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SERVICE MANUAL
Sony Corporation
Audio&Video Business Group
Published by Sony Techno Create Corporation
HCD-DZ285K/DZ290M/DZ585K/
DZ590M/DZ685K/DZ690M
SPECIFICATIONS
DVD RECEIVER
9-889-480-01
2009D04-1
©
2009.04
Russian Model
Ver. 1.0 2009.04
• HCD-DZ285K/DZ290M/DZ585K/DZ590M/DZ685K/DZ690M
are the amplifi er, DVD/CD and tuner section in DAV-DZ285K/
DZ290M/DZ585K/DZ590M/DZ685K/DZ690M.
DZ290M/DZ585K/DZ590M/DZ685K/DZ690M.
Amplifi er Section
Stereo mode (rated)
108 W + 108 W (at 3 ohms,
1 kHz, 1% THD)
DZ285K/DZ290M/DZ585K/DZ590M:
Surround mode (reference) RMS output power
FL/FR/C/SL/SR*:
Surround mode (reference) RMS output power
FL/FR/C/SL/SR*:
142
watts (per channel at 3
ohms, 1 kHz, 10% THD)
Subwoofer*: 140 watts (at
3 ohms, 80 Hz, 10% THD)
DZ685K/DZ690M:
Surround mode (reference) RMS output power
FL/FR/C/SL/SR*:
Surround mode (reference) RMS output power
FL/FR/C/SL/SR*:
144
watts (per channel at 3
ohms, 1 kHz, 10% THD)
Subwoofer*: 280 watts (at
1.5 ohms, 80 Hz, 10% THD)
* Depending on the decoding mode settings and the
source, there may be no sound output.
source, there may be no sound output.
Inputs (Analog)
DZ285K/DZ290M/DZ585K/DZ590M:
TV/VIDEO (AUDIO IN) Sensitivity: 450/250 mV
AUDIO IN/MIC1
DZ285K/DZ290M/DZ585K/DZ590M:
TV/VIDEO (AUDIO IN) Sensitivity: 450/250 mV
AUDIO IN/MIC1
Sensitivity: AUDIO IN
250/125 mV/MIC1 1 mV
MIC2 Sensitivity:
1
mV
DZ685K/DZ690M:
TV (AUDIO IN)
TV (AUDIO IN)
Sensitivity: 450/250 mV
SAT/CABLE (AUDIO IN) Sensitivity: 450/250 mV
AUDIO IN/MIC1
AUDIO IN/MIC1
Sensitivity: AUDIO IN
250/125 mV/MIC1 1 mV
MIC2 Sensitivity:
1
mV
Inputs (Digital)
DZ585K/DZ590M:
TV/VIDEO (COAXIAL IN/OPTICAL IN)
DZ585K/DZ590M:
TV/VIDEO (COAXIAL IN/OPTICAL IN)
Impedance: 75 ohms/-
Input Stream: Dolby
Digital 5.1ch/DTS 5.1ch/
Linear PCM 2ch
(Sampling Frequency: less
than 48 kHz)
DZ685K/DZ690M:
TV (COAXIAL IN/OPTICAL IN)
TV (COAXIAL IN/OPTICAL IN)
Impedance: 75 ohms/-
Input Stream: Dolby
Digital 5.1ch/DTS 5.1ch/
Linear PCM 2ch
(Sampling Frequency: less
than 48 kHz)
Super Audio CD/DVD System
Laser Diode Properties
Emission Duration:
Continuous
Laser Output: Less than
44.6
μW
* This output is the value measurement at a distance
of 200mm from the objective lens surface on the
Optical Pick-up Block with 7mm aperture.
of 200mm from the objective lens surface on the
Optical Pick-up Block with 7mm aperture.
Signal format system
PAL/NTSC
– Continued on next page –
Photo: HCD-DZ690M
This system incorporates with Dolby* Digital and Dolby Pro Logic
(II) adaptive matrix surround decoder and the DTS** Digital Surround
System.
