CX-JE3, JAX-E3 - Sony Audio Service Manual (repair manual)

cx-je3, jax-e3 service manual
Model
CX-JE3 JAX-E3
Pages
64
Size
5.69 MB
Type
PDF
Document
Service Manual
Brand
Device
Audio
File
cx-je3-jax-e3.pdf
Date

Read Sony CX-JE3 / JAX-E3 Service Manual online

SERVICE MANUAL
Model Name Using Similar Mechanism
CX-JS3
CD Mechanism Type
CDM74S-K6BD71A
CD
Base Unit Name
BU-K6BD71A
Section
Optical Pick-up Block Name
KSM-213DCP
Optical Pick-up Name
KSS-213D
Tape deck
Model Name Using Similar Mechanism
CX-JS3
Section
Tape Transport Mechanism Type
CWM43FF13
COMPACT DISC DECK RECEIVER
AEP Model
CX-JE3
Ver. 1.2  2005.05
9-961-005-03
Sony Corporation
2005E05-1
Personal Audio Group
© 2005.05
Published by Sony Engineering Corporation
SPECIFICATIONS
CX-JE3 is the amplifier, CD player, tape deck
and tuner section in JAX-E3.
TUNER
FM tuning range
87.5 MHz to 108 MHz
FM usable sensitivity (IHF)
16.8 dBf
FM antenna terminal
75 ohms (unbalanced)
AM tuning range
531 kHz to 1602 kHz
AM usable sensitivity
350 
µV/m
AM antenna
Loop antenna
AMPLIFIER
Power output
Rated: 20 W + 20 W  (6 ohms, T.H.D.
1 %, 1 kHz/DIN 45500)
Reference: 25 W + 25 W (6 ohms,
T.H.D. 10 %, 1 kHz/DIN 45324)
MUSIC POWER: 50 W + 50 W
Total harmonic distortion
0.08 % (16 W, 1 kHz, 6 ohms, DIN
AUDIO)
Input
VIDEO/AUX: 400 mV
Outputs
SPEAKER: 6 ohms or more
PHONES: 32 ohms or more
CASSETTE DECK
Track format
4 tracks, 2 channels stereo
Frequency response
50 Hz – 8 kHz
Recording system
AC bias
Heads
Deck A: playback x 1
Deck B: recording/playback x 1,
erase x 1
CD PLAYER
Laser
Semiconductor laser (
λ = 780 nm)
Emission duration:
continuous
D/A converter
1 bit dual
Signal-to-noise ratio
85 dB (1 kHz, 0 dB)
Harmonic distortion
0.05 % (1 kHz, 0 dB)
GENERAL
Power requirements
230 V AC, 50/60 Hz
Power consumption
60 W
Power consumption
With ECO mode on: 0.25 W
  in standby mode
With ECO mode off: 15 W
Dimensions (W x H x D)
280 x 330 x 392.5 mm
Weight
6.5 kg
Specifications and external appearance are subject to change
without notice.
COPYRIGHT
Check copyright laws relevant to recordings from discs, tuner
or tape for the country where the unit is to be used.
Licensed by BBE Sound, Inc. under USP4638258, 5510752
and 5736897.
CX-JE3
2
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270 ˚C dur-
ing repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous ra-
diation exposure.
SAFETY-RELATED  COMPONENT  WARNING!!
COMPONENTS  IDENTIFIED  BY  MARK  
0
  OR  DOTTED
LINE  WITH  MARK  
0
  ON  THE  SCHEMATIC  DIAGRAMS
AND  IN  THE  PARTS  LIST  ARE  CRITICAL  TO  SAFE
OPERATION.  REPLACE  THESE  COMPONENTS  WITH
SONY  PARTS  WHOSE  PART  NUMBERS  APPEAR  AS
SHOWN  IN  THIS  MANUAL  OR  IN  SUPPLEMENTS  PUB-
LISHED  BY  SONY.
The following caution label is located inside the unit.
This appliance is classified as
a CLASS 1 LASER product.
The CLASS 1 LASER
PRODUCT MARKING is
located on the rear exterior.
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 ˚C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 ˚C.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscou-s (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges oc-
cur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
CX-JE3
3
TABLE  OF  CONTENTS
1.
SERVICING NOTES
................................................
4
2.
GENERAL
Location of Controls .......................................................
6
3.
DISASSEMBLY
3-1. Disassembly Flow ...........................................................
8
3-2. Case (SIDE-L/R) .............................................................
9
3-3. Case (Top) .......................................................................
9
3-4. Tray Panel ........................................................................ 10
3-5. CD Mechanism Deck (CDM74S-K6BD71A) ................ 10
3-6. Front Panel Section ......................................................... 11
3-7. Mechanical Deck (CWM43FF13) .................................. 11
3-8. Rear Cabinet Section ...................................................... 12
3-9. PT Board, MAIN Board .................................................. 12
3-10. Table Assy ....................................................................... 13
3-11. MOTOR (TB) Board ....................................................... 13
3-12. MOTOR (LD) Board ....................................................... 14
