CMT-U1, HCD-U1 - Sony Audio Service Manual (repair manual)

AEP Model

UK Model

E Model

2006J16-1
© 2006.10

HCD-U1 is the Amplifier, CD player, USB and
Tuner section in CMT-U1.

Model Name Using Similar Mechanism

NEW

CD

Base Unit Name

BU-F4BD83S-WOD

Section

Optical Pick-up Name

KSM-215CFP/C2NP

Amplifier section
European model:

DIN power output (rated): 20 + 20 watts
(6 ohms at 1 kHz, DIN)
Continuous RMS power output (reference):
25 + 25 watts (6 ohms at 1 kHz, 10% THD)
Music power output (reference):
25 + 25 watts (6 ohms at 1 kHz, 10% THD)

Other models:

DIN power output (rated): 20 + 20 watts
(6 ohms at 1 kHz, DIN)
Continuous RMS power output (reference):
25 + 25 watts (6 ohms at 1 kHz, 10% THD)

Inputs:

AUDIO IN (stereo mini jack):
voltage 620 mV, impedance 47 kilohms

 (USB) port: Type A, maximum current

500 mA

Outputs:

i

 (PHONES (stereo mini jack)):

accepts headphones of 8 ohms or more
SPEAKER: accepts impedance of 6 ohms

USB section
Supported bit rate

MP3 (MPEG 1 Audio Layer-3):
32 – 320 kbps, VBR
ATRAC: 48 – 352 kbps (ATRAC3 plus),
66/105/132 kbps (ATRAC3)
WMA: 48 – 192 kbps, VBR
AAC: 48 – 320 kbps

Sampling frequencies

MP3 (MPEG 1 Audio Layer-3):
32/44.1/48 kHz
ATRAC: 44.1 kHz
WMA: 44.1 kHz
AAC: 44.1 kHz

CD player section
System: Compact disc and digital audio system
Laser Diode Properties

Emission duration: continuous
Laser Output*: Less than 44.6

µ

W

* This output is the value measurement at a

distance of 200mm from the objective lens
surface on the Optical Pick-up Block with
7mm aperture.

Frequency response: 20 Hz – 20 kHz

Tuner section
FM stereo, FM/AM superheterodyne tuner

FM tuner section:
Tuning range
87.5 – 108.0 MHz (50 kHz step)
Antenna: FM lead antenna
Antenna terminals: 75 ohms unbalanced
Intermediate frequency: 10.7 MHz

AM tuner section:
Tuning range
European model:

531 – 1,602 kHz (with 9 kHz tuning interval)

Latin American model:

530 – 1,710 kHz (with 10 kHz tuning
interval)
531 – 1,710 kHz (with 9 kHz tuning interval)

Antenna: AM loop antenna, external antenna

terminal

Intermediate frequency: 450 kHz

General
Power requirements
European model:

AC 220 – 240 V, 50/60 Hz

Latin American models:

AC 120 – 127 or 220 – 240 V, 50/60 Hz,
Adjustable with voltae selector

Power consumption: 35 watts
Dimensions (w/h/d) (excl. speakers):

Approx. 160 

×

 241 

×

 218 mm

Mass (excl. speakers) 3.2 kg

Design and specifications are subject to change
without notice.

US and foreign patents licensed from
Dolby Laboratories.

2

................................................

3

...................................................................

5

3-1.

Disassembly Flow ...........................................................

8

3-2.

Back Cover ......................................................................

9

3-3.

Top Panel Assy ................................................................

9

3-4.

Front Panel Assy .............................................................. 10

3-5.

PANEL Board .................................................................. 11

3-6.

SMASTER Board ............................................................ 12

3-7.

SW POWER Board ......................................................... 13

3-8.

Tuner ................................................................................ 14

3-9.

REG Board ...................................................................... 14

3-10. MAIN Board .................................................................... 15
3-11. CD Mechanism Deck (CDM80BT-F4BD83S-WOD) ..... 15
3-12. USB Board, HP Board ..................................................... 16
3-13. SP Board, VOLTAGE SELECTOR Board (E51) ............ 17
3-14. Chassis (TOP) .................................................................. 17
3-15. Lever (Loading R/L) ........................................................ 18
3-16. Disc Stop Lever, Disc Sensor Lever ................................ 19
3-17. DRIVER Board ............................................................... 19
3-18. BD83S Board, Optical Pick-up (KSM-215CFP) ............ 20
3-19. Holder (BU215T) Assy ................................................... 21
3-20. Lever (BU Lock) ............................................................. 21
3-21. Close Lever ...................................................................... 22
3-22. Lever (Dir), Gear (Idl-b) .................................................. 22
3-23. Gear (IDL-C) ................................................................... 23

............................................................... 24

.......................... 25

6-1.

