DAV-SC5, DAV-SC6, DAV-SC8, HCD-SC5, HCD-SC6, HCD-SC8 - Sony Audio Service Manual (repair manual)

dav-sc5, dav-sc6, dav-sc8, hcd-sc5, hcd-sc6, hcd-sc8 service manual
Model
DAV-SC5 DAV-SC6 DAV-SC8 HCD-SC5 HCD-SC6 HCD-SC8
Pages
124
Size
11.68 MB
Type
PDF
Document
Service Manual
Brand
Device
Audio
File
dav-sc5-dav-sc6-dav-sc8-hcd-sc5-hcd-sc6-hcd-sc8.pdf
Date

Read Sony DAV-SC5 / DAV-SC6 / DAV-SC8 / HCD-SC5 / HCD-SC6 / HCD-SC8 Service Manual online

HCD-SC5/SC6/SC8
AEP Model
UK Model
E Model
HCD-SC5/SC6/SC8
Australian Model
HCD-SC6/SC8
SERVICE MANUAL
SACD/DVD RECEIVER
Sony Corporation
Audio Group
Published by Sony Engineering Corporation
9-961-137-05
2004J16-1
© 2004.10
HCD-SC5/SC6/SC8 are the amplifier, DVD/
SACD and tuner section in DAV-SC5/SC6/SC8.
Ver. 1.4  2004. 10
SPECIFICATIONS
Model Name Using Similar Mechanism
NEW
Mechanism Type
CDM80-DVBU24
Optical Pick-up Name
DBU-1
OUT):
Voltage: 1 V
Impedance: 1 kilohm
Phones
Accepts low-and high-
impedance headphones.
Super Audio CD/DVD system
Laser
Semiconductor laser
(Super Audio CD/DVD:
λ
= 650 nm)
(CD: 
λ = 780 nm)
Emission duration: 
continuous
Signal format system
NTSC or NTSC/PAL
Frequency response (at 2 CH STEREO mode)
DVD (PCM): 2 Hz to 22 
kHz (
±1.0 dB)
CD: 2 Hz to 20 kHz (
±1.0 
dB)
Harmonic distortion
Less than 0.03 %
Outputs
VIDEO 1 (AUDIO 
VIDEO 1:
Sensitivity: 150 mV
Impedance: 50 kilohms
VIDEO 2:
Sensitivity: 300 mV
Impedance: 50 kilohms
(Other models)
Tuner section
System
PLL quartz-locked digital 
synthesizer system
FM tuner section
Tuning range
87.5 – 108.0 MHz (50 kHz 
step)
Aerial
FM wire aerial
Aerial terminals
75 ohms, unbalanced
Intermediate frequency
10.7 MHz
AM tuner section
Aerial
AM loop aerial
Intermediate frequency
450 kHz
Vi
(AEP, UK and Russian models)
deo section (VIDEO 1, 2, EURO AV)
Inputs
Video: 1 Vp-p 75 ohms
Outputs
Video: 1 Vp-p 75 ohms
Amplifier section
Stereo mode
90 W + 90 W (4 ohms at
1 kHz, THD 10 %)
Surround mode
Front: 
90
 W + 
90
 W
100 W + 100 W (4 ohms
at 1 kHz, THD 10 %)
(HCD-SC6/SC8)
100 W + 100 W (4 ohms
at 1 kHz, THD 10 %)
(HCD-SC6/SC8)
(HCD-SC5)
(HCD-SC5)
(HCD-SC5)
(HCD-SC5)
100 W + 100 W
(HCD-SC6/SC8)
Centre*: 
90
 W
(HCD-SC6/SC8)
(HCD-SC5/SC6)
100 W
Surround*: 
90
 W + 
90
(4 ohms at 1 kHz, THD 
10 %) 
* Depending on the sound field settings and the source, 
there may be no sound output.
Inputs
VIDEO 1/VIDEO 2/TV:
Sensitivity: 150 mV
Impedance: 50 kilohms
(AEP, UK and Russian
models)
Subwoofer*: 
100
(4 ohms at 100 Hz, THD 
10 %)
Tuning range
AEP, UK, Russian, Australian, Singapore and 
Middle Easten models:     531 – 1,602 kHz (with the
                                         interval set at 9 kHz)
Video section (Other models)
Inputs Video: 
1 Vp-p 75 ohms
Outputs Video: 
1 Vp-p 75 ohms
S video:
Y: 1 Vp-p 75 ohms
C: 0.286 Vp-p 75 ohms
COMPONENT:
Y: 1 Vp-p 75 ohms
P
B
/C
B
, P
R
/C
R
: 0.7 Vp-p
75 ohms
General
Power requirements
European models: 
230 V AC, 50/60 Hz
Australian and Asian models:
220 – 240 V AC, 50/60 Hz
Taiwan models:
120 V AC, 50/60 Hz
Other models: 
110 – 120 V AC, 50/60 Hz
Dimensions (approx.) 
