Read Sony CX-JT8 / JAX-PK8 / JAX-T8 Service Manual online
SERVICE MANUAL
COMPACT DISC DECK RECEIVER
AEP Model
UK Model
E Model
Australian Model
CX-JT8
Ver. 1.2 2005.05
9-877-255-03
Sony Corporation
2005E05-1
Personal Audio Group
© 2005.05
Published by Sony Engineering Corporation
SPECIFICATIONS
CX-JT8 is the tumer, amplifier, cassette deck
and CD player section in JAX-T8 and JAX-PK8.
and CD player section in JAX-T8 and JAX-PK8.
TUNER
FM tuning range
87.5 MHz to 108 MHz
FM
usable sensitivity (IHF)
16.8 dBf
FM
antenna terminal
75 ohms (unbalanced)
AM tuning
range
531 kHz to 1602 kHz
AM
usable sensitivity
350
µV/m
AM
antenna
Loop antenna
AMPLIFIER
Power
output
Front:
Rated: 144 W + 144 W (6 ohms,
T.H.D.
Rated: 144 W + 144 W (6 ohms,
T.H.D.
1 %, 1 kHz/DIN 45500)
Reference:
180 W + 180 W (6 ohms,
T.H.D.
10 %, 1 kHz/DIN 45324)
MUSIC
POWER: 320 W + 320 W
Front
and Surround:
125
W + 55 W (6 ohms, T .H.D.
10
%, 1 kHz/DIN AUDIO)
Total
har monic distortion
0.08 % (90 W, 1 kHz, 6 ohms, DIN
AUDIO)
Input
MD (VIDEO): 1.5 V
Outputs
SPEAKERS: 6 ohms or more
PHONES:
32 ohms or more
CASSETTE DECK
Track
format
4 tracks, 2 channels stereo
Frequency
response
50 Hz – 8 kHz
Recording
system
AC bias
Heads
Deck A: playback x 1
Deck
B: recording/playback x 1,
erase
x 1
CD PLAYER
Laser
Semiconductor laser
(
λ = 780 nm)
Emission duration:
continuous
continuous
D/A converter
1 bit dual
Signal-to-noise ratio
85 dB (1 kHz, 0 dB)
Harmonic distortion
0.05 % (1 kHz, 0 dB)
GENERAL
Power requirements
230 V AC, 50/60 Hz
Power consumption
210 W
Power consumption
With ECO mode on: 0.25 W
in standby mode
With ECO mode off: 24 W
Dimensions (W x H x D)
280 x 328 x 437 mm
Weight
10.3 kg
Specifications and external appearance are subject to
change without notice.
change without notice.
COPYRIGHT
Check copyright laws relevant to recordings from discs,
or tape for the country where the unit is to be used.
Check copyright laws relevant to recordings from discs,
or tape for the country where the unit is to be used.
Licensed by BBE Sound, Inc. under USP4638258, 5510752
and 5736897.
and 5736897.
(AEP, UK, CIS, E, SP, AUS)
280 x 328 x 446 mm (E51)
• Abbreviation
AUS : Australian model
E51 : Chilean and Peruvian models
SP : Singapore model
E51 : Chilean and Peruvian models
SP : Singapore model
Model Name Using Similar Mechanism
NEW
CD
CD Mechanism Type
CDM74F-K6BD71A
Section
Base Unit Name
BU-K6BD71A
Optical Block Name
KSM-213DCP
Optical Pick-up Name
KSS-213D
Tape deck
Model Name Using Similar Mechanism
NEW
Section
Tape Transport Mechanism Type
CWM43RR23
CX-JT8
2
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270 ˚C dur-
ing repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous ra-
diation exposure.
other than those specified herein may result in hazardous ra-
diation exposure.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK
0
OR DOTTED
LINE WITH MARK
0
ON THE SCHEMATIC DIAGRAMS
AND IN THE PARTS LIST ARE CRITICAL TO SAFE
OPERATION. REPLACE THESE COMPONENTS WITH
SONY PARTS WHOSE PART NUMBERS APPEAR AS
SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUB-
LISHED BY SONY.
OPERATION. REPLACE THESE COMPONENTS WITH
SONY PARTS WHOSE PART NUMBERS APPEAR AS
SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUB-
LISHED BY SONY.
CLASS 1 LASER PRODUCT
LUOKAN 1 LASER LAITE
KLASS 1 LASER APPARA
T
This appliance is classified
as a CLASS 1 LASER
product.
as a CLASS 1 LASER
product.
This label is located on the
rear exterior.
rear exterior.
CX-JT8
3
TABLE OF CONTENTS
1.
