Read Sony CMT-SX2D / HCD-SX2D Service Manual online
SERVICE MANUAL
Sony Corporation
Personal Audio Division
Published by Sony Techno Create Corporation
Published by Sony Techno Create Corporation
E Model
DVD DECK RECEIVER
9-887-288-03
2006H16-1
© 2006.08
© 2006.08
Ver. 1.2 2006.08
SPECIFICATIONS
HCD-SX2D
HCD-SX2D is the Amplifier, DVD player, Tape
Deck and Tuner section in CMT-SX2D.
Deck and Tuner section in CMT-SX2D.
This system incorporates Dolby
1)
Digital and DTS
2)
Digital
Surround System.
1)
Manufactured under license from Dolby Laboratories.
“Dolby”, “Pro Logic”, and the double-D symbol are trademarks
of Dolby Laboratories.
of Dolby Laboratories.
2)
Manufactured under license from Digital Theater Systems,
Inc. “DTS” and “DTS 2.0 + Digital Out” are trademarks of
Digital Theater Systems, Inc.
Digital Theater Systems, Inc.
Amplifier section
Inputs
TV IN (phono jacks):
TV IN (phono jacks):
voltage 1 V,
impedance 47 kilohms
impedance 47 kilohms
MIC (phone jack):
sensitivity 1 mV,
impedance 10 kilohms
impedance 10 kilohms
Outputs
VIDEO OUT (phono jack):max. output level
VIDEO OUT (phono jack):max. output level
1 Vp-p, unbalanced, Sync
negative, load impedance
75 ohms
negative, load impedance
75 ohms
COMPONENT VIDEO OUT:
Y: 1 Vp-p, 75 ohms
P
P
B
, P
R
: 0.7 Vp-p, 75 ohms
DIGITAL OUT (OPTICAL) (Square optical connector
jack, rear panel)
Wavelength
jack, rear panel)
Wavelength
660 nm
PHONES (stereo mini jack):
accepts headphones of
8 ohms or more
8 ohms or more
SPEAKER:
accepts impedance of
6 ohms
6 ohms
Disc player section
System
Compact disc and digital
audio and video system
audio and video system
Laser
Semiconductor laser
(DVD:
(DVD:
λ=650 nm,
CD:
λ=790 nm)
Emission duration:
continuous
continuous
Frequency response
DVD (PCM 48 kHz):
2 Hz – 22 kHz (
2 Hz – 22 kHz (
±1 dB)
CD: 2 Hz – 20 kHz (
±1 dB)
Video color system format NTSC, PAL
Tape deck section
Recording system
4-track 2-channel stereo
Frequency response
40 – 13,000 Hz,
using Sony TYPE I
cassette
using Sony TYPE I
cassette
Tuner section
FM stereo, FM/AM superheterodyne tuner
FM tuner section
Tuning range
87.5 – 108.0 MHz
(50 kHz step)
(50 kHz step)
Antenna
FM lead antenna
Antenna terminals
75 ohms unbalanced
Intermediate frequency
10.7 MHz
AM tuner section
Tuning range
530 – 1,710 kHz
(with the tuning interval
set at 10 kHz)
531 – 1,602 kHz
(with the tuning interval
set at 9 kHz)
(with the tuning interval
set at 10 kHz)
531 – 1,602 kHz
(with the tuning interval
set at 9 kHz)
Antenna
AM loop antenna
Antenna terminals
External antenna terminal
Intermediate frequency
450 kHz
General
Korean and Thai models:
The following measured at AC 220 V, 60 Hz
DIN power output (rated): 35 + 35 watts
DIN power output (rated): 35 + 35 watts
(6 ohms at 1 kHz, DIN)
Continuous RMS power output (reference):
45 + 45 watts
(6 ohms at 1 kHz, 10%
THD)
(6 ohms at 1 kHz, 10%
THD)
E3, SP models:
The following measured at AC 120 V, 240 V, 50/60 Hz
DIN power output (rated): 40 + 40 watts
DIN power output (rated): 40 + 40 watts
(6 ohms at 1 kHz, DIN)
Continuous RMS power output (reference):
50 + 50 watts
(6 ohms at 1 kHz, 10%
THD)
(6 ohms at 1 kHz, 10%
THD)
Power requirements
Thai model:
220 V AC, 50/60 Hz
Korean model:
220 V AC, 60 Hz
E3, SP models:
110 – 120 V, 220 – 240 V
AC, 50/60 Hz
Adjustable with voltage
selector
AC, 50/60 Hz
Adjustable with voltage
selector
DVD
Model Name Using Similar Mechanism
NEW
Section
DVD Mechanism Type
WXD
Optical Pick-up Name
DM3451-A (SF-HD65F)
TAPE
Model Name Using Similar Mechanism
NEW
Section
Tape Transport Mechanism Type
CMAL5Z220C
— Continued on next page —
• Abbreviation
E3 : 240 V AC Area in E model
SP : Singapore model
E3 : 240 V AC Area in E model
SP : Singapore model
2
HCD-SX2D
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radiation
exposure.