380 
× 60 × 337 mm (w/h/d)
incl. projecting parts
Mass (approx.) 
4.2 kg
Operating temperature 
5
°C to 35°C (41°F to 95°F)
Operating humidity 
5 % to 90 %
Other models:                   531 – 1,602 kHz (with the
                                         interval set at 9 kHz)
                                         530 – 1,710 kHz (with the
                                         interval set at 10 kHz)
Design and specification are subject to change without
notice.
PHOTO: HCD-SC5
2
HCD-SC5/SC6/SC8
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous
radiation exposure.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
 damaged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of soldering iron around 270˚C
during repairing.
• Do not touch the soldering iron on the same conductor of the
 circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
 or unsoldering.
Laser component in this product is capable of emitting radiation
exceeding the limit for Class 1.
This appliance is classified as
a CLASS 1 LASER product.
The CLASS 1 LASER
PRODUCT MARKING is
located on the rear exterior.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 
0
 OR DOTTED LINE WITH
MARK 
0
 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS
LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE
COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS
APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS
PUBLISHED BY SONY.
Unleaded solder
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)
 : LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40°C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350°C.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow) than
ordinary solder so use caution not to let solder bridges occur such
as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
3
HCD-SC5/SC6/SC8
TABLE OF CONTENTS
1. SERVICING NOTES
······················································· 4
2. GENERAL
·········································································· 5
3. DISASSEMBLY
································································ 9
3-1. FRONT PANEL SECTION,
SIDE PANEL (L/R) SECTION ··································· 10
3-2. DDCON BOARD, FL BOARD ··································· 11
3-3. PLAY BUTTON, SLOT DISC ···································· 11
3-4. POWER BOARD ························································· 12
3-5. I/O BOARD ································································· 12
3-6. SCART BOARD, DVD BOARD ································· 13
3-7. AMP BOARD ······························································ 13
3-8. CD MECHANISM DECK (CDM80-DVBU24) ········· 14
3-9. CHASSIS (TOP) ·························································· 14
3-10. LEVER (LOADING R/L) ·········································· 15
3-11. DISC STOP LEVER, DISC SENSOR LEVER ········· 16
3-12. DRIVER BOARD ······················································ 16
3-13. RF BOARD ································································ 17
3-14. OPTICAL PICK-UP (TDP022W) ····························· 17
3-15. BASE UNIT ······························································· 18
3-16. LEVER (BU LOCK) ·················································· 18
3-17. CLOSE LEVER ························································· 19
3-18. DIR LEVER, GEAR (IDL-B) ···································· 19
3-19. GEAR (IDL-C) ·························································· 20
4. TEST MODE
···································································· 21
5. ELECTRICAL ADJUSTMENT
·································· 29
6. DIAGRAMS
6-1. CIRCUIT BOARDS LOCATION ······························· 30
6-2. BLOCK DIAGRAMS – RF/SERVO SECTION – ······ 32
– AUDIO (DSP) SECTION – ······································ 33
– AUDIO OUT SECTION – ······································· 34
– VIDEO SECTION – ················································· 35
– POWER SUPPLY SECTION – ································ 36
6-3. PRINTED WIRING BOARD – RF SECTION – ········ 37
6-4. SCHEMATIC DIAGRAM – RF SECTION – ············· 38
6-5. PRINTED WIRING BOARD
– DRIVER SECTION – ·············································· 39
6-6. SCHEMATIC DIAGRAM
– DRIVER SECTION – ·············································· 39
6-7. PRINTED WIRING BOARD
– DVD SECTION (SIDE A) – ···································· 40
6-8. PRINTED WIRING BOARD
– DVD SECTION (SIDE B) – ···································· 41
6-9. SCHEMATIC DIAGRAM
– DVD SECTION (1/10) – ·········································· 42