* Manufactured under license from Dolby Laboratories.
(II) adaptive matrix surround decoder and the DTS** Digital Surround
System.
* Manufactured under license from Dolby Laboratories.
Dolby, Pro Logic, and the double-D symbol are trademarks of Dolby
Laboratories.
Laboratories.
** Manufactured under license under U.S. Patent #’s:
5,451,942; 5,956,674; 5,974,380; 5,978,762; 6,487,535 & other U.S.
and worldwide patents issued & pending. DTS and DTS Digital
Surround are registered trademarks and the DTS logos and Symbol
are trademarks of DTS, Inc. © 1996-2008 DTS, Inc. All Rights
Reserved.
and worldwide patents issued & pending. DTS and DTS Digital
Surround are registered trademarks and the DTS logos and Symbol
are trademarks of DTS, Inc. © 1996-2008 DTS, Inc. All Rights
Reserved.
Model Name Using Similar Mechanism
HCD-DZ275M/DZ570M/
DZ665K/DZ670M
DZ665K/DZ670M
Mechanism Type
CDM85-DVBU102
Optical Pick-up Name
KHM-313CAA
HCD-DZ285K/DZ290M/DZ585K/DZ590M/DZ685K/DZ690M
2
SAFETY-RELATED COMPONET WARNING!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS
WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
USB Section
(USB) port:
Maximum current:
500 mA
Tuner Section
System
PLL quartz-locked digital
synthesizer
FM Tuner section
Tuning range
North American models: 87.5 MHz - 108.0 MHz
FM Tuner section
Tuning range
North American models: 87.5 MHz - 108.0 MHz
(100 kHz step)
Other models:
87.5 MHz - 108.0 MHz
(50 kHz step)
Antenna (aerial)
FM wire antenna (aerial)
Antenna (aerial) terminals 75 ohms, unbalanced
Intermediate frequency
Intermediate frequency
10.7 MHz
Video Section
Outputs
VIDEO: 1 Vp-p 75 ohms
COMPONENT:
Y: 1 Vp-p 75 ohms
P
B
/C
B
, P
R
/C
R
: 0.7 Vp-p
75
ohms
HDMI OUT: Type A (19
pin)
General
Power requirements
220 V - 240 V AC,
50/60
Hz
Power consumption
On: 150 W
Standby: 0.3 W (at the
Power Saving mode)
Output voltage (DIGITAL MEDIA PORT)
DC
DC
5
V
Output current (DIGITAL MEDIA PORT)
700
700
mA
Dimensions (approx.)
430 mm
× 66 mm × 390 mm
(w/h/d) incl. projecting parts
Mass (approx.)
4.3 kg
SPECIAL COMPONENT NOTICE
The components identifi ed by mark 9 contain confi dential infor-
mation.
Strictly follow the instructions whenever the components are re-
paired and/or replaced.
The components identifi ed by mark 9 contain confi dential infor-
mation.
Strictly follow the instructions whenever the components are re-
paired and/or replaced.
Supported fi le format
MP3 (MPEG 1 Audio Layer-3)
MP3 (MPEG 1 Audio Layer-3)
File Extension:
mp3
Bitrate:
32 kbps - 320 kbps
Sampling frequencies:
32/44.1/48 kHz
WMA (USB device only)
File Extension:
wma
Bitrate:
48 kbps - 192 kbps
Sampling frequencies:
44.1 kHz
AAC (USB device only)
File Extension:
m4a
Bitrate:
48 kbps - 320 kbps
Sampling frequencies:
44.1 kHz
DivX
File Extension:
avi/divx
Video codec:
DivX video
Bitrate: 8
Mbps
(MAX)
Frame rate:
30 fps
Resolution: 720
× 576
Audio codec:
MP3
MPEG4
File format:
MP4 File Format
File Extension:
mp4/m4v
Video codec:
MPEG4 Simple Profi le
(AVC is not compatible.)
