DAV-FX1000W, DAV-FX999W, HCD-FX1000W, HCD-FX999W - Sony Audio Service Manual (repair manual)

E Model

HCD-FX999W/FX1000W

Australian Model

HCD-FX999W

2005L16-1
© 2005.12

HCD-FX999W/FX1000W are the amplifier, DVD/CD
and tuner section in DAV-FX999W/FX1000W.

— Continued on next page —

Model Name Using Similar Mechanism

NEW

Mechanism Type

CDM69EH-DVBU101

Optical Pick-up Name

KHM-310CAB/C2NP

This system incorporates with Dolby*1 Digital and
Dolby Pro Logic (II) adaptive matrix surround decoder
and the DTS*2 Digital Surround System.

*1 Manufactured under license from Dolby Laboratories.

“Dolby,” “Pro Logic,” and the double-D symbol are trademarks
of Dolby Laboratories.

*2 Manufactured under license from Digital Theater Systems, Inc.

“DTS” and “DTS Digital Surround” are trademarks of Digital
Theater Systems, Inc.

Central and South American models:
Stereo mode (rated)

55 W + 55 W (3 ohms at 1 
kHz, DIN)

Surround mode (reference)  music power output

Front: 120 W + 120 W
(with SS-TS47)
Center*: 120 W
(with SS-CT46)
Surround*: 120 W + 120 W
(with SS-TS46B)
Subwoofer*: 240 W
(with SS-WS43)

Mexican and other models:
Stereo mode (rated)

55 W + 55 W (3 ohms at 1 
kHz, DIN)

Surround mode (reference)  music power output

Front: 143 W + 143 W
(with SS-TS47)
Center*: 143 W
(with SS-CT46)
Surround*: 143 W + 143 W
(with SS-TS46B)
Subwoofer*: 285 W
(with SS-WS43)

Inputs (Analog)

VIDEO, 

SAT

Sensitivity: VIDEO 250 
mV/SAT 450 mV
Impedance: 50 kilohms

Input (Digital)
SAT (Optical)

Impedance: 

–

Phones

Accepts low-and high-
impedance headphones.

MIC

Sensitivity: 1 mV
Impedance: 10 kilohms

Laser

 Semiconductor 

laser

(Super Audio CD/DVD:   
= 650 nm)
(CD:   = 790 nm)
Emission duration: 
continuous

Signal format system

NTSC/PAL

Frequency response (at 2 CH STEREO mode)

DVD (PCM): 2 Hz to 22 
kHz (

±1.0 dB)

CD: 2 Hz to 20 kHz (

±1.0 

dB)

Harmonic distortion

Less than 0.03 %

System

PLL quartz-locked digital 
synthesizer system

FM tuner section
Tuning range

87.5 – 108.0 MHz (50 kHz 
step)

Antenna (aerial)

FM wire antenna (aerial)

Antenna (aerial) terminals 75 ohms, unbalanced
Intermediate frequency

10.7 MHz

AM tuner section
Tuning range
Middle Eastern models:

531 – 1,602 kHz (with the 
interval set at 9 kHz)

Mexican model:

530 – 1,710 kHz (with the 
interval set at 10 kHz)
531 – 1,710 kHz (with the 
interval set at 9 kHz)

Other models:

531 – 1,602 kHz (with the 
interval set at 9 kHz)
530 – 1,710 kHz (with the 
interval set at 10 kHz)

Antenna (aerial)

AM loop antenna (aerial)

Intermediate frequency

450 kHz

λ

λ

Photo : HCD-FX999W

2

Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radiation
exposure.

Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with

the lead free mark due to their particular size)

Unleaded solder has the following characteristics.

• Unleaded solder melts at a temperature about 40 °C higher

than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 

°C.

Caution: The printed pattern (copper foil) may peel away if

the heated tip is applied for too long, so be careful!

• Strong viscosity

Unleaded solder is more viscou-s (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.

• Usable with ordinary solder

It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.

• Never reuse a disconnected chip component.

• Notice that the minus side of a tantalum capacitor may be

damaged by heat.

• Keep the temperature of the soldering iron around 270 °C

during repairing.

• Do not touch the soldering iron on the same conductor of the

circuit board (within 3 times).

• Be careful not to apply force on the conductor when soldering

or unsoldering.

0

0

Laser component in this product is capable of emitting radiation
exceeding the limit for Class 1.

This appliance is classified as
a CLASS 1 LASER product.
The CLASS 1 LASER
PRODUCT MARKING is
located on the bottom exterior.

Parts No.

