Read Sony CMT-HX50BTR / CMT-HX70BTR / CMT-HX80R / CMT-HX90BTR / HCD-HX50BTR / HCD-HX70BTR / HCD-HX80R / HCD-HX90BTR Service Manual online
SERVICE MANUAL
Sony Corporation
Audio Business Group
Published by Sony Techno Create Corporation
Published by Sony Techno Create Corporation
HCD-HX50BTR/HX70BTR/
HX80R/HX90BTR
SPECIFICATIONS
COMPACT DISC RECEIVER
9-889-091-02
2008F05-1
©
2008.06
Canadian Model
E Model
HCD-HX50BTR
AEP Model
HCD-HX50BTR/HX70BTR
UK Model
HCD-HX80R/HX90BTR
Ver. 1.1 2008.06
Model Name Using Similar Mechanism
NEW
CD Mechanism Deck
BU-K6BD91UR2-WOD
Optical Pick-up Block Name
KSM-213DCP
• HCD-HX50BTR is the amplifi er, bluetooth,
USB, CD player and tuner section in CMT-
HX50BTR.
HX50BTR.
• HCD-HX70BTR is the amplifi er, bluetooth,
USB, CD player and tuner section in CMT-
HX70BTR.
HX70BTR.
• HCD-HX80R is the amplifi er, USB, CD play-
er and tuner section in CMT-HX80R.
• HCD-HX90BTR is the amplifi er, bluetooth,
USB, CD player and tuner section in CMT-
HX90BTR.
HX90BTR.
Photo: HCD-HX50BTR
– Continued on next page –
• The Bluetooth word mark and logos are owned by the Bluetooth SIG, Inc. and any use of such
marks by Sony Corporation is under license. Other trademarks and trade names are those of their
respective owners.
respective owners.
• “WALKMAN” and “WALKMAN” logo are registered trademarks of Sony Corporation.
• MPEG Layer-3 audio coding technology and patents licensed from Fraunhofer IIS and Thom-
• MPEG Layer-3 audio coding technology and patents licensed from Fraunhofer IIS and Thom-
son.
• Windows Media is a registered trademark of Microsoft Corporation in the United States and/or
other countries.
Amplifier section
HCD-HX80R/HX90BTR
DIN power output (rated):
40 + 40 watts (6 ohms at 1 kHz, DIN)
Continuous RMS power output
(reference): 50 + 50 watts (6 ohms at
1 kHz, 10% THD)
Music power output (reference):
50 + 50 watts (6 ohms at 1 kHz, 10%
THD)
40 + 40 watts (6 ohms at 1 kHz, DIN)
Continuous RMS power output
(reference): 50 + 50 watts (6 ohms at
1 kHz, 10% THD)
Music power output (reference):
50 + 50 watts (6 ohms at 1 kHz, 10%
THD)
HCD-HX70BTR
DIN power output (rated):
60 + 60 watts (4 ohms at 1 kHz, DIN)
Continuous RMS power output
(reference): 75 + 75 watts (4 ohms at
1 kHz, 10% THD)
Music power output (reference):
75 + 75 watts (4 ohms at 1 kHz, 10%
THD)
60 + 60 watts (4 ohms at 1 kHz, DIN)
Continuous RMS power output
(reference): 75 + 75 watts (4 ohms at
1 kHz, 10% THD)
Music power output (reference):
75 + 75 watts (4 ohms at 1 kHz, 10%
THD)
HCD-HX50BTR
European and Russian models:
DIN power output (rated):
40 + 40 watts (6 ohms at 1 kHz, DIN)
Continuous RMS power output
(reference): 50 + 50 watts (6 ohms at
1 kHz, 10% THD)
Music power output (reference):
50 + 50 watts (6 ohms at 1 kHz, 10%
THD)
40 + 40 watts (6 ohms at 1 kHz, DIN)
Continuous RMS power output
(reference): 50 + 50 watts (6 ohms at
1 kHz, 10% THD)
Music power output (reference):
50 + 50 watts (6 ohms at 1 kHz, 10%
THD)
Other models:
DIN power output (rated):
40 + 40 watts (6 ohms at 1 kHz, DIN)
Continuous RMS power output
(reference): 50 + 50 watts (6 ohms at
1 kHz, 10% THD)
40 + 40 watts (6 ohms at 1 kHz, DIN)
Continuous RMS power output
(reference): 50 + 50 watts (6 ohms at
1 kHz, 10% THD)
Inputs:
AUDIO IN (stereo mini jack):
voltage 250 mV, impedance
22 kilohms
voltage 250 mV, impedance
22 kilohms
(USB) port: Type A, maximum
current 500 mA
Outputs:
PHONES (stereo mini jack): accepts
headphones of 8 ohms or more
SPEAKER: accepts impedance of
4 ohms (CMT-HX70BTR) or 6 ohms
(CMT-HX50BTR)