6-10. SCHEMATIC DIAGRAM
– DVD SECTION (2/10) – ·········································· 43
6-11. SCHEMATIC DIAGRAM
– DVD SECTION (3/10) – ·········································· 44
6-12. SCHEMATIC DIAGRAM
– DVD SECTION (4/10) – ·········································· 45
6-13. SCHEMATIC DIAGRAM
– DVD SECTION (5/10) – ·········································· 46
6-14. SCHEMATIC DIAGRAM
– DVD SECTION (6/10) – ·········································· 47
6-15. SCHEMATIC DIAGRAM
– DVD SECTION (7/10) – ·········································· 48
6-16. SCHEMATIC DIAGRAM
– DVD SECTION (8/10) – ·········································· 49
6-17. SCHEMATIC DIAGRAM
– DVD SECTION (9/10) – ·········································· 50
6-18. SCHEMATIC DIAGRAM
– DVD SECTION (10/10) – ········································ 51
6-19. PRINTED WIRING BOARD
– AMP SECTION (SIDE A) – ···································· 52
6-20. PRINTED WIRING BOARD
– AMP SECTION (SIDE B) – ···································· 53
6-21. SCHEMATIC DIAGRAM
– AMP SECTION (1/2) – ············································ 54
6-22. SCHEMATIC DIAGRAM
– AMP SECTION (2/2) – ············································ 55
6-23. PRINTED WIRING BOARD
– I/O SECTION – ························································ 56
6-24. SCHEMATIC DIAGRAM
– I/O SECTION (1/2) – ··············································· 57
6-25. SCHEMATIC DIAGRAM
– I/O SECTION (2/2) – ··············································· 58
6-26. PRINTED WIRING BOARD
– FRONT PANEL SECTION – ··································· 59
6-27. SCHEMATIC DIAGRAM
– FRONT PANEL SECTION – ··································· 60
6-28. PRINTED WIRING BOARD
– POWER SECTION – ··············································· 61
6-29. SCHEMATIC DIAGRAM
– POWER SECTION – ··············································· 62
6-30. IC BLOCK DIAGRAMS ············································ 65
6-31. IC PIN FUNCTION DESCRIPTION ························· 73
7. EXPLODED VIEWS
7-1. CASE SECTION ························································· 94
7-2. FRONT PANEL SECTION ········································· 95
7-3. CHASSIS SECTION-1 ··············································· 96
7-4. CHASSIS SECTION-2 ··············································· 97
7-5. CHASSIS SECTION-3 ··············································· 98
7-6. MECHANISM DECK SECTION-1
(CDM80-DVBU24) ····················································· 99
7-7. MECHANISM DECK SECTION-2
(CDM80-DVBU24) ··················································· 100
7-8. MECHANISM DECK SECTION-3
(CDM80-DVBU24) ··················································· 101
7-9. BASE UNIT SECTION ············································ 102
8. ELECTRICAL PARTS LIST
····································· 103
4
HCD-SC5/SC6/SC8
NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK
OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
NOTES ON DVD BOARD EXCHANGE
If a DVD board is exchanged, “DRIVE AUTO ADJUSTMENT”
may be unable to be performed. In this case, initialize a memory in
the following procedure.
1. Starting Test  Mode (see page 22).
2. Press the 2  button of remote commander to set the Drive
Manual Operation (see page 24).
3. Press the 6 button of remote commander to set the Memory
Check (see page 26).
4. Press the [CLEAR] button of remote commander to initialize
a memory.
JIG ON REPAIRING
Please use the following extension cables at the time of repair of
this set.
• Part No. J-2501-103-A (29P)
DVD board CN401 — RF board CN002
• Part No. J-2501-231-A (15P)
DVD board CN004 — AMP board CN003
• Part No. J-2501-242-A (11P)
DVD board CN001 — AMP board CN304
MODEL IDENTIFICATION
— BACK PANEL —
Part No.
Model
SC5:AEP,UK/SC6:AEP,UK
SC5:EA/SC6:EA
SC5:SP,HK,KR,TW/SC6:SP,KR
SC5:E32/SC6:AUS
SC8:AEP,UK
SC8:EA
SC8:SP,HK,KR,TW
SC8:E32,MX,AUS
SC5:RU/SC6:RU
SC8:RU
PARTS No.
4-248-563-0s
4-248-563-1s
4-248-563-2s
4-248-563-3s
4-248-563-5s
4-248-563-6s
4-248-563-7s
4-248-563-8s
4-250-335-1s
4-250-335-2s
SECTION 1
SERVICING NOTES
POWER board
AEP and UK models should exchange
for POWER SWITCHING (1-468-790-13) .
These do not correspond with  DIAGRAMS 
and ELECTRICAL PARTS LIST .
LF board
• Abbreviation
AUS
: Australian model
E32
: 110-240V AC area in E model
EA
: Saudi Arabia model
HK
: Hong Kong model
KR
: Korean model
MX
: Mexican model
RU
: Russian model
SP
: Singapore model
TW
: Taiwan model
USE OF POWER SWITCHING
Ver. 1.4
AEP
UK
SERIAL NUMBER
70sssss
76sssss
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