Read Sony DAV-IS50 / SA-WSIS50 Service Manual online
3
SA-WSIS50
SECTION 1
SERVICING NOTES
BEGIN IT BEFORE THE REPAIR
When the SA-WSIS50 is checked, connect to HCD-IS50 (for
DVD receiver of DAV-IS50). Be sure in advance the HCD-IS50
is prepared.
When the SA-WSIS50 is checked, connect to HCD-IS50 (for
DVD receiver of DAV-IS50). Be sure in advance the HCD-IS50
is prepared.
NOTE OF WHEN OUTPUT IS CONFIRMED (SS-IS15)
To connect with SA-WSIS50 and to use it, SS-IS15 is designed.
Therefore, when it connects with an usual amplifi er and the audio
signal of an excessive low-frequency (800 Hz or less) is input, there
is a possibility that the speaker breaks.
When you confi rm the output with large audio signal input, connect
SA-WSIS50 with SS-IS15.
To connect with SA-WSIS50 and to use it, SS-IS15 is designed.
Therefore, when it connects with an usual amplifi er and the audio
signal of an excessive low-frequency (800 Hz or less) is input, there
is a possibility that the speaker breaks.
When you confi rm the output with large audio signal input, connect
SA-WSIS50 with SS-IS15.
NOTE OF REPLACING THE EEPROM (IC1009) ON DSP
BOARD
When you replace EEPROM (IC1009), connect HCD-IS50 and
SA-WSIS50 and execute “Cold reset” (See page 24 of HCD-IS50
Service Manual) and “Execute Initialize Setup Data” (See page 27
of HCD-IS50 Service Manual).
BOARD
When you replace EEPROM (IC1009), connect HCD-IS50 and
SA-WSIS50 and execute “Cold reset” (See page 24 of HCD-IS50
Service Manual) and “Execute Initialize Setup Data” (See page 27
of HCD-IS50 Service Manual).
MODEL IDENTIFICATION
– Model number label –
Part No.
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
:
LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350
°C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscous (sticky, less prone to fl ow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
MODEL
PART
No.
US and Canadian models
3-296-031-0[]
AEP and UK models
3-296-033-0[]
Russian model
3-296-034-0[]
Singapore model
3-296-035-0[]
Thai model
3-296-036-0[]
Australian model
3-296-038-0[]
Argentina model
3-296-041-0[]
Latin America models except Argentina
3-300-366-0[]
Saudi Arabia model
3-878-309-0[]
Ver. 1.1
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