Read Sony CX-LT110 / LCX-T110 / SX-LT110 Service Manual online
2
CX-LT110/LCX-T110/SX-LT110
Notes on chip component replacement
•
Never reuse a disconnected chip component.
•
Notice that the minus side of a tantalum capacitor may be
damaged by heat.
damaged by heat.
Flexible Circuit Board Repairing
•
Keep the temperature of the soldering iron around 270
°
C
during repairing.
•
Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
circuit board (within 3 times).
•
Be careful not to apply force on the conductor when soldering
or unsoldering.
or unsoldering.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK
0
OR DOTTED LINE
WITH MARK
0
ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radiation
exposure.
other than those specified herein may result in hazardous radiation
exposure.
Laser component in this product is capable of emitting radiation
exceeding the limit for Class 1.
exceeding the limit for Class 1.
This appliance is classified as
a CLASS 1 LASER product.
The CLASS 1 LASER
PRODUCT MARKING is
located on the rear exterior.
a CLASS 1 LASER product.
The CLASS 1 LASER
PRODUCT MARKING is
located on the rear exterior.
TABLE OF CONTENTS
1.
SERVICING NOTES
...........................................
3
2.
DIAGRAMS
2-1.
Printed Wiring Board
– MAIN Section (Conductor Side) – ...............................
– MAIN Section (Conductor Side) – ...............................
5
2-2.
Printed Wiring Board
– MAIN Section (Component Side) – .............................
– MAIN Section (Component Side) – .............................
6
2-3.
Schematic Diagram – MAIN Section (1/2) –
.............
7
2-4.
Schematic Diagram – MAIN Section (2/2) – .................
8
2-5.
Printed Wiring Board – MOTOR Section – ...................
9
2-6.
Printed Wiring Board
– FRONT/CD Section (Conductor Side)– ....................... 10
– FRONT/CD Section (Conductor Side)– ....................... 10
2-7.
Printed Wiring Board
– FRONT Section (Component Side) – ........................... 11
– FRONT Section (Component Side) – ........................... 11
2-8.
Schematic Diagram – FRONT Section – ....................... 12
2-9.
Schematic Diagram – CD Section – ............................... 13
2-10. Printed Wiring Board – POWER Section – .................... 14
2-11. Schematic Diagram – POWER Section – ...................... 14
2-11. Schematic Diagram – POWER Section – ...................... 14
3.
EXPLODED VIEWS
3-1.
Overall Section-1 ............................................................ 17
3-2.
Overall Section-2, Speaker (SX-LT110) ........................ 18
4.
ELECTRICAL PARTS LIST
................................. 19
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
•
Unleaded solder melts at a temperature about 40
°
C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350
°
C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
•
Strong viscosity
Unleaded solder is more viscou-s (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
Unleaded solder is more viscou-s (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
•
Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
Ver. 1.3
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