Read Sony DAV-DZ770W / DAV-FX999W / TA-WR3 Service Manual online
SERVICE MANUAL
Sony Corporation
Home Audio Division
Published by Sony Engineering Corporation
Published by Sony Engineering Corporation
E Model
Australian Model
SURROUND AMPLIFIER
9-879-758-02
2005J16-1
© 2005.10
© 2005.10
Ver. 1.1 2005.10
SPECIFICATIONS
TA-WR3
TA-WR3 is the surround amplifier section in DAV-
DZ770W and DAV-FX999W.
DZ770W and DAV-FX999W.
Power requirements
Korean model:
Korean model:
220 V AC, 60 Hz
Taiwan model:
120 V AC,
Other models:
220 – 240 V AC, 50/60 Hz
50/60 Hz
Power consumption
50 W
Dimensions (approx.)
260
×
260.5
×
58 mm
(w/h/d)
Mass (approx.)
1.45 kg
Design and specifications are subject to change
without notice.
without notice.
2
TA-WR3
TABLE OF CONTENTS
1.
GENERAL
...................................................................
3
2.
DIAGRAMS
2-1.
Block Diagram ................................................................
5
2-2.
Printed Wiring Board — DIAT POWER Section — ......
6
2-3.
Schematic Diagram — DIAT POWER Section — ........
7
2-4.
Printed Wiring Board — RX Board — ..........................
8
2-5.
Schematic Diagram — RX Board (1/2) — ....................
9
2-6.
Schematic Diagram — RX Board (2/2) — .................... 10
3.
EXPLODED VIEWS
3-1.
Overall Section ................................................................ 17
3-2.
RX Board, DIAT POWER Board Section ....................... 18
4.
ELECTRICAL PARTS LIST
.................................. 19
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270 °C
during repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350
°C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscou-s (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
also be added to ordinary solder.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK
0
OR DOTTED LINE
WITH MARK
0
ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
3
TA-WR3
SECTION 1
GENERAL
This section is extracted
from instruction manual.
from instruction manual.
Surround amplifier
A
POWER/ON LINE indicator
B
POWER
C
DIR-R2 jack
D
SPEAKER jacks
POWER/ON LINE
POWER
SURROUND L
SURROUND R
SPEAKER
DIR-R2
Front panel
Rear panel
4
TA-WR3
SECTION 2
DIAGRAMS
• Waveforms
– RX Board –
– RX Board –
Note on Schematic Diagrams:
• All capacitors are in
• All capacitors are in
µ
F unless otherwise noted. (p: pF)
50 WV or less are not indicated except for electrolytics and
tantalums.
tantalums.
• All resistors are in
Ω
and
1
/
4
W or less unless otherwise
specified.
•
f
: internal component.
•
2
: nonflammable resistor.
•
C
: panel designation.
•
A
: B+ Line.
• Voltages and waveforms are dc with respect to ground
under no-signal (detuned) conditions.
no mark: Power on
no mark: Power on
• Voltages are taken with a VOM (Input impedance 10 M
Ω
).
Voltage variations may be noted due to normal production
tolerances.
tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal production
tolerances.
tolerances.
• Circled numbers refer to waveforms.
• Signal path.
F
: AUDIO
• Abbreviation
TW
: Taiwan model
Note on Printed Wiring Boards:
•
•
X
: parts extracted from the component side.
•
Y
: parts extracted from the conductor side.
•
f
: internal component.
•
: Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
• Indication of transistor.
• Note for Printed Wiring Boards and Schematic Diagrams
C
B
These are omitted.
E
Q
Caution:
Pattern face side: Parts on the pattern face side seen from
(SIDE A) the pattern face are indicated.
Parts face side: Parts on the parts face side seen from
(SIDE B) the parts face are indicated.
Pattern face side: Parts on the pattern face side seen from
(SIDE A) the pattern face are indicated.
Parts face side: Parts on the parts face side seen from
(SIDE B) the parts face are indicated.
3
IC111
rk
(XFSOIN)
1 V/DIV, 10 ns/DIV
2
IC102
r;
(OSCI)
1
IC107
wd
(X1)
1 V/DIV, 100 ns/DIV
1 V/DIV, 40 ns/DIV
125 ns
20.3 ns
81.3 ns
3.7 Vp-p
4.8 Vp-p
3.4 Vp-p
B
These are omitted.
C
E
Q
Note: The components identified by mark
0
or dotted
line with mark
0
are critical for safety.
Replace only with part number specified.
Ver. 1.1