headphones of 8 ohms or more
SPEAKER: accepts impedance of
4 ohms (CMT-HX70BTR) or 6 ohms
(CMT-HX50BTR)
Bluetooth section
(HCD-HX50BTR/HX70BTR/HX90BTR)
Communication system:
Bluetooth Standard version 2.0
Output:
Bluetooth Standard Power Class 2
Maximum communication range:
Line of sight approx. 10 m
1)
Frequency band:
2.4 GHz band (2.4000 GHz
– 2.4835 GHz)
– 2.4835 GHz)
Modulation method:
FHSS
Compatible Bluetooth profiles
2)
:
A2DP (Advanced Audio Distribution
Profile)
AVRCP (Audio Video Remote
Control Profile)
Profile)
AVRCP (Audio Video Remote
Control Profile)
Supported codecs:
Receive: SBC (Sub Band Codec), MP3
Transmit: SBC (Sub Band Codec)
Transmit: SBC (Sub Band Codec)
Tuner section
DAB tuner section
(HCD-HX80R/HX90BTR) :
Frequency range*
(HCD-HX80R/HX90BTR) :
Frequency range*
Band-III: 174.928 (5A) – 239.200
(13F) MHz
(13F) MHz
* For details, see “DAB frequency table”.
Antenna: FM/DAB lead antenna
Antenna terminal: 75 ohms, F female
FM stereo, FM/AM superheterodyne tuner
Antenna terminal: 75 ohms, F female
FM stereo, FM/AM superheterodyne tuner
FM tuner section:
Tuning range
Tuning range
Canadian and Brazilian models:
87.5 – 108.0 MHz (100 kHz step)
Other models: 87.5 – 108.0 MHz
(50 kHz step)
87.5 – 108.0 MHz (100 kHz step)
Other models: 87.5 – 108.0 MHz
(50 kHz step)
Antenna: FM lead antenna
Antenna terminals: 75 ohms unbalanced
Intermediate frequency: 10.7 MHz
AM tuner section:
Tuning range
Antenna terminals: 75 ohms unbalanced
Intermediate frequency: 10.7 MHz
AM tuner section:
Tuning range
European and Russian models:
531 – 1,602 kHz (with 9 kHz tuning
interval)
Canadian and Latin American
models:
530 – 1,710 kHz (with 10 kHz tuning
interval)
531 – 1,710 kHz (with 9 kHz tuning
interval)
Other models:
531 – 1,602 kHz (with 9 kHz tuning
interval)
530 – 1,610 kHz (with 10 kHz tuning
interval)
531 – 1,602 kHz (with 9 kHz tuning
interval)
Canadian and Latin American
models:
530 – 1,710 kHz (with 10 kHz tuning
interval)
531 – 1,710 kHz (with 9 kHz tuning
interval)
Other models:
531 – 1,602 kHz (with 9 kHz tuning
interval)
530 – 1,610 kHz (with 10 kHz tuning
interval)
Antenna: AM loop antenna, external
antenna terminal
Intermediate frequency: 450 kHz
antenna terminal
Intermediate frequency: 450 kHz
1)
The actual range will vary depending on
factors such as obstacles between devices,
magnetic fields around a microwave oven,
static electricity, reception sensitivity,
antenna’s performance, operating system,
software application, etc.
factors such as obstacles between devices,
magnetic fields around a microwave oven,
static electricity, reception sensitivity,
antenna’s performance, operating system,
software application, etc.
2)
Bluetooth standard profiles indicate the
purpose of Bluetooth communication
between devices.
purpose of Bluetooth communication
between devices.
USB section
Supported bit rate
MP3 (MPEG 1 Audio Layer-3):
32 – 320 kbps, VBR
WMA: 32 – 192 kbps, VBR
AAC: 48 – 320 kbps
32 – 320 kbps, VBR
WMA: 32 – 192 kbps, VBR
AAC: 48 – 320 kbps
Sampling frequencies
MP3 (MPEG 1 Audio Layer-3):
32/44.1/48 kHz
WMA: 44.1 kHz
AAC: 44.1 kHz
32/44.1/48 kHz
WMA: 44.1 kHz
AAC: 44.1 kHz
CD player section
System: Compact disc and digital audio
system
Laser Diode Properties
system
Laser Diode Properties
Emission duration: Continuous
Laser Output*: Less than 44.6μW
Laser Output*: Less than 44.6μW
* This output is the value measurement
at a distance of 200mm from the
objective lens surface on the Optical
Pick-up Block with 7mm aperture.
objective lens surface on the Optical
Pick-up Block with 7mm aperture.
