Read Sony DAV-LF1 / HCD-LF1 Service Manual online
SERVICE MANUAL
Sony Corporation
Home Audio Division
Published by Sony Techno Create Corporation
Published by Sony Techno Create Corporation
US Model
Canadian Model
AEP Model
UK Model
E Model
Australian Model
SUPER AUDIO CD/DVD PLAYER
9-879-139-03
2005I16-1
© 2006.09
© 2006.09
Ver 1.2 2006.09
SPECIFICATIONS
HCD-LF1
• HCD-LF1 is DVD/CD DECK system in DAV-LF1.
Model Name Using Similar Mechanism
NEW
Mechanism Type
CDM80AT-DVBU29T
Optical Pick-up Name
DBU-3
* Manufactured under license from Dolby Laboratories.
“Dolby”, “Pro Logic”, and the double-D symbol are trademarks
of Dolby Laboratories.
of Dolby Laboratories.
**Manufactured under license from Digital Theater Systems, Inc.
“DTS”, “DTS-ES”, and “DTS Digital Surround” are trademarks
of Digital Theater Systems, Inc.
of Digital Theater Systems, Inc.
Super Audio CD/DVD system
Laser
Semiconductor
laser
(Super Audio CD/DVD:
λ
= 650 nm)
(CD:
(CD:
λ = 780 nm)
Emission duration:
continuous
continuous
Signal format system
North America,
Latin America:
North America,
Latin America:
NTSC
Other regions:
NTSC, PAL
Frequency response (at 2 CH STEREO mode)
DVD (PCM): 2 Hz to 22
kHz (
kHz (
±1.0 dB)
CD: 2 Hz to 20 kHz (
±1.0
dB)
Harmonic distortion
Less than 0.03 %
Dimensions (approx.)
568
× 200 × 120 mm
(22
3
/
8
× 7
7
/
8
× 4
3
/
4
inches) (w/h/d) incl.
projecting parts
projecting parts
Mass (approx.)
4.7 kg (10 lb 6 oz)
Design and specifications are subject to change
without notice.
without notice.
2
HCD-LF1
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270 °C
during repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350
°C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscou-s (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
also be added to ordinary solder.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK
0
OR DOTTED LINE
WITH MARK
0
ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ!
LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE
0
SUR
LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES
PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE
FONCTIONNEMENT. NE REMPLACER CES COM- POSANTS
QUE PAR DES PIÈCES SONY DONT LES NUMÉROS SONT
DONNÉS DANS CE MANUEL OU DANS LES SUPPLÉMENTS
PUBLIÉS PAR SONY.
PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE
FONCTIONNEMENT. NE REMPLACER CES COM- POSANTS
QUE PAR DES PIÈCES SONY DONT LES NUMÉROS SONT
DONNÉS DANS CE MANUEL OU DANS LES SUPPLÉMENTS
PUBLIÉS PAR SONY.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radiation
exposure.
other than those specified herein may result in hazardous radiation
exposure.
Laser component in this product is capable of emitting radiation
exceeding the limit for Class 1.
exceeding the limit for Class 1.
This appliance is classified as a
CLASS 1 LASER product.
The CLASS 1 LASER
PRODUCT MARKING is
located on the rear exterior.
CLASS 1 LASER product.
The CLASS 1 LASER
PRODUCT MARKING is
located on the rear exterior.
DVD player :
HCD-LF1
HCD-LF1
DVD player : HCD-LF1
Sub woofer :
SA-WSLF1
SA-WSLF1
Sub woofer : SA-WSLF1
Front speaker :
SS-TSLF1(R)
SS-TSLF1L(L)
SS-TSLF1(R)
SS-TSLF1L(L)
Front speaker : SS-TSLF1(R)
SS-TSLF1L(L)
Center speaker :
SS-CTLF1
SS-CTLF1
Center speaker :
SS-CTLF1
SS-CTLF1
Surround speaker :
SS-TSLF1W(R)
SA-TSLF1(L)
SS-TSLF1W(R)
SA-TSLF1(L)
Surround speaker : SS-TSLF1W(R)
SA-TSLF1(L)
Remote
commander :
RM-SP320
commander :
RM-SP320
Remote commander :
RM-SP320
RM-SP320
Units required for
operation
check
Unit.
need to
checking
need to
checking
a
a
a
a
a
a
a
a
a
a
a
a
a
a
a
a
a
*
1
*
1
*
2
*
1 Only the defective unit.
*
2 Either one of them.
Units with
a
mark: The units that are required for the system operation check during repair service
However, there can be a case that some units of the system need to not be brought into repair shop depending on the unit. that became defective.
• The units that are required for the system operation check during repair service
3
HCD-LF1
TABLE OF CONTENTS
1.