other than those specified herein may result in hazardous radiation
exposure.
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350
°C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscou-s (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
also be added to ordinary solder.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270 °C
during repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK
0
OR DOTTED LINE
WITH MARK
0
ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
Laser component in this product is capable of emitting radiation
exceeding the limit for Class 1.
exceeding the limit for Class 1.
This appliance is classified as
a CLASS 1 LASER product.
The CLASS 1 LASER
PRODUCT MARKING is
located on the rear exterior.
a CLASS 1 LASER product.
The CLASS 1 LASER
PRODUCT MARKING is
located on the rear exterior.
Dimensions (w/h/d) (excl. speakers)
Approx. 190
× 250 ×
310 mm
Approx. 190
× 250 ×
301 mm
Mass (excl. speakers)
Approx. 5.9 kg
Design and specifications are subject to change
without notice.
without notice.
Power consumption
Korean and Thai models:
Korean and Thai models:
Korean model:
Other models:
110 watts
E3, SP models:
120 watts
Ver. 1.2
3
HCD-SX2D
TABLE OF CONTENTS
1.
SERVICING NOTES
................................................
4
2.
GENERAL
...................................................................
7
3.
DISASSEMBLY
3-1.
Disassembly Flow ........................................................... 10
3-2.
Top Cover, DC Fan .......................................................... 11
3-3.
AMP Board, AV Board, Tuner (FM/AM) ....................... 11
3-4.
MPEG Board ................................................................... 12
3-5.
MPEG Holder .................................................................. 12
3-6.
Panel (DVD) .................................................................... 13
3-7.
DVD Loader (DVD Mechanism) .................................... 13
3-8.
Front Panel Section ......................................................... 14
3-9.
Cassette Mechanism Deck (CMAL5Z220C) .................. 14
3-10. KEY Board ...................................................................... 15
3-11. HP Board, MIC Board ..................................................... 15
3-12. MAIN Board .................................................................... 16
3-13. POWER Board ................................................................ 16
3-14. Panel Cass (Cassette) ....................................................... 17
3-11. HP Board, MIC Board ..................................................... 15
3-12. MAIN Board .................................................................... 16
3-13. POWER Board ................................................................ 16
3-14. Panel Cass (Cassette) ....................................................... 17
4.
TEST MODE
............................................................... 18
5.
MECHANICAL ADJUSTMENTS
......................... 19
6.
ELECTRICAL ADJUSTMENTS
.......................... 19
7.
DIAGRAMS
7-1.
Block Diagram — MPEG-1 Section — ......................... 22
7-2.
Block Diagram — MPEG-2 Section — ......................... 23
7-3.
Block Diagram — AUDIO Section — ........................... 24
7-4.
Block Diagram — PANEL/POWER Section — ............ 25
7-5.
