Read Sony DAR-X1R / SA-WSX1R Service Manual online
2
SA-WSX1R
Notes on chip component replacement
•
Never reuse a disconnected chip component.
•
Notice that the minus side of a tantalum capacitor may be
damaged by heat.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK
0
OR DOTTED LINE
WITH MARK
0
ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
TABLE OF CONTENTS
1.
SERVICING NOTES
...............................................
2
2.
GENERAL
...................................................................
5
3.
DISASSEMBLY
3-1.
Disassembly Flow ...........................................................
6
3-2.
Front Panel Assy ..............................................................
7
3-3.
DC Fan (M3000) .............................................................
8
3-4.
AMP Box Assy ................................................................
8
3-5.
SPK Out Board ................................................................
9
3-6.
TUNER (FM/AM) (TM10SCE), DSP Board ..................
9
3-7.
LF Board .......................................................................... 10
3-8.
Power Board .................................................................... 10
3-9.
AMP Board ...................................................................... 11
4.
DIAGRAMS
4-1.
Block Diagram – MAIN Section – .................................. 13
4-2.
Block Diagram – AMP Section – .................................... 14
4-3.
Block Diagram – POWER SUPPLY Section – ............... 15
4-4.
Printed Wiring Boards – DSP Section – .......................... 17
4-5.
Schematic Diagram – DSP Section (1/4) – ..................... 18
4-6.
Schematic Diagram – DSP Section (2/4) – ..................... 19
4-7.
Schematic Diagram – DSP Section (3/4) – ..................... 20
4-8.
Schematic Diagram – DSP Section (4/4) – ..................... 21
4-9.
Schematic Diagram – AMP Board (1/2) – ...................... 22
4-10. Schematic Diagram – AMP Board (2/2) – ...................... 23
4-11. Printed Wiring Board – AMP Board – ............................ 24
4-12. Printed Wiring Board – SPK OUT Board – .................... 25
4-13. Schematic Diagram – SPK OUT Board – ....................... 25
4-14. Printed Wiring Boards – POWER SUPPLY Section – .... 26
4-15. Schematic Diagram – POWER SUPPLY Section – ........ 27
4-11. Printed Wiring Board – AMP Board – ............................ 24
4-12. Printed Wiring Board – SPK OUT Board – .................... 25
4-13. Schematic Diagram – SPK OUT Board – ....................... 25
4-14. Printed Wiring Boards – POWER SUPPLY Section – .... 26
4-15. Schematic Diagram – POWER SUPPLY Section – ........ 27
5.
EXPLODED VIEWS
5-1.
Cabinet Section ................................................................ 39
5-2.
AMP Box Section ............................................................ 40
6.
ELECTRICAL PARTS LIST
............................... 41
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
•
Unleaded solder melts at a temperature about 40
°
C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350
°
C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
•
Strong viscosity
Unleaded solder is more viscou-s (sticky, less prone to flow)
Unleaded solder is more viscou-s (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
occur such as on IC pins, etc.
•
Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
SECTION 1
SERVICING NOTES
Click on the first or last page to see other DAR-X1R / SA-WSX1R service manuals if exist.