SERVICING NOTES
................................................
4
2.
GENERAL
...................................................................
8
3.
DISASSEMBLY
3-1.
Disassembly Flow ........................................................... 10
3-2.
Stand Section ................................................................... 11
3-3.
Cover (MAIN/CDM) ....................................................... 11
3-4.
Chassis Section ................................................................ 12
3-5.
DLED Board .................................................................... 12
3-6.
STBY KEY Board, EJECT KEY Board ......................... 13
3-7.
Mechanism Deck (CDM80AT-DVBU29T) ..................... 13
3-8.
DMB07 Board ................................................................. 14
3-9.
DISPLAY Board .............................................................. 14
3-10. I/O Board ......................................................................... 15
3-11. DVD-POW Board ............................................................ 15
3-12. Chassis (Top) ................................................................... 16
3-13. Lever (Loading R/L) ........................................................ 17
3-14. Disc Stop Lever, Disc Sensor Lever ................................ 18
3-15. DRIVER Board ............................................................... 18
3-16. RF Board ......................................................................... 19
3-17. Optical Pick-up (DBU-3) ................................................ 19
3-18. Base Unit ......................................................................... 20
3-19. Lever (BU Lock) ............................................................. 20
3-20. Close Lever ...................................................................... 21
3-21. DIR Lever, Gear (IDL-B) ................................................ 21
3-22. Gear (IDL-C) ................................................................... 22
3-11. DVD-POW Board ............................................................ 15
3-12. Chassis (Top) ................................................................... 16
3-13. Lever (Loading R/L) ........................................................ 17
3-14. Disc Stop Lever, Disc Sensor Lever ................................ 18
3-15. DRIVER Board ............................................................... 18
3-16. RF Board ......................................................................... 19
3-17. Optical Pick-up (DBU-3) ................................................ 19
3-18. Base Unit ......................................................................... 20
3-19. Lever (BU Lock) ............................................................. 20
3-20. Close Lever ...................................................................... 21
3-21. DIR Lever, Gear (IDL-B) ................................................ 21
3-22. Gear (IDL-C) ................................................................... 22
4.
TEST MODE
............................................................... 23
5.
ELECTRICAL ADJUSTMENTS
.......................... 32
6.
DIAGRAMS
6-1.
Block Diagram
— RF SERVO Section — ................... 34
— DVD DSP Section — ................................................. 35
— AUDIO Section — ...................................................... 36
— MAIN Section — ....................................................... 37
— AUDIO Section — ...................................................... 36
— MAIN Section — ....................................................... 37
6-2.
Printed Wiring Board — RF Section — ......................... 38
6-3.
Schematic Diagram — RF Section — ........................... 39
6-4.
Printed Wiring Board — DRIVER Section — ............... 40
6-5.
Schematic Diagram — DRIVER Section — ................. 40
6-6.
Printed Wiring Board — DMB07 Section (Side A) — .. 41
6-7.
Printed Wiring Board — DMB07 Section (Side B) — .. 42
6-8.
Schematic Diagram — DMB07 Section (1/10) — ........ 43
6-9.
Schematic Diagram — DMB07 Section (2/10) — ........ 44
6-10. Schematic Diagram — DMB07 Section (3/10) — ........ 45
6-11. Schematic Diagram — DMB07 Section (4/10) — ........ 46
6-12. Schematic Diagram — DMB07 Section (5/10) — ........ 47
6-13. Schematic Diagram — DMB07 Section (6/10) — ........ 48
6-14. Schematic Diagram — DMB07 Section (7/10) — ........ 49
6-15. Schematic Diagram — DMB07 Section (8/10) — ........ 50
6-16. Schematic Diagram — DMB07 Section (9/10) — ........ 51
6-17. Schematic Diagram — DMB07 Section (10/10) — ...... 52
6-18. Printed Wiring Board — DVD-POW Section — ........... 53
6-19. Schematic Diagram — DVD-POW Section (1/2) — ..... 54
6-20. Schematic Diagram — DVD-POW Section (2/2) — ..... 55
6-21. Printed Wiring Board — DISPLAY Section — ............. 56
6-22. Schematic Diagram — DISPLAY Section — ................ 57
6-23. Printed Wiring Board — TOUCH KEY Section — ....... 58
6-24. Schematic Diagram — TOUCH KEY Section — ......... 59
6-25. Printed Wiring Board — I/O Section — ........................ 60
6-26. Schematic Diagram — I/O Section — ........................... 61
6-11. Schematic Diagram — DMB07 Section (4/10) — ........ 46
6-12. Schematic Diagram — DMB07 Section (5/10) — ........ 47
6-13. Schematic Diagram — DMB07 Section (6/10) — ........ 48
6-14. Schematic Diagram — DMB07 Section (7/10) — ........ 49
6-15. Schematic Diagram — DMB07 Section (8/10) — ........ 50
6-16. Schematic Diagram — DMB07 Section (9/10) — ........ 51
6-17. Schematic Diagram — DMB07 Section (10/10) — ...... 52
6-18. Printed Wiring Board — DVD-POW Section — ........... 53
6-19. Schematic Diagram — DVD-POW Section (1/2) — ..... 54
6-20. Schematic Diagram — DVD-POW Section (2/2) — ..... 55
6-21. Printed Wiring Board — DISPLAY Section — ............. 56
6-22. Schematic Diagram — DISPLAY Section — ................ 57
6-23. Printed Wiring Board — TOUCH KEY Section — ....... 58
6-24. Schematic Diagram — TOUCH KEY Section — ......... 59
6-25. Printed Wiring Board — I/O Section — ........................ 60
6-26. Schematic Diagram — I/O Section — ........................... 61
7.