FX999W: E3 model

2-588-162-0

[]

FX999W: SP, TW models

2-588-162-1

[]

FX999W: MX, E32, AUS models

2-588-162-2

[]

FX999W: E13 model

2-588-162-3

[]

FX1000W: KR model

2-588-163-0

[]

• Abbreviation

AUS

: Australian model

E3

: 240V AC area in E model

E13

: 220-230V AC area in E model

E32

: 110-240V AC area in E model

KR

: Korean model

MX

: Mexican model

SP

: Singapore model

TW

: Taiwan model

Power requirements

Mexican model:

120 V AC

Taiwan model:

120 V AC, 50/60 Hz

Korean model:

220 V AC, 60 Hz

, 60 Hz

Central/South American models:

110 – 240 V AC, 50/60 Hz 

Other models:

220 – 240 V AC, 50/60 Hz 

Power consumption

On: 130 W
Standby: 0.3 W (at the 
Power Saving mode) 

Dimensions (approx.)

445   70   375 mm (w/h/d) 
incl. projecting parts

Mass (approx.)

5.1 kg

Design and specifications are subject to change 
without notice.

Outputs

Video: 1 Vp-p 75 ohms
S video:
Y: 1 Vp-p 75 ohms
C: 0.286 Vp-p 75 ohms
COMPONENT:
Y: 1 Vp-p 75 ohms

P

B

/C

B

, P

R

/C

R

: 0.7 Vp-p 

75 ohms

Input

V

HDMI OUT: Type A (19 pin)
(HCD-FX1000W only)

IDEO, SAT: 1 Vp-p 75 

ohms

 

×   × 

3

...................................................

4

...................................................................

5

3-1.

Disassembly Flow ...........................................................

7

3-2.

Top Panel Sub Assy .........................................................

8

3-3.

Front Panel Assy ..............................................................

9

3-4.

I/O Board, DC Fan ..........................................................

9

3-5.

MIB01 Board, MIB01 POWER Board
(HCD-FX1000W only) .................................................... 10

3-6.

DMB10 Board, TX Board ............................................... 11

3-7.

MAIN Board, H/P Board ................................................. 12

3-8.

FL Board, KEY Board, LED Board ................................ 12

3-9.

DVD Mechanism Deck (CDM69EH-DVBU101) ........... 13

3-10. Base Unit ......................................................................... 13
3-11. Optical Pick-up (KHM-310CAB) ................................... 14
3-12. SW Board, Bracket (Top) Assy ....................................... 14
3-13. RELAY Board ................................................................. 15
3-14. Motor (Stocker) Assy (Stocker)(M761) .......................... 15
3-15. Motor (Roller) Assy (Roller)(M781) ............................... 16
3-16. Motor (Mode) Assy (Mode)(M771) ................................ 16
3-17. Rubber Roller (Slider) ASSY .......................................... 17
3-18. Timing Belt (Front/Rear) ................................................. 17
3-19. Cam (Gear) ...................................................................... 18
3-20. SENSOR Board ............................................................... 18

4-1.

How To Install The Cam (Eject Lock) ............................ 19

4-2.

How To Install The Cam (Gear) ...................................... 19

4-3.

How To Install The Gear (Mode C) ................................. 20

4-4.

How To Install The Gear (Mode Cam) ............................ 20

4-5.

How To Install The Rotary Encorder (S702),
Gear (Stocker Communication) ....................................... 21

4-6.

How To Install The Stocker Assy .................................... 21

............................................................... 22

............................ 26

7-1.

Block Diagram  – RF Section – ....................................... 30

7-2.

Block Diagram  – MIB Section – .................................... 31

7-3.

Block Diagram  – VIDEO Section – ............................... 32

7-4.

Block Diagram  – AMP Section – ................................... 33

7-5.

Block Diagram  – AUDIO Section – ............................... 34

7-6.

Block Diagram  – MAIN Section – ................................. 35

7-7.

Block Diagram  – DIAT TRANSMIT Section – ............. 36

7-8.

Printed Wiring Board – CHANGER Section – ............... 37

7-9.

Schematic Diagram  – CHANGER Section –

............. 38

7-10. Printed Wiring Board  – DMB10 Section (Side A) – ...... 39
7-11. Printed Wiring Board  – DMB10 Section (Side B) – ...... 40