SERVICING NOTES
................................................
4
2.
GENERAL
Location of Controls .......................................................
7
3.
DISASSEMBLY
3-1. Disassembly Flow ...........................................................
9
3-2. Case (SIDE-L/R) ............................................................. 10
3-3. Case (Top) ....................................................................... 10
3-4. Tray Panel ........................................................................ 11
3-5. CD Mechanism Deck (CDM74F-K6BD71A) ................ 11
3-6. Front Panel Section ......................................................... 12
3-7. Mechanical Deck ............................................................. 12
3-8. Rear Cabinet Section ...................................................... 13
3-9. Main Board ...................................................................... 13
3-10. Power Board .................................................................... 14
3-11. Transformer Board .......................................................... 14
3-12 Table Assy ....................................................................... 15
3-13. Motor (TB) Board ........................................................... 15
3-14. Motor (LD) Board ........................................................... 16
3-15. Base Unit (BU-K6BD71A) ............................................. 16
3-16. Motor Gear Assy (Sled) (M701), BD Board .................. 17
3-17. Optical Pick-up (KSS-213D) .......................................... 17
3-3. Case (Top) ....................................................................... 10
3-4. Tray Panel ........................................................................ 11
3-5. CD Mechanism Deck (CDM74F-K6BD71A) ................ 11
3-6. Front Panel Section ......................................................... 12
3-7. Mechanical Deck ............................................................. 12
3-8. Rear Cabinet Section ...................................................... 13
3-9. Main Board ...................................................................... 13
3-10. Power Board .................................................................... 14
3-11. Transformer Board .......................................................... 14
3-12 Table Assy ....................................................................... 15
3-13. Motor (TB) Board ........................................................... 15
3-14. Motor (LD) Board ........................................................... 16
3-15. Base Unit (BU-K6BD71A) ............................................. 16
3-16. Motor Gear Assy (Sled) (M701), BD Board .................. 17
3-17. Optical Pick-up (KSS-213D) .......................................... 17
4.
TEST MODE
.............................................................. 18
5.
ELECTRICAL ADJUSTMENTS
CD Section ...................................................................... 21
6.
DIAGRAMS
6-1. Block Diagram – CD Section – ..................................... 22
6-2. Block Diagram – TUNER/TAPE/PANEL Section – ..... 23
6-3. Block Diagram – AMP/POWER SUPPLY Section – ... 24
6-4. Note for Printed Wiring Boards and
6-2. Block Diagram – TUNER/TAPE/PANEL Section – ..... 23
6-3. Block Diagram – AMP/POWER SUPPLY Section – ... 24
6-4. Note for Printed Wiring Boards and
Schematic Diagrams ....................................................... 25
6-5. Printed Wiring Board – BD Board – ............................. 26
6-6. Schematic Diagram – BD Board – ................................ 27
6-7. Printed Wiring Boards – CHANGER Section – ............ 28
6-8. Schematic Diagram – CHANGER Section – ................ 29
6-9. Schematic Diagram
6-6. Schematic Diagram – BD Board – ................................ 27
6-7. Printed Wiring Boards – CHANGER Section – ............ 28
6-8. Schematic Diagram – CHANGER Section – ................ 29
6-9. Schematic Diagram
– MAIN Board (1/4) (Suffix-11) – ................................. 30
6-10. Schematic Diagram
– MAIN Board (2/4) (Suffix-11) – ................................. 31
6-11. Schematic Diagram
– MAIN Board (3/4) (Suffix-11) – ................................. 32
6-12. Schematic Diagram
– MAIN Board (4/4) (Suffix-11) – ................................. 33
6-13. Printed Wiring Board – MAIN Board (Suffix-11) – ..... 34
6-14. Printed Wiring Board – MAIN Board (Suffix-13) – ..... 35
6-15. Schematic Diagram
6-14. Printed Wiring Board – MAIN Board (Suffix-13) – ..... 35
6-15. Schematic Diagram
– MAIN Board (1/4) (Suffix-13) – ................................. 36
6-16. Schematic Diagram
– MAIN Board (2/4) (Suffix-13) – ................................. 37
6-17. Schematic Diagram
– MAIN Board (3/4) (Suffix-13) – ................................. 38
6-18. Schematic Diagram
– MAIN Board (4/4) (Suffix-13) – ................................. 39
6-19. Printed Wiring Board – POWER Board –
(AEP, UK, CIS, E51 models) .......................................... 40
6-20. Printed Wiring Board – POWER Board –
(E, SP, AUS models) ....................................................... 41
6-21. Schematic Diagram – POWER Board (1/2) – ............... 42
6-22. Schematic Diagram – POWER Board (2/2) – ............... 43
6-23. Printed Wiring Boards – CD BUTTON/
6-22. Schematic Diagram – POWER Board (2/2) – ............... 43
6-23. Printed Wiring Boards – CD BUTTON/
HEADPHONE/MICROPHONE Boards – ..................... 44
6-24. Schematic Diagram – CD BUTTON/
HEADPHONE/MICROPHONE Boards – ..................... 45
6-25. Printed Wiring Board – PANEL Board – ...................... 46
6-26. Schematic Diagram – PANEL Board – ......................... 47
6-27. Printed Wiring Board – TRANSFORMER Board –
6-26. Schematic Diagram – PANEL Board – ......................... 47
6-27. Printed Wiring Board – TRANSFORMER Board –
(AEP, UK, CIS, E51 models) .......................................... 48
6-28. Printed Wiring Board – TRANSFORMER Board –
(E, SP, AUS models) ....................................................... 49
6-29. Schematic Diagram – TRANSFORMER Board –
(AEP, UK, CIS, E51 models) .......................................... 50
6-30. Schematic Diagram – TRANSFORMER Board –
(E, SP, AUS models) ....................................................... 51
6-31. IC Pin Function Description ........................................... 55
7.