Bitrate: 4
Mbps
Frame rate:
30 fps
Resolution: 720
× 576
Audio codec:
AAC-LC (HE-AAC is not
compatible.)
DRM: Not
DRM: Not
compatible
Design and specifi cations are subject to change
without notice.
without notice.
HCD-DZ285K/DZ290M/DZ585K/DZ590M/DZ685K/DZ690M
3
Model
Part No.
DZ290M
4-113-459-1[]
DZ285K
4-113-459-2[]
DZ585K
4-113-460-9[]
DZ590M
4-113-461-1[]
DZ690M
4-122-167-1[]
DZ685K
4-122-167-9[]
MODEL IDENTIFICATION
– Back Panel –
– Back Panel –
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher
• Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong
viscosity
Unleaded solder is more viscous (sticky, less prone to fl ow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
also be added to ordinary solder.
NOTES ON CHIP COMPONENT REPLACEMENT
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
FLEXIBLE CIRCUIT BOARD REPAIRING
• Keep the temperature of soldering iron around 270 °C during
• Keep the temperature of soldering iron around 270 °C during
repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
Laser component in this product is capable of emitting radiation
exceeding the limit for Class 1.
exceeding the limit for Class 1.
This appliance is classifi ed as
a CLASS 1 LASER product.
This marking is located on the
rear or bottom exterior.
a CLASS 1 LASER product.
This marking is located on the
rear or bottom exterior.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specifi ed herein may result in hazardous radia-
tion exposure.
Use of controls or adjustments or performance of procedures
other than those specifi ed herein may result in hazardous radia-
tion exposure.
Parts No.
HCD-DZ285K/DZ290M/DZ585K/DZ590M/DZ685K/DZ690M
4
1.
SERVICING NOTES
............................................. 5
2. DISASSEMBLY
2-1. Case ................................................................................ 8
2-2. Front Panel Section ......................................................... 8
2-3. Back Panel Section (DZ285K/DZ290M) ....................... 9
2-4. Back Panel Section (Except DZ285K/DZ290M) ........... 9
2-5. DVD Mechanism Deck ................................................... 10
2-6. POWER Board, USB Board ........................................... 10
2-7. MAIN Board, SPEAKER Board .................................... 11
2-8. IO-COMPONENT
2-2. Front Panel Section ......................................................... 8
2-3. Back Panel Section (DZ285K/DZ290M) ....................... 9
2-4. Back Panel Section (Except DZ285K/DZ290M) ........... 9
2-5. DVD Mechanism Deck ................................................... 10
2-6. POWER Board, USB Board ........................................... 10
2-7. MAIN Board, SPEAKER Board .................................... 11
2-8. IO-COMPONENT
Board
............................................... 11
2-9. Tray
................................................................................. 12
2-10. Belt .................................................................................. 12
2-11. MS-203 Board ................................................................. 13
2-12. Base Unit ......................................................................... 13
2-13. Optical Pick-up ............................................................... 14
2-11. MS-203 Board ................................................................. 13
2-12. Base Unit ......................................................................... 13
2-13. Optical Pick-up ............................................................... 14
3.