7-12. Schematic Diagram  – DMB10 Section (1/4) – .............. 41
7-13. Schematic Diagram  – DMB10 Section (2/4) – .............. 42
7-14. Schematic Diagram  – DMB10 Section (3/4) – .............. 43
7-15. Schematic Diagram  – DMB10 Section (4/4) – .............. 44
7-16. Printed Wiring Board – MAIN Section (Side A) – ......... 45
7-17. Printed Wiring Board – MAIN Section (Side B) – ......... 46
7-18. Schematic Diagram  – MAIN Section (1/8) – ................. 47
7-19. Schematic Diagram  – MAIN Section (2/8) – ................. 48
7-20. Schematic Diagram  – MAIN Section (3/8) – ................. 49
7-21. Schematic Diagram  – MAIN Section (4/8) – ................. 50
7-22. Schematic Diagram  – MAIN Section (5/8) – ................. 51
7-23. Schematic Diagram  – MAIN Section (6/8) – ................. 52
7-24. Schematic Diagram  – MAIN Section (7/8) – ................. 53
7-25. Schematic Diagram  – MAIN Section (8/8) – ................. 54
7-26. Printed Wiring Board – FL/KEY Section – ..................... 55
7-27. Schematic Diagram  – FL/KEY Section – ...................... 56
7-28. Printed Wiring Board – LED / MIC Section – ................ 57
7-29. Schematic Diagram  – LED / MIC SSection – ................ 58
7-30. Printed Wiring Board – I/O Section (Side A) – ............... 59
7-31. Printed Wiring Board – I/O Section (Side B) – ............... 60
7-32. Schematic Diagram  – I/O Section – ............................... 61
7-33. Printed Wiring Board – MIB01 Section (Side A) – ......... 62
7-34. Printed Wiring Board – MIB01 Section (Side B) – ......... 63
7-35. Schematic Diagram  – MIB01 Section (1/3) – ................ 64
7-36. Schematic Diagram  – MIB01 Section (2/3)  – ............... 65
7-37. Schematic Diagram  – MIB01 Section (3/3) – ................ 66
7-38. Printed Wiring Board – MIB01 POWER Section – ........ 67
7-39. Schematic Diagram  – MIB01 POWER Section – .......... 67
7-40. Printed Wiring Board – TX Section – ............................. 68
7-41. Schematic Diagram  – TX Section – ............................... 69

8-1.

Overall Section ................................................................ 92

8-2.

Front Panel Assy Section ................................................. 93

8-3.

Chassis Section-1 ............................................................ 94

8-4.

Chassis Section-2 ............................................................ 95

8-5.

DVD Mechanism Deck Section-1
(CDM69EH-DVBU101) ................................................. 96

8-6.

DVD Mechanism Deck Section-2
(CDM69EH-DVBU101) ................................................. 97

8-7.

DVD Mechanism Deck Section-3
(CDM69EH-DVBU101) ................................................. 98

8-8.

DVD Mechanism Deck Section-4
(CDM69EH-DVBU101) ................................................. 99

8-9.

DVD Mechanism Deck Section-5
(CDM69EH-DVBU101) ................................................ 100

8-10. DVD Mechanism Deck Section-6

(CDM69EH-DVBU101) ................................................ 101

8-11. Optical Pick-up Section (KHM-310CAB) ..................... 102

................................. 103

4

The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.

The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.

Carry out the “S curve check” in “CD section adjustment” and check
that the S curve waveform is output several times.

The disc slot lock function for the antitheft of an demonstration
disc in the store is equipped.

1. Press the  ?/1  button to turn the set on.
2. Press the [FUNCTION] button to set DVD function.
3. Insert a disc.
4. Press the  

x  

stick and the  

A 

 button simultaneously for five

seconds.

5. The message “LOCKED” is displayed and the slot is locked.

1. Press the  

x  

stick and the  

A 

 button simultaneously for five

seconds again.

2. The message “UNLOCKED” is displayed and the slot is

unlocked.

When “LOCKED” is displayed, the slot lock is not released by
turning power on/off with the  ?/1  button.

Regarding the notification symbol “R”
Because the number of the operating buttons of this product

are limited, some operations require use of the operating
buttons of the remote commander, When a specific operation
requires use of the operating buttons of the remote commander,
“R” is added to the specific operating procedure in this manual.

Example  MENU/NO  “R”  The  MENU/NO  button  of remote
commander.

Incorrect operations may be performed if the test mode ia not

entered properly.

In this case, press the  ?/1  button to turn the power off, and

retry to enter the test mode.

If the disc tray does not open and the message “LOCKED”
appears, press the  x stick and the  A  button  simultaneously
for 5 seconds or longer.
Then remove your fingers from the above stick and the button.
The message “UNLOCKED” appears for 2 seconds and the disc
tray opens.

New part of EEP ROM (IC103) on the DMB10 board cannot be
used. Therefore, if the mounted DMB10 board (A-1111-270-A,etc.)
is replaced, exchange new EEP ROM (IC103) with that used before
the replacement.

NOTE OF HANDLING THE MIB01 BOARD (A-1124-106-A)
When the MIB01 board is replaced by a repair for a fee, throw
away the MIB01 board after obtaining consent of not returning of
the MIB01 board to the customer. When throwing away the MIB01
board, be sure to throw away after destroying IC602 physically with
the hammer etc.

When the self-diagnosis function is activated to 
prevent the system from malfunctioning, a 5-
character service number (e.g., C 13 50) with a 
combination of a letter and 4 digits appears on 
the screen and the front panel display. In this 
case, check the following table.

C 13

The disc is dirty.

,Clean the disc with a soft cloth 

C 31

The disc is not inserted correctly.

,Restart the system, then re-insert 

the disc correctly.

E XX

(xx is a number)

To prevent a malfunction, the 
system has performed the self-
diagnosis function.

,Contact your nearest Sony 

dealer or local authorized Sony 
service facility and give the 5-
character service number.

Example: E 61 10

C:13:50