CMT-V75BTIP - Sony Audio Service Manual (repair manual)

2013E33-1

© 

2013.05

Model Name Using Similar Mechanism

NEW

CD Mechanism Type

BSXD1-DVBU201

Optical Pick-up Block Name

CMS-S76RFS3G

Power output (rated): 16 watts + 16 watts (8 ohms at 1 kHz, 1% THD)
Continuous RMS power output (reference): 20 watts + 20 watts (8 ohms at 
1 kHz, 10% THD)

AUDIO IN (stereo mini jack): Sensitivity 700 mV, impedance 47 kilohms

PHONES (stereo mini jack): Accepts headphones of 8 ohms or more

CD player section
System: Compact disc and digital audio system
Laser Diode Properties

Emission Duration: Continuous
Laser Output*: Less than 44.6 μW
* This output is the value measurement at a distance of 200 mm from the 

objective lens surface on the Optical Pick-up Block with 7 mm aperture.

Frequency response: 20 Hz   20 kHz
Signal-to-noise ratio: More than 90 dB
Dynamic range: More than 90 dB

FM stereo, FM superheterodyne tuner
Antenna: FM lead antenna
Tuning range:

87.5 MHz   108.0 MHz (50 kHz step)

DAB/DAB+ tuner section:

FM stereo, DAB/FM superheterodyne tuner
Frequency range*
Band-III: 174.928 (5A) MHz   239.200 (13F) MHz
* For details, see “DAB/DAB+ frequency table” below.
Antenna: DAB/FM lead antenna
The DAB/DAB+ services are available only in countries/regions that 
support DAB/DAB+ services.

DAB/DAB+ frequency table (Band-III)

174.928 MHz

5A

209.936 MHz

10A

176.640 MHz

5B

211.648 MHz

10B

178.352 MHz

5C

213.360 MHz

10C

180.064 MHz

5D

215.072 MHz

10D

181.936 MHz

6A

216.928 MHz

11A

183.648 MHz

6B

218.640 MHz

11B

185.360 MHz

6C

220.352 MHz

11C

187.072 MHz

6D

222.064 MHz

11D

188.928 MHz

7A

223.936 MHz

12A

190.640 MHz

7B

225.648 MHz

12B

192.352 MHz

7C

227.360 MHz

12C

194.064 MHz

7D

229.072 MHz

12D

195.936 MHz

8A

230.784 MHz

13A

197.648 MHz

8B

232.496 MHz

13B

199.360 MHz

8C

234.208 MHz

13C

201.072 MHz

8D

235.776 MHz

13D

202.928 MHz

9A

237.488 MHz

13E

204.640 MHz

9B

239.200 MHz

13F

206.352 MHz

9C

208.064 MHz

9D

* Frequencies are displayed to two decimal places on this system.

iPod/iPhone/iPad section
Compatible iPod/iPhone/iPad models:

 iPod touch 4th generation
 iPod touch 3rd generation
 iPod touch 2nd generation
 iPod nano 6th generation
 iPod nano 5th generation (video camera)
 iPod nano 4th generation (video)
 iPod nano 3rd generation (video)
 iPod classic 160 GB (2009)

iPhone 4S
iPhone 4
iPhone 3GS
iPhone 3G
iPad2
iPad

“Made for iPod,” “Made for iPhone,” and “Made for iPad” mean that an 
electronic accessory has been designed to connect specifically to iPod, iPhone, 
or iPad, respectively, and has been certified by the developer to meet Apple 
performance standards. Apple is not responsible for the operation of this 
device or its compliance with safety and regulatory standards. Please note 
that the use of this accessory with iPod, iPhone, or iPad may affect wireless 
performance.

Bluetooth section
Communication system:

Bluetooth Standard version 2.1+EDR (Enhanced Data Rate)

Output:

Bluetooth Standard Power Class 2

Maximum communication range:

Line of sight approx. 10 m

*1

Frequency band:

2.4 GHz band (2.4000 GHz - 2.4835 GHz)

Modulation method:

FHSS

Compatible Bluetooth profiles

*2

:

A2DP (Advanced Audio Distribution Profile)
AVRCP 1.3 (Audio Video Remote Control Profile)

Supported codecs:

Receive: SBC (Sub Band Codec)
Transmit: SBC (Sub Band Codec)

1)

 The actual range will vary depending on factors such as obstacles between 

devices, magnetic fields around a microwave oven, static electricity, 
reception sensitivity, antenna’s performance, operating system, software 
application, etc.

2)

 Bluetooth standard profiles indicate the purpose of Bluetooth 

communication between devices.