TEST MODE
............................................................ 15
4. ELECTRICAL
ADJUSTMENTS
........................ 21
5. DIAGRAMS
5-1. Block Diagram –RF Section– ......................................... 23
5-2. Block Diagram –VIDEO Section– ................................. 24
5-3. Block Diagram –AUDIO Section– ................................. 25
5-4. Block Diagram –AMP Section– ..................................... 26
5-5. Block Diagram –POWER Section– ................................ 27
5-6. Printed Wiring Board –MAIN Section (1/2)– ................. 30
5-7. Printed Wiring Boards –MAIN Section (2/2)– ............... 31
5-8. Schematic Diagram –MAIN Section (1/10)– ................. 32
5-9. Schematic Diagram –MAIN Section (2/10)– ................. 33
5-2. Block Diagram –VIDEO Section– ................................. 24
5-3. Block Diagram –AUDIO Section– ................................. 25
5-4. Block Diagram –AMP Section– ..................................... 26
5-5. Block Diagram –POWER Section– ................................ 27
5-6. Printed Wiring Board –MAIN Section (1/2)– ................. 30
5-7. Printed Wiring Boards –MAIN Section (2/2)– ............... 31
5-8. Schematic Diagram –MAIN Section (1/10)– ................. 32
5-9. Schematic Diagram –MAIN Section (2/10)– ................. 33
TABLE OF CONTENTS
5-10. Schematic Diagram –MAIN Section (3/10)– ................. 34
5-11. Schematic Diagram –MAIN Section (4/10)– ................. 35
5-12. Schematic Diagram –MAIN Section (5/10)– ................. 36
5-13. Schematic Diagram –MAIN Section (6/10)– ................. 37
5-14. Schematic Diagram –MAIN Section (7/10)– ................. 38
5-15. Schematic Diagram –MAIN Section (8/10)– ................. 39
5-16. Schematic Diagram –MAIN Section (9/10)– ................. 40
5-17. Schematic Diagram –MAIN Section (10/10)– ............... 41
5-18. Printed Wiring Board –IO-COMPONENT Section– ...... 42
5-19. Schematic Diagram –IO-COMPONENT Section– ........ 43
5-20. Printed Wiring Boards –FL JACK, SWITCH Section– ... 44
5-21. Schematic Diagram –FL JACK Section– ....................... 45
5-22. Schematic Diagram –SWITCH Section– ....................... 46
5-23. Printed Wiring Boards –S-AIR-CON
5-11. Schematic Diagram –MAIN Section (4/10)– ................. 35
5-12. Schematic Diagram –MAIN Section (5/10)– ................. 36
5-13. Schematic Diagram –MAIN Section (6/10)– ................. 37
5-14. Schematic Diagram –MAIN Section (7/10)– ................. 38
5-15. Schematic Diagram –MAIN Section (8/10)– ................. 39
5-16. Schematic Diagram –MAIN Section (9/10)– ................. 40
5-17. Schematic Diagram –MAIN Section (10/10)– ............... 41
5-18. Printed Wiring Board –IO-COMPONENT Section– ...... 42
5-19. Schematic Diagram –IO-COMPONENT Section– ........ 43
5-20. Printed Wiring Boards –FL JACK, SWITCH Section– ... 44
5-21. Schematic Diagram –FL JACK Section– ....................... 45
5-22. Schematic Diagram –SWITCH Section– ....................... 46
5-23. Printed Wiring Boards –S-AIR-CON
(DZ585K/DZ590M/DZ685K/DZ690M), USB Section– ... 47
5-24. Schematic Diagram –S-AIR-CON Section
(DZ585K/DZ590M/DZ685K/DZ690M)–
(DZ585K/DZ590M/DZ685K/DZ690M)–
......................... 48
5-25. Schematic Diagram –USB Section– ............................... 49
5-26. Printed Wiring Board –SPEAKER Section– .................. 50
5-27. Schematic Diagram –SPEAKER Section– ..................... 51
5-28. Printed Wiring Board –POWER Section– ...................... 52
5-29. Schematic Diagram –POWER Section– ......................... 53
5-26. Printed Wiring Board –SPEAKER Section– .................. 50
5-27. Schematic Diagram –SPEAKER Section– ..................... 51
5-28. Printed Wiring Board –POWER Section– ...................... 52
5-29. Schematic Diagram –POWER Section– ......................... 53
6.
EXPLODED VIEWS
6-1. Overall
Section
............................................................... 67
6-2. Front Panel Section ......................................................... 68
6-3. Chassis
6-3. Chassis
Section
............................................................... 69
6-4. DVD Mechanism Deck Section (CDM85-DVBU102) .. 70
7.
ELECTRICAL PARTS LIST
.............................. 71
