Read Sony DAV-HDZ273 / HCD-HDZ273 Service Manual online
HCD-HDZ273
HCD-HDZ273
25
25
• Waveforms
– MAIN Board –
– MAIN Board –
• Circuit Boards Location
– I/O Board –
SECTION 6
DIAGRAMS
For Schematic Diagrams.
Note:
• All capacitors are in
• All capacitors are in
μF unless otherwise noted. (p: pF)
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in
Ω and
1
/
4
W or less unless otherwise
specifi ed.
•
f :
internal
component.
•
C : panel designation.
THIS NOTE IS COMMON FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS.
(In addition to this, the necessary note is printed in each block.)
(In addition to this, the necessary note is printed in each block.)
•
A : B+ Line.
•
B : B– Line.
• Voltages and waveforms are dc with respect to ground
under no-signal (detuned) conditions.
• Voltages and waveforms are dc with respect to ground in
service mode.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal production
Voltage variations may be noted due to normal production
tolerances.
no mark : TUNER (FM)
<
<
> : DVD PLAY
*
: Impossible to measure
• Voltages are taken with VOM (Input impedance 10 M
Ω).
• Circled numbers refer to waveforms.
• Signal path.
F :
TUNER
J
: DVD PLAY
L :
VIDEO
E :
Y
a :
CHROMA
r : COMPONENT VIDEO
For Printed Wiring Boards.
Note:
•
•
X : Parts extracted from the component side.
•
a
:
Through
hole.
•
: Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
• Indication of transistor.
C E
B
These are omitted.
Caution:
Pattern face side:
(SIDE B)
Parts face side:
(SIDE A)
Pattern face side:
(SIDE B)
Parts face side:
(SIDE A)
Parts on the pattern face side seen from
the pattern face are indicated.
Parts on the parts face side seen from
the parts face are indicated.
the pattern face are indicated.
Parts on the parts face side seen from
the parts face are indicated.
Note: The components identifi ed by mark
0 or dotted
line with mark
0 are critical for safety.
Replace only with part number specifi ed.
SPEAKER board
I/O board
MAIN board
POWER board
MS-203 board
P-SW board
FL board
JACK board
C
B
This is omitted.
E
Q
IC1101
(DVDRFIP)
200 mV/DIV, 100 ns/DIV
IC1101
[
Y (R/Cr/Pr)
500 mV/DIV, 20
μs/DIV
IC1101
[
D (B/Cb/Pb)
500 mV/DIV, 20
μs/DIV
IC1101
[
C (Y/G)
1 V/DIV, 20
μs/DIV
IC1101
[
(C)
1 V/DIV, 20
μs/DIV
IC1101
[[ (Y)
1 V/DIV, 20
μs/DIV
IC1101
YD
(XTALO)
500 mV/DIV, 20 ns/DIV
IC501
RE (Xout)
1 V/DIV, 100 ns/DIV
IC702
XB (XOUT (O))
1 V/DIV, 20 ns/DIV
IC3010
RG (XFSOOUT)
1 V/DIV, 10 ns/DIV
RB
IC3010
SL (XFSOIN)
1 V/DIV, 10 ns/DIV
RT
IC3051
(3Y)
1 V/DIV, 10 ns/DIV
0.72Vp-p
0.72Vp-p
H
1Vp-p
H
1Vp-p
H
H
1Vp-p
4.3Vp-p
49.1MHz
1.6Vp-p
27MHz
4.3Vp-p
49.1MHz
4.3Vp-p
49.1MHz
3.4Vp-p
4Vp-p
5MHz
12.288MHz
650mVp-p
H
IC404
RI (Cr OUT)
500 mV/DIV, 20
μs/DIV
IC404
RL (Cb OUT)
500 mV/DIV, 20
μs/DIV
IC404
X (CY OUT)
500 mV/DIV, 20
μs/DIV
H
1Vp-p
1Vp-p
H
1Vp-p
H
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