531 – 1,602 kHz (with the
interval set at 9 kHz)
531 – 1,602 kHz (with the
interval set at 9 kHz)
530 – 1,710 kHz (with the
interval set at 10 kHz
interval set at 10 kHz
)
Antenna (aerial)
AM loop antenna (aerial)
Intermediate frequency
450 kHz
Middle Easten models:
Other models:
European, Russian models:
Video section
Outputs
Video: 1 Vp-p 75 ohms
V
S video:
Y: 1 Vp-p 75 ohms
C:0.286 Vp-p 75 ohms
COMPONENT:
Y: 1 Vp-p 75 ohms
P
Y: 1 Vp-p 75 ohms
C:0.286 Vp-p 75 ohms
COMPONENT:
Y: 1 Vp-p 75 ohms
P
B
/C
B
, P
R
/C
R
: 0.7 Vp-p
75 ohms
ideo: Vp-p 75 ohms
Other models:
General
Power requirements
European models:
European models:
230 V AC, 50/60 Hz
Other models:
220 – 240 V AC,
50/60 Hz
50/60 Hz
Power consumption
90 W
0.3 W (at the Power
Saving mode)
0.3 W (at the Power
Saving mode)
Dimensions (approx.)
430
× 60 × 385 mm
incl. projecting
parts
Mass (approx.)
4.7 kg
Design and specifications are subject to change
without notice.
without notice.
/h/d)
(w
SS-TS21)
2
HCD-SR4W
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350
°C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscou-s (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
also be added to ordinary solder.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK
0
OR DOTTED LINE
WITH MARK
0
ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270 °C
during repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radiation
exposure.
other than those specified herein may result in hazardous radiation
exposure.
Laser component in this product is capable of emitting radiation
exceeding the limit for Class 1.
exceeding the limit for Class 1.
This appliance is classified as
a CLASS 1 LASER product.
The CLASS 1 LASER
PRODUCT MARKING is
located on the rear exterior.
a CLASS 1 LASER product.
The CLASS 1 LASER
PRODUCT MARKING is
located on the rear exterior.
3
HCD-SR4W
TABLE OF CONTENTS
1.
SERVICING NOTE
...................................................
4
2.
GENERAL
...................................................................
5
3.
DISASSEMBLY
3-1.
Disassembly Flow ...........................................................
8
3-2.
Side Panel (R)(L), Front Panel Section ...........................
9
3-3.
Fl Board ...........................................................................
9
3-4.
Mechanism Deck (CDM80A-DVBU24) ......................... 10
3-5.
AMP Board ...................................................................... 10
3-6.
Switching Regulator ........................................................ 11
3-7.
Tuner Unit, IO Board ...................................................... 11
3-8.
DMB08 Board ................................................................. 12
3-9.
Chassis (Top) ................................................................... 12
3-10. Lever (Loading R/L) ........................................................ 13
3-11. Disc Stop Lever, Disc Sensor Lever ................................ 14
3-12. DRIVER Board ............................................................... 14
3-13. RF Board ......................................................................... 15
3-14. Optical Pick-up (DBU-1) ................................................ 15
3-15. Base Unit ......................................................................... 16
3-16. Lever (BU Lock) ............................................................. 16
3-17. Close Lever ...................................................................... 17
3-18. Dir Lever, Gear (IDL-B) .................................................. 17
3-19. Gear (IDL-C) .................................................................... 18
3-11. Disc Stop Lever, Disc Sensor Lever ................................ 14
3-12. DRIVER Board ............................................................... 14
3-13. RF Board ......................................................................... 15
3-14. Optical Pick-up (DBU-1) ................................................ 15
3-15. Base Unit ......................................................................... 16
3-16. Lever (BU Lock) ............................................................. 16
3-17. Close Lever ...................................................................... 17
3-18. Dir Lever, Gear (IDL-B) .................................................. 17
3-19. Gear (IDL-C) .................................................................... 18
4.
TEST MODE
............................................................... 19
5.
ELECTRICAL ADJUSTMENT
............................. 27
6.
DIAGRAMS
6-1.
Block Diagram – RF/SERVO Section – .......................... 30
6-2.
Block Diagram – AUDIO (DSP) Section – ..................... 31
6-3.
Block Diagram – AUDIO (OUT) Section – .................... 32
6-4.
Block Diagram – VIDEO Section – ................................ 33
6-5.
Block Diagram – DIAT TRANSMIT Section – .............. 34
6-6.
Block Diagram – POWER Section – ............................... 35
6-7.
Printed Wiring Board – RF Board – ................................ 36
6-8.
Schematic Diagram – RF Board – ................................... 37
6-9.