EXPLODED VIEWS
7-1. Case Section .................................................................... 61
7-2. Front Panel Section-1 ...................................................... 62
7-3. Front Panel Section-2 ...................................................... 63
7-4. Front Panel Section-3 ...................................................... 64
7-5. Front Panel Section-4 ...................................................... 65
7-6. Chassis Section-1 ............................................................ 66
7-7. Chassis Section-2 ............................................................ 67
7-8. CD Mechanism Deck Section-1
7-2. Front Panel Section-1 ...................................................... 62
7-3. Front Panel Section-2 ...................................................... 63
7-4. Front Panel Section-3 ...................................................... 64
7-5. Front Panel Section-4 ...................................................... 65
7-6. Chassis Section-1 ............................................................ 66
7-7. Chassis Section-2 ............................................................ 67
7-8. CD Mechanism Deck Section-1
(CDM74F-K6BD71A) .................................................... 68
7-9. CD Mechanism Deck Section-2
(CDM74F-K6BD71A) .................................................... 69
7-10. CD Mechanism Deck Section-3
(CDM74F-K6BD71A) .................................................... 70
7-11. Base Unit Section (BU-K6BD71A) ............................... 71
8.
ELECTRICAL PARTS LIST
............................... 72
• Abbreviation
AUS : Australian model
E51 : Chilean and Peruvian models
SP
E51 : Chilean and Peruvian models
SP
: Singapore model
4
CX-JT8
SECTION 1
SERVICING NOTES
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electro-
static break-down because of the potential difference generated
by the charged electrostatic load, etc. on clothing and the human
body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
static break-down because of the potential difference generated
by the charged electrostatic load, etc. on clothing and the human
body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused
on the disc reflective surface by the objective lens in the optical
pick-up block. Therefore, when checking the laser diode emis-
sion, observe from more than 30 cm away from the objective lens.
on the disc reflective surface by the objective lens in the optical
pick-up block. Therefore, when checking the laser diode emis-
sion, observe from more than 30 cm away from the objective lens.
LASER DIODE AND FOCUS SEARCH OPERATION
CHECK
CHECK
Carry out the “S curve check” in “CD section adjustment” and
check that the S curve waveforms is output three times.
check that the S curve waveforms is output three times.
• MODEL IDENTIFICATION
– Back Panel –
– Back Panel –
MODEL
PART No.
Chilean and Peruvian models
4-245-109-0
[]
AEP, UK, CIS and Australian models
4-245-109-2
[]
E and Singapore models
4-245-109-7
[]
PART No.
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 ˚C higher than
• Unleaded solder melts at a temperature about 40 ˚C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 ˚C.
Caution: The printed pattern (copper foil) may peel away if the
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 ˚C.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscou-s (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges oc-
cur such as on IC pins, etc.
than ordinary solder so use caution not to let solder bridges oc-
cur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
also be added to ordinary solder.
D324
CN309
IC303
CN312
– MAIN BOARD (Conductor Side) –
•
DISCRIMINATION
Either type of the MAIN board, Part No. 1-688-080-11 or 1-688-
080-13 is used for Chilean and Peruvian models.
080-13 is used for Chilean and Peruvian models.
Note:
For other models, only one type of the MAIN board, Part No. 1-
688-080-13 is used.
688-080-13 is used.
How to identify the type is described below.
D324
Suffix-11
×
Suffix-13
a