Block Diagram — BD/DRIVER Section — .................. 28

6-2.

Block Diagram — FRONT Section — .......................... 29

0

0

6-3.

Block Diagram — AUDIO Section — ........................... 30

6-4.

Block Diagram — AMP Section — ............................... 31

6-5.

Block Diagram — POWER Section — .......................... 32

6-6.

Printed Wiring Board — BD83S Section — .................. 33

6-7.

Schematic Diagram — BD83S Section — ..................... 34

6-8.

Printed Wiring Board — DRIVER Section — ............... 35

6-9.

Schematic Diagram — DRIVER Section — ................. 35

6-10. Printed Wiring Board — MAIN Section — ................... 36
6-11. Schematic Diagram — MAIN Section (1/2) — ............. 37
6-12. Schematic Diagram — MAIN Section (2/2) — ............. 38
6-13. Printed Wiring Board — SMASTER Section — ........... 39
6-14. Schematic Diagram — SMASTER Section — .............. 40
6-15. Printed Wiring Board — PANEL Section — ................. 41
6-16. Schematic Diagram — PANEL Section — .................... 42
6-17. Printed Wiring Board — USB Section — ...................... 43
6-18. Schematic Diagram — USB Section — ......................... 44
6-19. Printed Wiring Boards — HP, SP, REG Section — ....... 45
6-20. Schematic Diagram — HP, SP Section — ..................... 46
6-21. Printed Wiring Board — SW POWER Section — ......... 47
6-22. Schematic Diagram — SW POWER Section — ........... 48

7-1.

Overall Section ................................................................ 63

7-2.

Front Panel Section ......................................................... 64

7-3.

AMP Section ................................................................... 65

7-4.

MAIN Section ................................................................. 66

7-5.

CD Mechanism Deck Section-1
(CDM80BT-F4BD83S-WOD) ........................................ 67

7-6.

CD Mechanism Deck Section-2
(CDM80BT-F4BD83S-WOD) ........................................ 68

7-7.

CD Mechanism Deck Section-3
(CDM80BT-F4BD83S-WOD) ........................................ 69

7-8.

Base Unit Section (BU-F4BD83S-WOD) ....................... 70

.................................. 71

•

Abbreviation
E51 : Chilean and Peruvian models

3

•

Never reuse a disconnected chip component.

•

Notice that the minus side of a tantalum capacitor may be
damaged by heat.

•

Keep the temperature of the soldering iron around 270 

°

C

during repairing.

•

Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).

•

Be careful not to apply force on the conductor when soldering
or unsoldering.

Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radiation
exposure.

Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with

the lead free mark due to their particular size.)

Unleaded solder has the following characteristics.

•

Unleaded solder melts at a temperature about 40 

°

C higher

than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 

°

C.

Caution: The printed pattern (copper foil) may peel away if

the heated tip is applied for too long, so be careful!

•

Strong viscosity
Unleaded solder is more viscou-s (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.

•

Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.

The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.

The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.

This appliance is classified as a
CLASS 1 LASER product.
The CLASS 1 LASER PRODUCT
MARKING is located on the rear
exterior.

Laser component in this product is capable of emitting radiation
exceeding the limit for Class 1.

This mode is used to unable to take sample disc out of disc table in
the shop.
Procedure:

1. Press the

@/1

button to turn the power on.

2. Press the  

CD 

u 

 button to select “CD”.

3. Press two buttons of

x 

CANCEL

 

 and

Z

for 5 seconds.

4. The message “CD LOCKED” is displayed on the fluorescent

indicator tube and the disc slot is locked. (Even if pressing
the

Z

button, the message “CD LOCKED” is displayed on

the fluorescent indicator tube and the disc table is locked.)

5. To release from this mode, press two buttons of

x 

CANCEL

and

Z

for 5 seconds.

6. The message “CD UNLOCKED” is displayed on the fluores-

cent indicator tube and the disc table is unlocked.

*

•

The voltage and waveform of CSP (chip size package) cannot
be measured, because its lead layout is different from that of
conventional IC.

•

Lead layouts

New part of EEP ROM (IC6) on the USB board cannot be used.  Therefore,
if the mounted USB board (X-2149-040-1) is replaced, exchange new

EEP ROM (IC6) with that used before the replacement.

surface

Lead layout of
conventional IC

CSP (chip size package)

• Abbreviation

E51 : Chilean and Peruvian models

Parts No.

AEP, UK models

2-683-391-0

[]

E51 model

2-683-399-0

[]

4

CD mechanism deck 
(CDM80BT-F4BD83S-WOD)

movable block

MAIN board

work stand or 
on a spacer 

Be sure to place the mechanism deck on a work 
stand or on a spacer so that the movable block 
does not receive any physical stress.

•