EXPLODED VIEWS
7-1.
Stand Section ................................................................... 84
7-2.
Main Section .................................................................... 85
7-3.
Chassis Section ................................................................ 86
7-4.
Mechanism Deck Section-1 (CDM80AT-DVBU29T) .... 87
7-5.
Mechanism Deck Section-2 (CDM80AT-DVBU29T) .... 88
7-6.
Mechanism Deck Section-3 (CDM80AT-DVBU29T) .... 89
7-7.
Base Unit Section ............................................................ 90
8.
ELECTRICAL PARTS LIST
.................................. 91
4
HCD-LF1
SECTION 1
SERVICING NOTES
NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK
OR BASE UNIT
OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
LASER DIODE AND FOCUS SEARCH OPERATION
CHECK
CHECK
Carry out the “S curve check” in “CD section adjustment” and check
that the S curve waveform is output several times.
that the S curve waveform is output several times.
NOTE 1:
Regarding the notification symbol “R”
Because the number of the operating buttons of this product
are limited, some operations require use of the operating
buttons of the remote commander (RM-SP320 supplied with
the product). When a specific operation requires use of the
operating buttons of the remote commander (RM-SP320), “R”
is added to the specific operating procedure in this manual.
Example MENU/NO “R” The MENU/NO button of remote
commander.
Because the number of the operating buttons of this product
are limited, some operations require use of the operating
buttons of the remote commander (RM-SP320 supplied with
the product). When a specific operation requires use of the
operating buttons of the remote commander (RM-SP320), “R”
is added to the specific operating procedure in this manual.
Example MENU/NO “R” The MENU/NO button of remote
commander.
NOTE 2:
Incorrect operations may be performed if the test mode is not
entered properly.
In this case, press the ?/1 button to turn the power off, and
retry to enter the test mode.
entered properly.
In this case, press the ?/1 button to turn the power off, and
retry to enter the test mode.
DISC TRAY LOCK
The disc tray lock function for the antitheft of an demonstration
disc in the store is equipped.
Procedure :
disc in the store is equipped.
Procedure :
1. Press the ?/1 button to turn the set on.
2. Press the FUNCTION “R” button or touch the FUNCTION
2. Press the FUNCTION “R” button or touch the FUNCTION
button to set DVD function.
3. Insert a disc.
4. While the power is ON (excluding the mode of Power-ON
4. While the power is ON (excluding the mode of Power-ON
Animation mode), touch the
x
Sensor (on Touch Panel) and
press the A button simultaneously for several seconds.
5. The “Locked” display appears for a while and disc cannot be
removed any more even if the A button is pressed.
* To release this mode, repeat the above operation. The
“Unlocked” display appears and the Disc Tray Lock mode is
canceled.
canceled.
Note:
When “LOCKED” is displayed, the slot lock is not released by
turning power on/off with the ?/1 button.
turning power on/off with the ?/1 button.
NOTE OF REPLACING THE DMB07 BOARD
When replacing the DMB07 board, since the adjustment value is
not set up correctly, “Drive Auto Adjustment” can’t be performed.
In this case, initialize Memory in the following procedures.
not set up correctly, “Drive Auto Adjustment” can’t be performed.
In this case, initialize Memory in the following procedures.
Procedure:
1. Set the test mode. (See page 25)
2. Press the [2] key of the remote commander, and set the “DRIVE
2. Press the [2] key of the remote commander, and set the “DRIVE
MANUAL OPERATION”. (See page 27)
3. Press the [6] key of the remote commander, and set the “2-6,
Memory Check”. (See page 29)
4. Press the [CLEAR] key of the remote commander, and initialize
Memory.