Read Sony DAV-FR10W / HCD-FR10W Service Manual online
SERVICE MANUAL
Sony Corporation
Audio Group
Published by Sony Engineering Corporation
Published by Sony Engineering Corporation
US Model
Canadian Model
SACD/DVD RECEIVER
9-879-099-04
2005G16-1
© 2005.07
© 2005.07
Ver. 1.3 2005.07
SPECIFICATIONS
HCD-FR10W
HCD-FR10W is the amplifier, DVD/SACD
and tuner section in DAV-FR10W.
and tuner section in DAV-FR10W.
Model Name Using Similar Mechanism
HCD-FR1
Mechanism Type
CDM69-DVBU16
Optical Pick-up Name
DBU-1
AUDIO POWER SPECIFICATIONS POWER
OUTPUT AND TOTAL HARMONIC
DISTORTION:
OUTPUT AND TOTAL HARMONIC
DISTORTION:
With 4 ohm loads, both channels driven, from 20 –
20,000 Hz; rated 75 watts per channel minimum RMS
power, with no more than 0.7 % total harmonic
distortion. (from 250 milli watts to rated output)
20,000 Hz; rated 75 watts per channel minimum RMS
power, with no more than 0.7 % total harmonic
distortion. (from 250 milli watts to rated output)
×
Amplifier section
Surround mode
Front:
114
W +
114
W
(reference)
(with SS-TS21)
music power output
Center*:
114
W
(with SS-CT33)
Surround*:
Surround*:
114
W +
114
W
(with SA-TS22W, SS-TS21)
Subwoofer*:
Subwoofer*:
115
W
2
(with SS-WS12)
* Depending on the sound field settings and the source,
there may be no sound output.
Inputs
VIDEO/SAT:
Sensitivity: 250 mV/
450 mV
450 mV
Impedance: 50 kilohms
Output
SURROUND BACK
Voltage: 2V
Impedance: 1 kilohms
Voltage: 2V
Impedance: 1 kilohms
Phones
Accepts low-and high-
impedance headphones.
impedance headphones.
Super Audio CD/DVD system
Laser
Semiconductor laser
(Super Audio CD/DVD:
= 650 nm)
(CD:
(Super Audio CD/DVD:
= 650 nm)
(CD:
λ
λ
= 780 nm)
Emission duration:
continuous
continuous
Signal format system
NTSC
Frequency response (at 2 CH STEREO mode)
DVD (PCM): 2 Hz to 22
kHz (
kHz (
±1.0 dB)
CD: 2 Hz to 20 kHz (
±1.0
dB)
Harmonic distortion
Less than 0.03 %
Tuner section
System
PLL quartz-locked digital
synthesizer system
synthesizer system
FM tuner section
Tuning range
Tuning range
87.5 – 108.0 MHz
(100 kHz step)
(100 kHz step)
Antenna (aerial)
FM wire antenna (aerial)
Antenna (aerial) terminals
75 ohms, unbalanced
Intermediate frequency 10.7 MHz
AM tuner section
Tuning range
AM tuner section
Tuning range
531 – 1,710 kHz (with the
interval set at 9 kHz)
530 – 1,710 kHz (with the
interval set at 10 kHz)
interval set at 9 kHz)
530 – 1,710 kHz (with the
interval set at 10 kHz)
Video section
Outputs
General
Power requirements
Power consumption
Dimensions (approx.)
Power consumption
Dimensions (approx.)
Mass (approx.)
Antenna (aerial)
Intermediate frequency
Intermediate frequency
AM loop antenna (aerial)
450 kHz
450 kHz
Video: 1 Vp-p 75 ohms\
S VIDEO:
Y: 1 Vp-p 75 ohms
C: 0.286 Vp-p 75 ohms
COMPONENT:
Y: 1 Vp-p 75 ohms
S VIDEO:
Y: 1 Vp-p 75 ohms
C: 0.286 Vp-p 75 ohms
COMPONENT:
Y: 1 Vp-p 75 ohms
P
B
/C
B
, P
R
/C
R
: 0.65 Vp-p
75 ohms
×
×
120 V AC, 60 Hz
90 W
90 W
430
× 70 × 398 mm
(17
2
7
/
8
15
3
/
4
inches)
(w/h/d) incl. projecting
parts
5.5 kg (12 lb 12 oz)
parts
5.5 kg (12 lb 12 oz)
Design and specifications are subject to change
without notice.
without notice.
