Read Sony CX-LFA600 / XR-FA600 Service Manual online
CX-LFA600
AEP Model
UK Model
SERVICE MANUAL
MICRO HI-FI COMPONENT SYSTEM
Sony Corporation
Home Audio Company
Published by Sony Engineering Corporation
9-961-220-01
2003H1678-1
© 2003.08
CX-LFA600 is the Amplifier, CD player, Tape
Deck and Tuner section in XR-FA600.
Deck and Tuner section in XR-FA600.
SPECIFICATIONS
Ver 1.0 2003. 08
Model Name Using Similar Mechanism
NEW
CD
CD Mechanism Type
CDM55A-30BD64S
Section
Base Unit Name
BU-30BD64S
Optical Pick-up Name
A-MAX.3
TAPE
Model Name Using Similar Mechanism
CX-LFA500
Section
Tape Transport Mechanism Type
CMAL1Z222B
TUNER
FM tuning range
87.5 MHz to 108 MHz
FM usable sensitivity (IHF)
16.8 dBf
FM antenna terminal
75
Ω (unbalanced)
AM tuning range
531 kHz to 1602 kHz
AM usable sensitivity
350
µV/m
AM antenna
Loop antenna
AMPLIFIER
Power output
Rated: 20 W + 20 W(6
Ω, T.H.D. 1 %,
1 kHz/DIN 45500)
Reference: 30 W + 30 W(6
Reference: 30 W + 30 W(6
Ω, T.H.D.
10 %, 1 kHz/DIN 45324)
MUSIC POWER
60 W + 60 W
MUSIC POWER
60 W + 60 W
Input
AUX IN: 500 mV
Outputs
SPEAKERS: 6
Ω or more
PHONES: 32
Ω or more
CASSETTE DECK
Track format
4 tracks, 2 channels stereo
Frequency response
50 Hz – 10000 Hz
Recording system
AC bias
Heads
Recording/playback
× 1, erase × 1
CD PLAYER
Laser
Semiconductor laser (
λ = 780 nm)
Emission duration: continuous
D/A converter
MULTI BIT
Signal-to-noise ratio
80 dB (1 kHz, 0 dB)
Wow and flutter
Unmeasurable
GENERAL
Power requirements
230 V AC, 50/60 Hz
Power consumption
72 W
Power consumption in standby mode
with ECO mode on: 0.3 W
with ECO mode off: 10 W
with ECO mode off: 10 W
Dimensions (w/h/d)
Approx. 190
× 250 × 307.5 mm
Mass
Approx. 4.4 kg
Supplied accessories:
FM antenna (1)
AM antenna (1)
Speaker cords (2)
Remote commander (1)
Batteries (2)
Speaker pads (8)
AM antenna (1)
Speaker cords (2)
Remote commander (1)
Batteries (2)
Speaker pads (8)
Specifications and external appearance are subject to change
without notice.
without notice.
2
CX-LFA600
1. SERVICING NOTES
······················································· 3
2. GENERAL
·········································································· 5
3. DISASSEMBLY
3-1. TOP CABINET, DC FAN ··············································· 7
3-2. FRONT PANEL ASSY-1 ················································ 8
3-3. FRONT PANEL ASSY-2,
3-2. FRONT PANEL ASSY-1 ················································ 8
3-3. FRONT PANEL ASSY-2,
CD MECHANISM DECK (CDM55A-30BD64S) ········· 9
3-4. FRONT BOARD, SINGLE CASSETTE
MECHANISM ······························································ 10
3-5. MAIN BOARD, PT BOARD ······································· 10
3-6. LOADING BOARD ····················································· 11
3-7. BD BOARD ·································································· 11
3-8. TRAY (CDM55D) ························································ 12
3-9. BASE UNIT (BU-30BD64S) ········································ 12
3-6. LOADING BOARD ····················································· 11
3-7. BD BOARD ·································································· 11
3-8. TRAY (CDM55D) ························································ 12
3-9. BASE UNIT (BU-30BD64S) ········································ 12
4. TEST MODE
···································································· 13
5. MECHANICAL ADJUSTMENTS
····························· 14
6. ELECTRICAL ADJUSTMENTS
······························· 15
7. DIAGRAMS
7-1. BLOCK DIAGRAM – CD SECTION – ····················· 20
7-2. BLOCK DIAGRAM – MAIN SECTION – ················ 21
7-3. PRINTED WIRING BOARD – BD SECTION – ······· 22
7-4. SCHEMATIC DIAGRAM – BD SECTION – ············ 23
7-5. PRINTED WIRING BOARDS
7-2. BLOCK DIAGRAM – MAIN SECTION – ················ 21