Frequency response: 20 Hz – 20 kHz
Signal-to-noise ratio: More than 90 dB
Dynamic range: More than 90 dB
Signal-to-noise ratio: More than 90 dB
Dynamic range: More than 90 dB
HCD-HX50BTR/HX70BTR/HX80R/HX90BTR
2
SAFETY-RELATED COMPONET WARNING!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS
WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ!
LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE 0 SUR
LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES
PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE FONC-
TIONNEMENT. NE REMPLACER CES COM- POSANTS QUE
PAR DES PIÈCES SONY DONT LES NUMÉROS SONT DON-
NÉS DANS CE MANUEL OU DANS LES SUPPLÉMENTS
PUBLIÉS PAR SONY.
LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES
PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE FONC-
TIONNEMENT. NE REMPLACER CES COM- POSANTS QUE
PAR DES PIÈCES SONY DONT LES NUMÉROS SONT DON-
NÉS DANS CE MANUEL OU DANS LES SUPPLÉMENTS
PUBLIÉS PAR SONY.
DAB frequency table (Band-III)
Frequency
Label Frequency
Label
174.928 MHz 5A
209.936 MHz 10A
176.640 MHz 5B
211.648 MHz 10B
178.352 MHz 5C
213.360 MHz 10C
180.064 MHz 5D
215.072 MHz 10D
181.936 MHz 6A
216.928 MHz 11A
183.648 MHz 6B
218.640 MHz 11B
185.360 MHz 6C
220.352 MHz 11C
187.072 MHz 6D
222.064 MHz 11D
188.928 MHz 7A
223.936 MHz 12A
190.640 MHz 7B
225.648 MHz 12B
192.352 MHz 7C
227.360 MHz 12C
194.064 MHz 7D
229.072 MHz 12D
195.936 MHz 8A
230.784 MHz 13A
197.648 MHz 8B
232.496 MHz 13B
199.360 MHz 8C
234.208 MHz 13C
201.072 MHz 8D
235.776 MHz 13D
202.928 MHz 9A
237.488 MHz 13E
204.640 MHz 9B
239.200 MHz 13F
206.352 MHz 9C
208.064 MHz 9D
General
Power requirements
European and Russian models:
220 – 240 V AC, 50/60 Hz
Canadian model: 120 V AC, 60 Hz
Mexican model: 127 V AC, 60 Hz
Argentina model: 220 – 240 V AC,
50/60 Hz
Korean model: 220 – 240 V AC,
50/60 Hz
Latin American models (except for
Mexican and Argentina models):
120 – 127, 220 – 240 V AC, 50/60 Hz,
adjustable with voltage selector
Other models:
220 – 240 V AC, 50/60 Hz
220 – 240 V AC, 50/60 Hz
Canadian model: 120 V AC, 60 Hz
Mexican model: 127 V AC, 60 Hz
Argentina model: 220 – 240 V AC,
50/60 Hz
Korean model: 220 – 240 V AC,
50/60 Hz
Latin American models (except for
Mexican and Argentina models):
120 – 127, 220 – 240 V AC, 50/60 Hz,
adjustable with voltage selector
Other models:
220 – 240 V AC, 50/60 Hz
Power consumption
HCD-HX90BRT: 40 watts
HCD-HX80R: 40 watts
HCD-HX70BTR: 50 watts
HCD-HX50BTR: 40 watts
HCD-HX80R: 40 watts
HCD-HX70BTR: 50 watts
HCD-HX50BTR: 40 watts
Dimensions (w/h/d) (excl. speakers):
Approx. 305 × 116 × 226 mm
(HCD-HX80R/HX90BTR)
Approx. 305 × 116 × 225 mm
(HCD-HX50BTR/HC70BTR)
(HCD-HX80R/HX90BTR)
Approx. 305 × 116 × 225 mm
(HCD-HX50BTR/HC70BTR)
Design and specifications are subject to
change without notice.
change without notice.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of soldering iron around 270 °C during
• Keep the temperature of soldering iron around 270 °C during
repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
CAUTION
Use of controls or adjustments or performance of procedures other than
those specifi ed herein may result in hazardous radiation exposure.
Use of controls or adjustments or performance of procedures other than
those specifi ed herein may result in hazardous radiation exposure.
This appliance is classified as a CLASS 1
LASER product. This marking is located
on the rear exterior.
LASER product. This marking is located
on the rear exterior.