Printed Wiring Board – DRIVER Board – ...................... 38
6-10. Schematic Diagram – DRIVER Board – ......................... 38
6-11. Printed Wiring Board – DMB08 Board (Side A) – ......... 39
6-12. Printed Wiring Board – DMB08 Board (Side B) – ......... 40
6-11. Printed Wiring Board – DMB08 Board (Side A) – ......... 39
6-12. Printed Wiring Board – DMB08 Board (Side B) – ......... 40
6-13. Schematic Diagram – DMB08 Board (1/10) – ................ 41
6-14. Schematic Diagram – DMB08 Board (2/10) – ................ 42
6-15. Schematic Diagram – DMB08 Board (3/10) – ................ 43
6-16. Schematic Diagram – DMB08 Board (4/10) – ................ 44
6-17. Schematic Diagram – DMB08 Board (5/10) – ................ 45
6-18. Schematic Diagram – DMB08 Board (6/10) – ................ 46
6-19. Schematic Diagram – DMB08 Board (7/10) – ................ 47
6-20. Schematic Diagram – DMB08 Board (8/10) – ................ 48
6-21. Schematic Diagram – DMB08 Board (9/10) – ................ 49
6-22. Schematic Diagram – DMB08 Board (10/10) – .............. 50
6-23. Printed Wiring Board – AMP Board (Side A) – .............. 51
6-24. Printed Wiring Board – AMP Board (Side B) – .............. 52
6-25. Schematic Diagram – AMP Board (1/4) – ...................... 53
6-26. Schematic Diagram – AMP Board (2/4) – ...................... 54
6-27. Schematic Diagram – AMP Board (3/4) – ...................... 55
6-28. Schematic Diagram – AMP Board (4/4) – ...................... 56
6-29. Printed Wiring Board – IO Section – .............................. 57
6-30. Schematic Diagram – IO Section (1/2) – ........................ 58
6-31. Schematic Diagram – IO Section (2/2) – ........................ 59
6-32. Printed Wiring Board – DDCON Board – ....................... 60
6-33. Schematic Diagram – DDCON Board – ......................... 61
6-34. Printed Wiring Board – DIAT TRANSMIT Board – ...... 62
6-35. Schematic Diagram – DIAT TRANSMIT Board – ........ 63
6-36. Printed Wiring Board – SPEAKER OUT Section – ........ 64
6-37. Schematic Diagram – SPEAKER OUT Section – .......... 65
6-38. Printed Wiring Board – FL Board – ................................ 66
6-39. Schematic Diagram – FL Board – ................................... 67
6-40. Printed Wiring Board
6-14. Schematic Diagram – DMB08 Board (2/10) – ................ 42
6-15. Schematic Diagram – DMB08 Board (3/10) – ................ 43
6-16. Schematic Diagram – DMB08 Board (4/10) – ................ 44
6-17. Schematic Diagram – DMB08 Board (5/10) – ................ 45
6-18. Schematic Diagram – DMB08 Board (6/10) – ................ 46
6-19. Schematic Diagram – DMB08 Board (7/10) – ................ 47
6-20. Schematic Diagram – DMB08 Board (8/10) – ................ 48
6-21. Schematic Diagram – DMB08 Board (9/10) – ................ 49
6-22. Schematic Diagram – DMB08 Board (10/10) – .............. 50
6-23. Printed Wiring Board – AMP Board (Side A) – .............. 51
6-24. Printed Wiring Board – AMP Board (Side B) – .............. 52
6-25. Schematic Diagram – AMP Board (1/4) – ...................... 53
6-26. Schematic Diagram – AMP Board (2/4) – ...................... 54
6-27. Schematic Diagram – AMP Board (3/4) – ...................... 55
6-28. Schematic Diagram – AMP Board (4/4) – ...................... 56
6-29. Printed Wiring Board – IO Section – .............................. 57
6-30. Schematic Diagram – IO Section (1/2) – ........................ 58
6-31. Schematic Diagram – IO Section (2/2) – ........................ 59
6-32. Printed Wiring Board – DDCON Board – ....................... 60
6-33. Schematic Diagram – DDCON Board – ......................... 61
6-34. Printed Wiring Board – DIAT TRANSMIT Board – ...... 62
6-35. Schematic Diagram – DIAT TRANSMIT Board – ........ 63
6-36. Printed Wiring Board – SPEAKER OUT Section – ........ 64
6-37. Schematic Diagram – SPEAKER OUT Section – .......... 65
6-38. Printed Wiring Board – FL Board – ................................ 66
6-39. Schematic Diagram – FL Board – ................................... 67
6-40. Printed Wiring Board
– POWER/FRONT PANEL Section – ............................. 68
6-41. Schematic Diagram
– POWER/FRONT PANEL Section – ............................. 69
7.
EXPLODED VIEWS
7-1.
Case Section ................................................................... 103
7-2.
Front Panel Section ........................................................ 104
7-3.
Chassis Section ............................................................... 105
7-4.
Mechanism Deck Section-1 (CDM80A-DVBU24) ....... 106
7-5.
Mechanism Deck Section-2 (CDM80A-DVBU24) ....... 107
7-6.
Mechanism Deck Section-3 (CDM80A-DVBU24) ....... 108
7-7.
Base Unit Section ........................................................... 109
8.
ELECTRICAL PARTS LIST
................................. 110
4
HCD-SR4W
SECTION 1
SERVICING NOTE
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
MODEL IDENTIFICATION
— BACK PANEL —
Part No.
• Abbreviation
AUS : Australian model
CH : Chinese model
E41 : 230 V AC area in E model
EA : Saudi Arabia model
HK : Hong Kong model
KR : Korean model
MX : Mexican model
RU : Russian model
SP : Singapore model
TW : Taiwan model
AUS : Australian model
CH : Chinese model
E41 : 230 V AC area in E model
EA : Saudi Arabia model
HK : Hong Kong model
KR : Korean model
MX : Mexican model
RU : Russian model
SP : Singapore model
TW : Taiwan model
Model Name
Part No.
EA
2-109-513-0
[]
HK, SP, TW, KR, CH
2-109-513-1
[]
AEP, UK
4-253-896-7
[]
RU
4-253-896-8
[]
MX, AUS, E41
4-253-896-9
[]