7-3. PRINTED WIRING BOARD – BD SECTION – ······· 22
7-4. SCHEMATIC DIAGRAM – BD SECTION – ············ 23
7-5. PRINTED WIRING BOARDS
– MAIN SECTION (COMPONENT PARTS) – ···· 24
7-6. PRINTED WIRING BOARDS
– MAIN SECTION (CONDUCTOR PARTS) – ···· 25
7-7. SCHEMATIC DIAGRAM – MAIN SECTION – ······· 26
7-8. PRINTED WIRING BOARDS
7-8. PRINTED WIRING BOARDS
– FRONT SECTION (COMPONENT PARTS) – ·· 27
7-9. PRINTED WIRING BOARDS
– FRONT SECTION (CONDUCTOR PARTS) – ·· 28
7-10. SCHEMATIC DIAGRAM – FRONT SECTION – ··· 29
7-11. PRINTED WIRING BOARD
7-11. PRINTED WIRING BOARD
– POWER SECTION – ·········································· 30
7-12. SCHEMATIC DIAGRAM – POWER SECTION – ·· 30
7-13. IC PIN FUNCTION DESCRIPTION ························· 35
7-13. IC PIN FUNCTION DESCRIPTION ························· 35
8. EXPLODED VIEWS
8-1. OVERALL SECTION ·················································· 37
8-2. FRONT SECTION ························································ 38
8-3. CHASSIS SECTION ···················································· 39
8-4. CD MECHANISM DECK SECTION ·························· 40
8-5. BASE UNIT SECTION (BU-30BD64S) ······················ 41
8-2. FRONT SECTION ························································ 38
8-3. CHASSIS SECTION ···················································· 39
8-4. CD MECHANISM DECK SECTION ·························· 40
8-5. BASE UNIT SECTION (BU-30BD64S) ······················ 41
9. ELECTRICAL PARTS LIST
······································· 42
TABLE OF CONTENTS
3
CX-LFA600
SECTION 1
SERVICING NOTES
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK
0
OR DOTTED LINE WITH
MARK
0
ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS
LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE
COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS
APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS
PUBLISHED BY SONY.
COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS
APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS
PUBLISHED BY SONY.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous
radiation exposure.
other than those specified herein may result in hazardous
radiation exposure.
This appliance is classified as a CLASS 1 LASER product.
The CLASS 1 LASER PRODUCT MARKING is located on
the exterior.
The CLASS 1 LASER PRODUCT MARKING is located on
the exterior.
Laser component in this product is capable of emitting radiation
exceeding the limit for Class 1.
exceeding the limit for Class 1.
The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
LASER DIODE AND FOCUS SEARCH OPERATION
CHECK
CHECK
Carry out the “S curve check” in “CD section adjustment” and check
that the S curve waveforms is output three times.
that the S curve waveforms is output three times.
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
BLOCK OR BASE UNIT
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270 ˚C during
repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering or
unsoldering.
Unleaded solder
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40°C higher than
• Unleaded solder melts at a temperature about 40°C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350°C.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350°C.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow) than
ordinary solder so use caution not to let solder bridges occur such
as on IC pins, etc.
ordinary solder so use caution not to let solder bridges occur such
as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
also be added to ordinary solder.
4
CX-LFA600
Service Position of the CD Mechanism Deck
Service Position of the Tape Cassette Mechanism Deck
MAIN Board
Tape Cassette Mechanism Deck
(CMAL1Z222B)
(CMAL1Z222B)
MAIN Board
CD Mechanism Deck
(CDM55A-30BD64S)
(CDM55A-30BD64S)