Full-range speaker: 65 mm, cone type
Passive radiator: 67 mm × 108 mm

Rated impedance: 8 ohms

General
Power requirements:

AC adapter

Input: 100 V   240 V AC, 50/60 Hz
Output: DC 19.5 V 3.9A

Power consumption: 32 watts
Dimensions (W/H/D): 

Approx. 449 mm × 212 mm × 137 (95) mm (incl. protruding parts)

Mass: Approx. 2.8 kg
Quantity of the main unit: 1 piece

Supplied accessories: Remote Commander (1), AC adapter (1), 
Power cord (1), DAB/FM lead antenna (1), Protective cushion (2), 
R6 (Size AA) batteries (2)

Design and specifications are subject to change without notice.

Standby power consumption: 0.5 W

NOTES  ON  CHIP  COMPONENT  REPLACEMENT
• 

Never reuse a disconnected chip component.

• 

Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.

0  OR  DOTTED  LINE  

0  ON  THE  SCHEMATIC  DIAGRAMS  AND  IN  

This appliance is classified 
as a CLASS 1 LASER 
product. This marking 
is located on the bottom 
exterior of the unit.

CAUTION
Use of controls or adjustments or performance of procedures 
other than those specifi ed herein may result in hazardous radia-
tion exposure.

iPhone, iPod, iPod classic, iPod nano, and iPod touch 
are trademarks of Apple Inc., registered in the U.S. and 
other countries. iPad is a trademark of Apple Inc.
MPEG Layer-3 audio coding technology and patents 
licensed from Fraunhofer IIS and Thomson.
Windows Media is either a registered trademark or 
trademark of Microsoft Corporation in the United 
States and/or other countries.
This product is protected by certain intellectual 
property rights of Microsoft Corporation. Use or 
distribution of such technology outside of this product 
is prohibited without a license from Microsoft or an 
authorized Microsoft subsidiary.
All other trademarks and registered trademarks are 
of their respective holders. In this manual, 

™

 and 

®

 

marks are not specified.

 .............................................  

4

2-1. Disassembly 

Flow 

...........................................................   7

2-2.  Panel (Bottom) Block .....................................................   8
2-3. Dock 

Block 

.....................................................................   9

2-4. Case 

(Dock 

Top) 

.............................................................   9

2-5.  Case (Dock Bottom) .......................................................   10
2-6.  Panel (Dock Top IP) Block .............................................   10
2-7. Spring 

(Loading) 

.............................................................  11

2-8. Lever 

(Cam) 

....................................................................  11

2-9. Spring 

(Lid) 

.....................................................................  12

2-10. Spring (Foot) ...................................................................   12
2-11.  D LED R Board, D LED L Board, IP JUNC Board .......   13
2-12. Spring (Lock) ..................................................................   14
2-13.  IP DOCK Board ..............................................................   14
2-14. Front Block .....................................................................   15
2-15.  Chassis (Main) Block ......................................................   16
2-16. RMC Board .....................................................................   17
2-17.  Loudspeaker (67 × 108 mm) (L/R-ch) (SP3, SP4) .........   17
2-18.  Loudspeaker (6.5 cm) (L/R-ch) (SP1, SP2) ....................   18
2-19. Top Block ........................................................................   19
2-20.  Soldering of Short-land ...................................................   19
2-21.  DAB Board, Module (DAB Tuner) (DAB1) ..................   20
2-22. LCD Board ......................................................................   20
2-23.  JACK Board Block .........................................................   21
2-24. JACK Board ....................................................................   21
2-25. MAIN Board ...................................................................   22
2-26.  CD Mechanism Deck Block ...........................................   23
2-27.  BT Board, Plate (Balance) ..............................................   24
2-28. FFC Guide .......................................................................   24
2-29. Bottom Cover ..................................................................   25
2-30. Loading Assy ..................................................................   26
2-31.  Optical Pick-up Block (CMS-S76RFS3G) (OP1) ..........   26
2-32.  How to Bend Wire (Flat Type) ........................................   27

 ............................................................   29

 ......................................   31

5-1.  Block Diagram - CD Section - ........................................   32
5-2.  Block Diagram - AUDIO Section - .................................   33

5-3. Block 

Diagram 

- PANEL/POWER SUPPLY Section - ............................   34

5-4.  Printed Wiring Boards - MAIN Section (1/2) - ..............   36
5-5.  Printed Wiring Board - MAIN Section (2/2) - ................   37
5-6.  Schematic Diagram - MAIN Section (1/7) - ...................   38
5-7.  Schematic Diagram - MAIN Section (2/7) - ...................   39
5-8.  Schematic Diagram - MAIN Section (3/7) - ...................   40
5-9.  Schematic Diagram - MAIN Section (4/7) - ...................   41
5-10.  Schematic Diagram - MAIN Section (5/7) - ...................   42
5-11.  Schematic Diagram - MAIN Section (6/7) - ...................   43
5-12.  Schematic Diagram - MAIN Section (7/7) - ...................   44
5-13.  Printed Wiring Board - SHORTLAND Board - ..............   45
5-14.  Schematic Diagram - SHORTLAND Board - ................   45
5-15.  Printed Wiring Board - DAB Board - .............................   46
5-16.  Schematic Diagram - DAB Board - ................................   47
5-17.  Printed Wiring Boards - DOCK Section - ......................   48
5-18.  Schematic Diagram - DOCK Section - ...........................   49
5-19.  Printed Wiring Board - JACK Board - ............................   50
5-20.  Schematic Diagram - JACK Board - ..............................   51
5-21.  Printed Wiring Boards - PANEL Section - .....................   52
5-22.  Schematic Diagram - PANEL Section - ..........................   53

