DAV-FR1, HCD-F100, HCD-F50, HCD-FR1, MHC-F100, MHC-F50, MHC-FR1 - Sony Audio Service Manual (repair manual). Page 4

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Servicing Notes ........................................................................... 4

.................................................................... 5

......................................................... 25

.............................................................. 33

........................ 36

Deck Section .................................................................... 39
Tuner Section ................................................................... 41
CD Section ....................................................................... 42

................................................................ 44

6-1.

Printed Wiring Board –Tuner Section– ........................... 45

6-2.

Schematic Diagram –Tuner Section– .............................. 46

6-3.

Schematic Diagram –CD Section– .................................. 48

6-4.

Printed Wiring Board –CD Section– ............................... 51

6-5.

Printed Wiring Boards –CD Motor Section– ................... 54

6-6.

Schematic Diagram –CD Motor Section– ....................... 55

6-7.

Printed Wiring Boards –Deck Section– ........................... 57

6-8.

Schematic Diagram –Deck Section– ............................... 59

6-9.

Schematic Diagram –Main /Power Section– ................... 64

6-10. Printed Wiring Boards –Main /Power Section– .............. 69
6-11. Schematic Diagram –Main (3/3) Section– ...................... 73
6-12. Printed Wiring Boards –Panel Section– .......................... 75
6-13. Schematic Diagram –Panel Section– ............................... 77
6-14. IC Pin Function Description ............................................ 85

............................................... 95

.............................. 104

The laser diode in the optical pick-up block may suffer electro-
static break-down because of the potential difference generated
by the charged electrostatic load, etc. on clothing and the human
body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.

The laser beam on this model is concentrated so as to be focused
on the disc reflective surface by the objective lens in the optical
pick-up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.

Carry out the “S curve check” in “CD section adjustment” and
check that the S curve waveform is output repeatedly.

•

Never reuse a disconnected chip component.

•

Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.

•

Keep the temperature of the soldering iron around 270 ˚C dur-
ing repairing.

•

Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).

•

Be careful not to apply force on the conductor when soldering
or unsoldering.