2
HCD-FR10W
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radiation
exposure.
other than those specified herein may result in hazardous radiation
exposure.
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350
°C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscou-s (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
also be added to ordinary solder.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270 °C
during repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
SAFETY CHECK-OUT
After correcting the original service problem, perform the following
safety check before releasing the set to the customer:
Check the antenna terminals, metal trim, “metallized” knobs, screws,
and all other exposed metal parts for AC leakage.
Check leakage as described below.
safety check before releasing the set to the customer:
Check the antenna terminals, metal trim, “metallized” knobs, screws,
and all other exposed metal parts for AC leakage.
Check leakage as described below.
LEAKAGE TEST
The AC leakage from any exposed metal part to earth ground and
from all exposed metal parts to any exposed metal part having a
return to chassis, must not exceed 0.5 mA (500 microamperes.).
Leakage current can be measured by any one of three methods.
from all exposed metal parts to any exposed metal part having a
return to chassis, must not exceed 0.5 mA (500 microamperes.).
Leakage current can be measured by any one of three methods.
1. A commercial leakage tester, such as the Simpson 229 or RCA
WT-540A. Follow the manufacturers’ instructions to use these
instruments.
instruments.
2. A battery-operated AC milliammeter. The Data Precision 245
digital multimeter is suitable for this job.
3. Measuring the voltage drop across a resistor by means of a
VOM or battery-operated AC voltmeter. The “limit” indication
is 0.75 V, so analog meters must have an accurate low-voltage
scale. The Simpson 250 and Sanwa SH-63Trd are examples
of a passive VOM that is suitable. Nearly all battery operated
digital multimeters that have a 2 V AC range are suitable. (See
Fig. A)
is 0.75 V, so analog meters must have an accurate low-voltage
scale. The Simpson 250 and Sanwa SH-63Trd are examples
of a passive VOM that is suitable. Nearly all battery operated
digital multimeters that have a 2 V AC range are suitable. (See
Fig. A)
Fig. A.
Using an AC voltmeter to check AC leakage.
1.5 k
Ω
0.15
µ
F
AC
voltmeter
(0.75 V)
voltmeter
(0.75 V)
To Exposed Metal
Parts on Set
Parts on Set
Earth Ground
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK
0
OR DOTTED LINE
WITH MARK
0
ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ!
LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE
0
SUR
LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES
PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE
FONCTIONNEMENT. NE REMPLACER CES COM- POSANTS
QUE PAR DES PIÈCES SONY DONT LES NUMÉROS SONT
DONNÉS DANS CE MANUEL OU DANS LES SUPPLÉMENTS
PUBLIÉS PAR SONY.
PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE
FONCTIONNEMENT. NE REMPLACER CES COM- POSANTS
QUE PAR DES PIÈCES SONY DONT LES NUMÉROS SONT
DONNÉS DANS CE MANUEL OU DANS LES SUPPLÉMENTS
PUBLIÉS PAR SONY.
Laser component in this product is capable of emitting radiation
exceeding the limit for Class 1.
exceeding the limit for Class 1.
This appliance is classified as
a CLASS 1 LASER product.
The CLASS 1 LASER
PRODUCT MARKING is
located on the rear exterior.
a CLASS 1 LASER product.
The CLASS 1 LASER
PRODUCT MARKING is
located on the rear exterior.
3
HCD-FR10W
TABLE OF CONTENTS
1.
SERVICING NOTE
...................................................
4
2.
GENERAL
...................................................................
5
3.
DISASSEMBLY
3-1.
Flow Chart .......................................................................
7
3-2.
Side Panel (R) (L), Front Panel Section ..........................
8
3-3.
FL Board ..........................................................................
8
3-4.
Mechanism Deck (CDM69-DVBU16) ............................
9
3-5.
AMP Board ......................................................................
9
3-6.
Switching Regulator ........................................................ 10
3-7.
DMB08 Board ................................................................. 10
3-8.
TUNER Unit, IO Board ................................................... 11
3-9.
