Read Sony CMT-NEZ33 / HCD-NEZ33 Service Manual online
3
HCD-NEZ33
TABLE OF CONTENTS
1.
SERVICING NOTES
...............................................
3
2.
GENERAL
...................................................................
6
3.
DISASSEMBLY
3-1.
Disassembly Flow ...........................................................
8
3-2.
Cabinet .............................................................................
8
3-3.
Cabinet (Top) Section ......................................................
9
3-4.
Base Unit (BU-K8BD83S-WOD) ...................................
9
3-5.
Front Panel Section ......................................................... 10
3-6.
Tape Mechanical Deck (CMAL5Z235A) ........................ 10
3-7.
MAIN Board .................................................................... 11
3-8.
Tuner (FM/AM) ............................................................... 11
4.
TEST MODE
.............................................................. 12
5.
MECHANICAL ADJUSTMENTS
....................... 13
6.
ELECTRICAL ADJUSTMENTS
......................... 14
7.
DIAGRAMS
7-1.
Block Diagram – CD SERVO Section – ......................... 17
7-2.
Block Diagram – MAIN Section – .................................. 18
7-3.
Printed Wiring Board – CD Board – ............................... 20
7-4.
Schematic Diagram – CD Board – .................................. 21
7-5.
Printed Wiring Boards – MAIN Section – ...................... 22
7-6.
Schematic Diagram – MAIN Section (1/2) – .................. 24
7-7.
Schematic Diagram – MAIN Section (2/2) – .................. 25
7-8.
Printed Wiring Board – PANEL Board (Suffix-13) – ..... 26
7-9.
Schematic Diagram – PANEL Board (Suffix-13) – ........ 27
7-10. Printed Wiring Board – PANEL Board (Suffix-14) – ..... 28
7-11. Schematic Diagram – PANEL Board (Suffix-14) – ........ 29
7-12. Printed Wiring Boards – DC Section – ........................... 30
7-13. Printed Wiring Board – AC Board – ................................ 31
7-14. Schematic Diagram – POWER SUPPLY Section – ........ 32
7-11. Schematic Diagram – PANEL Board (Suffix-14) – ........ 29
7-12. Printed Wiring Boards – DC Section – ........................... 30
7-13. Printed Wiring Board – AC Board – ................................ 31
7-14. Schematic Diagram – POWER SUPPLY Section – ........ 32
8.
EXPLODED VIEWS
8-1.
Cabinet Section ................................................................ 38
8-2.
Mechanical Deck Section ................................................ 39
8-3.
PANEL Board Section ..................................................... 40
8-4.
Cabinet (Top) Section ...................................................... 41
8-5.
MAIN Board Section ....................................................... 42
8-6.
AC Board, DC Board Section ......................................... 43
9.
ELECTRICAL PARTS LIST
................................ 44
The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
BLOCK OR BASE UNIT
SECTION 1
SERVICING NOTES
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
•
Unleaded solder melts at a temperature about 40 ˚C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 ˚C.
Caution: The printed pattern (copper foil) may peel away if
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
•
Strong viscosity
Unleaded solder is more viscou-s (sticky, less prone to flow)
Unleaded solder is more viscou-s (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
occur such as on IC pins, etc.
•
Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
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