3-13. Base Unit (BU-K6BD71A) ............................................. 14
3-14. Motor Gear Assy (Sled) (M701), BD Board .................. 15
4.
TEST  MODE
.............................................................. 16
5.
ELECTRICAL  ADJUSTMENTS
CD Section ...................................................................... 17
6.
DIAGRAMS
6-1. Block Diagram  – CD Section – ..................................... 18
6-2. Block Diagram  – TUNER/TAPE/PANEL Section – ..... 19
6-3. Block Diagram  – AMP/POWER SUPPLY Section – ... 20
6-4. Note for Printed Wiring Boards and
Schematic Diagrams ....................................................... 21
6-5. Printed Wiring Board  – BD Section – ........................... 22
6-6. Schematic Diagram  – BD Section – .............................. 23
6-7. Printed Wiring Boards  – CHANGER Section – ............ 24
6-8. Schematic Diagram  – CHANGER Section – ................ 25
6-9. Schematic Diagram  – MAIN Section (1/4) – ................ 26
6-10. Schematic Diagram  – MAIN Section (2/4) – ................ 27
6-11. Schematic Diagram  – MAIN Section (3/4) – ................ 28
6-12. Schematic Diagram  – MAIN Section (4/4) – ................ 29
6-13. Printed Wiring Board  – MAIN Section – ...................... 30
6-14. Printed Wiring Board  – HP Section – ........................... 31
6-15. Schematic Diagram  – HP Section – .............................. 31
6-16. Printed Wiring Board  – PANEL Section – .................... 32
6-17. Schematic Diagram  – PANEL Section – ....................... 33
6-18. Printed Wiring Boards  – KEY Section – ....................... 34
6-19. Schematic Diagram  – KEY Section – ........................... 35
6-20. Printed Wiring Board  – PT Section – ............................ 36
6-21. Schematic Diagram  – PT Section – ............................... 37
6-22. IC Pin Function Description ........................................... 41
7.
EXPLODED  VIEWS
7-1. Case Section .................................................................... 43
7-2. Front Panel Section-1 ...................................................... 44
7-3. Front Panel Section-2 ...................................................... 45
7-4. Front Panel Section-3 ...................................................... 46
7-5. Front Panel Section-4 ...................................................... 47
7-6. Chassis Section ............................................................... 48
7-7. CD Mechanism Deck Section-1
(CDM74S-K6BD71A) .................................................... 49
7-8. CD Mechanism Deck Section-2
(CDM74S-K6BD71A) .................................................... 50
7-9. CD Mechanism Deck Section-3
(CDM74S-K6BD71A) .................................................... 51
7-10. Base Unit Section (BU-K6BD71A) ............................... 52
8.
ELECTRICAL  PARTS  LIST
............................... 53
4
CX-JE3
SECTION  1
SERVICING  NOTES
NOTES  ON  HANDLING  THE  OPTICAL  PICK-UP
BLOCK  OR  BASE  UNIT
The laser diode in the optical pick-up block may suffer electro-
static break-down because of the potential difference generated
by the charged electrostatic load, etc. on clothing and the human
body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused
on the disc reflective surface by the objective lens in the optical
pick-up block. Therefore, when checking the laser diode emis-
sion, observe from more than 30 cm away from the objective lens.
LASER  DIODE  AND  FOCUS  SEARCH  OPERATION
CHECK
Carry out the “S curve check” in “CD section adjustment” and
check that the S curve waveforms is output three times.
HOW  TO  OPEN  THE  DISC  TRAY  WHEN  POWER  SWITCH  TURNS  OFF.
3
Pull-out the disc tray.
1
Remove the case (side-L).
2
Turn the loading gear in the direction of arrow 
A
.
A
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Here you can read online and download Sony CX-JE3 / JAX-E3 Service Manual in PDF. CX-JE3 / JAX-E3 service manual will guide through the process and help you recover, restore, fix, disassemble and repair Sony CX-JE3 / JAX-E3 Audio. Information contained in service manuals typically includes schematics / circuit diagrams, wiring diagrams, block diagrams, printed wiring boards, exploded views, parts list, disassembly / assembly, pcb.