Printed Wiring Board — MAIN Section — ................... 26
7-6.
Schematic Diagram — MAIN Section (1/3) — ............. 27
7-7.
Schematic Diagram — MAIN Section (2/3) — ............. 28
7-8.
Schematic Diagram — MAIN Section (3/3) — ............. 29
7-9.
Printed Wiring Board — MPEG Section (Side A) — .... 30
7-10. Printed Wiring Board — MPEG Section (Side B) — .... 31
7-11. Schematic Diagram — MPEG Section (1/3) — ............ 32
7-12. Schematic Diagram — MPEG Section (2/3) — ............ 33
7-13. Schematic Diagram — MPEG Section (3/3) — ............ 34
7-14. Printed Wiring Boards — KEY Section — .................... 35
7-15. Schematic Diagram — KEY Section — ........................ 36
7-16. Printed Wiring Board — AV Section — ......................... 37
7-17. Schematic Diagram — AV Section — ........................... 37
7-18. Printed Wiring Board — AMP Section — ..................... 38
7-19. Schematic Diagram — AMP Section — ........................ 39
7-20. Printed Wiring Board
7-11. Schematic Diagram — MPEG Section (1/3) — ............ 32
7-12. Schematic Diagram — MPEG Section (2/3) — ............ 33
7-13. Schematic Diagram — MPEG Section (3/3) — ............ 34
7-14. Printed Wiring Boards — KEY Section — .................... 35
7-15. Schematic Diagram — KEY Section — ........................ 36
7-16. Printed Wiring Board — AV Section — ......................... 37
7-17. Schematic Diagram — AV Section — ........................... 37
7-18. Printed Wiring Board — AMP Section — ..................... 38
7-19. Schematic Diagram — AMP Section — ........................ 39
7-20. Printed Wiring Board
— POWER Section (Except KR) — ............................... 40
7-21. Schematic Diagram
— POWER Section (Except KR) — ............................... 41
8.
EXPLODED VIEWS
8-1.
Overall Section ................................................................ 51
8-2.
Front Panel Section ......................................................... 52
8-3.
Chassis Section ................................................................ 53
8-4.
DVD Mechanism Deck Section ...................................... 54
9.
ELECTRICAL PARTS LIST
.................................. 55
Ver. 1.2
• Abbreviation
KR
: Korean model
4
HCD-SX2D
SECTION 1
SERVICING NOTES
The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
BLOCK OR BASE UNIT
MODEL IDENTIFICATION
– Back Panel –
– Back Panel –
Parts No.
• Abbreviation
E3 : 240 V AC Area in E model
KR : Korean model
SP : Singapore model
TH : Thai model
KR : Korean model
SP : Singapore model
TH : Thai model
• SERVICE POSITION OF THE TAPE CASSETTE MECHANISM DECK
DISC TRAY LOCK
The disc tray lock function for the antitheft of an demonstration
disc in the store is equipped.
Procedure :
disc in the store is equipped.
Procedure :
1. Press the ?/1 button to turn the set ON.
2. Press the DVD u button to select “DVD”
3. Set disc on the tray, press the x button and the Z button
2. Press the DVD u button to select “DVD”
3. Set disc on the tray, press the x button and the Z button
simultaneously for five seconds.
4. The message “LOCKED” is displayed the tray is locked.
5. To release from this mode, press the x button and the Z
5. To release from this mode, press the x button and the Z
button simultaneously for five seconds again.
6. The message “UNLOCKED” is displayed and the tray is
unlocked.
Note:
When “LOCKED” is displayed, the slot lock is not released by
turning power on/off with the ?/1 button.
turning power on/off with the ?/1 button.
Tape Cassette Mechanism Deck
(CMAL5Z220C)
(CMAL5Z220C)
MAIN board
Front Panel
Ver. 1.2
Model
Part No.
E3 model
2-672-980-0
[]
SP model
2-672-981-0
[]
TH model
2-672-983-0
[]
KR model
2-672-984-0
[]