Optical Pick-up Section (DVBU16) ................................ 11
3-10. Pick-up Unit (DBU-1) ..................................................... 12
3-11. SW Board, Bracket (Top) Assy ....................................... 12
3-12. RELAY Board ................................................................. 13
3-13. Motor (Stocker) Assy (Stocker) (M781) ......................... 13
3-14. Motor (Stocker) Assy (Roller) (M771) ........................... 14
3-15. Motor (Stocker) Assy (Mode) (M761) ............................ 14
3-16. Rubber Roller (Slider) Assy ............................................ 15
3-17. Timing Belt (Front/Rear) ................................................. 15
3-18. Cam (Gear) ...................................................................... 16
3-19. SENSOR Board ............................................................... 16
3-11. SW Board, Bracket (Top) Assy ....................................... 12
3-12. RELAY Board ................................................................. 13
3-13. Motor (Stocker) Assy (Stocker) (M781) ......................... 13
3-14. Motor (Stocker) Assy (Roller) (M771) ........................... 14
3-15. Motor (Stocker) Assy (Mode) (M761) ............................ 14
3-16. Rubber Roller (Slider) Assy ............................................ 15
3-17. Timing Belt (Front/Rear) ................................................. 15
3-18. Cam (Gear) ...................................................................... 16
3-19. SENSOR Board ............................................................... 16
4.
ASSEMBLY
4-1.
How to Install the Cam (Eject Lock) ............................... 17
4-2.
How to Install the Cam (Gear) ........................................ 17
4-3.
How to Install the Gear (Mode 2) .................................... 18
4-4.
How to Install the Gear (Mode Cam) .............................. 18
4-5.
How to Install the Rotary Encoder (S702),
Gear (Stocker Communication) ....................................... 19
Gear (Stocker Communication) ....................................... 19
4-6.
How to Install the Cam (Stocker U/D) ............................ 20
4-7.
How to Install the Stocker Assy ...................................... 21
4-8.
Phase Adjustment Between Pinions (Slider)
and Slider-1 to 5 (L/R) .................................................... 22
and Slider-1 to 5 (L/R) .................................................... 22
5.
TEST MODE
............................................................... 23
6.
ELECTRICAL ADJUSTMENT
............................. 31
7.
DIAGRAMS
7-1.
Block Diagram – RF/SERVO Section – .......................... 34
7-2.
Block Diagram – AUDIO (DSP) Section – ..................... 35
7-3.
Block Diagram – AUDIO (OUT) Section – .................... 36
7-4.
Block Diagram – VIDEO Section – ................................ 37
7-5.
Block Diagram – DIAT TRANSMIT Section – .............. 38
7-6.
Block Diagram – POWER Section – ............................... 39
7-7.
Printed Wiring Board – RF Board – ................................ 40
7-8.
Schematic Diagram – RF Board – ................................... 41
7-9.
Printed Wiring Board – RELAY Section – ...................... 42
7-10. Schematic Diagram – RELAY Section – ........................ 43
7-11. Printed Wiring Board – DMB08 Board (Side A) – ......... 44
7-12. Printed Wiring Board – DMB08 Board (Side B) – ......... 45
7-13. Schematic Diagram – DMB08 Board (1/10) – ................ 46
7-14. Schematic Diagram – DMB08 Board (2/10) – ................ 47
7-15. Schematic Diagram – DMB08 Board (3/10) – ................ 48
7-16. Schematic Diagram – DMB08 Board (4/10) – ................ 49
7-17. Schematic Diagram – DMB08 Board (5/10) – ................ 50
7-18. Schematic Diagram – DMB08 Board (6/10) – ................ 51
7-19. Schematic Diagram – DMB08 Board (7/10) – ................ 52
7-20. Schematic Diagram – DMB08 Board (8/10) – ................ 53
7-21. Schematic Diagram – DMB08 Board (9/10) – ................ 54
7-22. Schematic Diagram – DMB08 Board (10/10) – .............. 55
7-23. Printed Wiring Board – AMP Board (Side A) – .............. 56