6-1.  Panel (Bottom) Section ...................................................   63
6-2. Dock 

Section 

...................................................................  64

6-3.  IP DOCK Board Section .................................................   65
6-4.  Front Panel Section .........................................................   66
6-5.  FUNC LED, RMC Board Section ..................................   67
6-6.  Panel (Top) Section .........................................................   68
6-7.  LCD Board Section .........................................................   69
6-8.  JACK Board Section .......................................................   70
6-9.  MAIN Board Section ......................................................   71
6-10.  CD Mechanism Deck Section .........................................   72
6-11. Loudspeaker Section .......................................................   73
6-12.  Panel (Back) Section .......................................................   74

 ..............................   75

Accessories are given in the last of the electrical parts list.

UNLEADED  SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution:  Some printed circuit boards may not come printed with 

the lead free mark due to their particular size)

Unleaded solder has the following characteristics.
•  Unleaded solder melts at a temperature about 40 °C higher 

than ordinary solder.

 

Ordinary soldering irons can be used but the iron tip has to be 
applied to the solder joint for a slightly longer time.

 

Soldering irons using a temperature regulator should be set to 
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if 

the heated tip is applied for too long, so be careful!

• Strong 

viscosity

 

Unleaded solder is more viscous (sticky, less prone to fl ow) 
than ordinary solder so use caution not to let solder bridges 
occur such as on IC pins, etc.

• 

Usable with ordinary solder

 

It is best to use only unleaded solder but unleaded solder may 
also be added to ordinary solder.

The laser diode in the optical pick-up block may suffer electro-
static break-down because of the potential difference generated by 
the charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also 
use the procedure in the printed matter which is included in the 
repair parts.
The fl exible board is easily damaged and should be handled with 
care.

NOTES  ON  LASER  DIODE  EMISSION  CHECK
The laser beam on this model is concentrated so as to be focused 
on the disc refl ective surface by the objective lens in the optical 
pickup block. Therefore, when checking the laser diode emission, 
observe from more than 30 cm away from the objective lens.

RELEASING  THE  DISC  SLOT  LOCK
The disc slot lock function for the antitheft of an demonstration 
disc in the store is equipped.

Releasing Procedure:
1.  Press the [

?/1

] button to turn the power on.

2.  Touch the [FUNCTION] sensor to turn the CD function.
3.  Touch the [x] sensor and press the [Z] button simultaneously 

for fi ve seconds.

4.  The message “UNLOCKED” is displayed on the liquid crystal 

display and the disc slot is unlocked.

Note: When “LOCKED” is displayed, the disc slot lock is not released by 

turning power on/off with the [?/1] button.

NOTE  OF  REPLACING  THE  BT  BOARD
When the BT board is defective, exchange the complete mounted 
board.

NOTE  OF  REPLACING  THE  MS-486  BOARD
When the MS-486 board is defective, exchange the LOADING 
ASSY (IM) (LOM1).

NOTE  OF  REPLACING  THE  TOUCH  KEY  BOARD
When the TOUCH KEY board is defective, exchange the TOP 
ASSY (TOP1).

NOTE  OF  REPLACING  THE  IC401,  IC502,  IC504,  IC801,  
IC901,  IC902  AND  IC903  ON  THE  MAIN  BOARD
IC401, IC502, IC504, IC801, IC901, IC902 and IC903 on the 
MAIN board cannot exchange with single. When these parts are 
damaged, exchange the complete mounted board.

CHECKING  THE  OPERATION  AFTER  REPAIR
After repair completion, connect the “iPod” etc. corresponding to 
this unit, and check the operation of playback, recording, charge, 
etc.

TEST  DISCS
Use following TEST DISC (for CD) when this unit confi rms the 
operation and checks it.

Part No.

   

Description

3-702-101-01 DISC 

(YEDS-18), 

TEST

4-225-203-01 DISC 

(PATD-012), 

TEST

AEP

z

–

UK

z

z

Australian

z

–

HOW  TO  EJECT  THE  DISC  WHEN  POWER  SWITCH  
TURN  OFF
•  Refer to “SECTION 2. DISASSEMBLY”, remove the CD 

mechanism deck from the unit.