7-24. Printed Wiring Board – AMP Board (Side B) – .............. 57
7-25. Schematic Diagram – AMP Board (1/4) – ...................... 58
7-26. Schematic Diagram – AMP Board (2/4) – ...................... 59
7-27. Schematic Diagram – AMP Board (3/4) – ...................... 60
7-28. Schematic Diagram – AMP Board (4/4) – ...................... 61
7-29. Printed Wiring Board – IO Section – .............................. 62
7-30. Schematic Diagram – IO Section (1/2) – ........................ 63
7-31. Schematic Diagram – IO Section (2/2) – ........................ 64
7-32. Printed Wiring Board – DDCON Board – ....................... 65
7-33. Schematic Diagram – DDCON Board – ......................... 66
7-34. Printed Wiring Board – DIAT TRANSMIT Board – ...... 67
7-35. Schematic Diagram – DIAT TRANSMIT Board – ........ 68
7-36. Printed Wiring Board – SPEAKER OUT Section – ........ 69
7-37. Schematic Diagram – SPEAKER OUT Section – .......... 70
7-38. Printed Wiring Board – FL Board – ................................ 71
7-39. Schematic Diagram – FL Board – ................................... 72
7-40. Printed Wiring Board
7-11. Printed Wiring Board – DMB08 Board (Side A) – ......... 44
7-12. Printed Wiring Board – DMB08 Board (Side B) – ......... 45
7-13. Schematic Diagram – DMB08 Board (1/10) – ................ 46
7-14. Schematic Diagram – DMB08 Board (2/10) – ................ 47
7-15. Schematic Diagram – DMB08 Board (3/10) – ................ 48
7-16. Schematic Diagram – DMB08 Board (4/10) – ................ 49
7-17. Schematic Diagram – DMB08 Board (5/10) – ................ 50
7-18. Schematic Diagram – DMB08 Board (6/10) – ................ 51
7-19. Schematic Diagram – DMB08 Board (7/10) – ................ 52
7-20. Schematic Diagram – DMB08 Board (8/10) – ................ 53
7-21. Schematic Diagram – DMB08 Board (9/10) – ................ 54
7-22. Schematic Diagram – DMB08 Board (10/10) – .............. 55
7-23. Printed Wiring Board – AMP Board (Side A) – .............. 56
7-24. Printed Wiring Board – AMP Board (Side B) – .............. 57
7-25. Schematic Diagram – AMP Board (1/4) – ...................... 58
7-26. Schematic Diagram – AMP Board (2/4) – ...................... 59
7-27. Schematic Diagram – AMP Board (3/4) – ...................... 60
7-28. Schematic Diagram – AMP Board (4/4) – ...................... 61
7-29. Printed Wiring Board – IO Section – .............................. 62
7-30. Schematic Diagram – IO Section (1/2) – ........................ 63
7-31. Schematic Diagram – IO Section (2/2) – ........................ 64
7-32. Printed Wiring Board – DDCON Board – ....................... 65
7-33. Schematic Diagram – DDCON Board – ......................... 66
7-34. Printed Wiring Board – DIAT TRANSMIT Board – ...... 67
7-35. Schematic Diagram – DIAT TRANSMIT Board – ........ 68
7-36. Printed Wiring Board – SPEAKER OUT Section – ........ 69
7-37. Schematic Diagram – SPEAKER OUT Section – .......... 70
7-38. Printed Wiring Board – FL Board – ................................ 71
7-39. Schematic Diagram – FL Board – ................................... 72
7-40. Printed Wiring Board
– POWER/FRONT PANEL Section – ............................. 73
7-41. Schematic Diagram
– POWER/FRONT PANEL Section – ............................. 74
8.
EXPLODED VIEWS
8-1.
Case Section ................................................................... 109
8-2.
Front Panel Section ........................................................ 110
8-3.
Chassis Section ............................................................... 111
8-4.
Mechanism Deck Section-1 (CDM69-DVBU16) .......... 112
8-5.
Mechanism Deck Section-2 (CDM69-DVBU16) .......... 113
8-6.
Mechanism Deck Section-3 (CDM69-DVBU16) .......... 114
8-7.
Mechanism Deck Section-4 (CDM69-DVBU16) .......... 115
8-8.
Mechanism Deck Section-5 (CDM69-DVBU16) .......... 116
8-9.
Mechanism Deck Section-6 (CDM69-DVBU16) .......... 117
8-10. Optical Pick-up Section (DBU-1) .................................. 118
9.
ELECTRICAL PARTS LIST
................................. 119
4
HCD-FR10W
SECTION 1
SERVICING NOTE
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.