Ver. 1.1
HCD-HX50BTR/HX70BTR/HX80R/HX90BTR
3
1.
SERVICING NOTES
............................................. 4
2. GENERAL
.................................................................. 6
3. DISASSEMBLY
3-1. Disassembly
Flow
........................................................... 8
3-2. Panel (Top) Block ........................................................... 9
3-3. Panel (Front) Block ......................................................... 9
3-4. Knob
3-3. Panel (Front) Block ......................................................... 9
3-4. Knob
Assy
....................................................................... 10
3-5. MAIN
Board
................................................................... 10
3-6. Loading Mechanism Block ............................................. 11
3-7. Base Unit (BU-K6BD91UR2-WOD) ............................. 11
3-8. Belt
3-7. Base Unit (BU-K6BD91UR2-WOD) ............................. 11
3-8. Belt
.................................................................................. 12
3-9. Optical Pick-up Block (KSM-213D) .............................. 12
4.
TEST MODE
............................................................ 13
5.
ELECTRICAL CHECKS
...................................... 15
6. DIAGRAMS
6-1. Block Diagram - CD SERVO Section - .......................... 16
6-2. Block
6-2. Block
Diagram
- TUNER/USB/BLUETOOTH Section - ........................ 17
6-3. Block Diagram - MAIN Section - ................................... 18
6-4. Block Diagram - AMP Section - ..................................... 19
6-5. Block Diagram - PANEL/POWER SUPPLY - ............... 20
6-6. Printed Wiring Boards - CD Section - ............................ 22
6-7. Schematic Diagram - CD Board - ................................... 23
6-8. Printed Wiring Board - USB Board - .............................. 24
6-9. Schematic Diagram - USB Board - ................................. 25
6-10. Printed Wiring Boards - BLUETOOTH Section
(HX50BTR/HX70BTR/HX90BTR)
6-4. Block Diagram - AMP Section - ..................................... 19
6-5. Block Diagram - PANEL/POWER SUPPLY - ............... 20
6-6. Printed Wiring Boards - CD Section - ............................ 22
6-7. Schematic Diagram - CD Board - ................................... 23
6-8. Printed Wiring Board - USB Board - .............................. 24
6-9. Schematic Diagram - USB Board - ................................. 25
6-10. Printed Wiring Boards - BLUETOOTH Section
(HX50BTR/HX70BTR/HX90BTR)
-
.............................
26
6-11. Schematic Diagram - BLUETOOTH Section
(HX50BTR/HX70BTR/HX90BTR)
(HX50BTR/HX70BTR/HX90BTR)
-
.............................
27
6-12. Printed Wiring Board
- DAB Board (HX80R/HX90BTR) - .............................. 28
6-13. Schematic Diagram
- DAB Board (HX80R/HX90BTR) - .............................. 29
6-14. Printed Wiring Board - MAIN Section - ......................... 30
6-15. Schematic Diagram - MAIN Section (1/3) - ................... 31
6-16. Schematic Diagram - MAIN Section (2/3) - ................... 32
6-17. Schematic Diagram - MAIN Section (3/3) - ................... 33
6-18. Printed Wiring Board
6-15. Schematic Diagram - MAIN Section (1/3) - ................... 31
6-16. Schematic Diagram - MAIN Section (2/3) - ................... 32
6-17. Schematic Diagram - MAIN Section (3/3) - ................... 33
6-18. Printed Wiring Board
- AMP Board (HX50BTR/HX80R/HX90BTR) - ........... 34
6-19. Schematic Diagram
- AMP Board (HX50BTR/HX80R/HX90BTR) - ........... 35
6-20. Printed Wiring Board - AMP Board (HX70BTR) - ........ 36
6-21. Schematic Diagram - AMP Board (HX70BTR) - ........... 37
6-22. Printed Wiring Boards - INPUT/OUTPUT Section - ..... 38
6-23. Schematic Diagram - INPUT/OUTPUT Section - .......... 39
6-24. Printed Wiring Boards - PANEL Section - ..................... 40
6-25. Schematic Diagram - PANEL Section - .......................... 41
6-26. Printed Wiring Board - SW POWER Board - ................. 42
6-27. Schematic Diagram - SW POWER Board - ................... 43
6-21. Schematic Diagram - AMP Board (HX70BTR) - ........... 37
6-22. Printed Wiring Boards - INPUT/OUTPUT Section - ..... 38
6-23. Schematic Diagram - INPUT/OUTPUT Section - .......... 39
6-24. Printed Wiring Boards - PANEL Section - ..................... 40
6-25. Schematic Diagram - PANEL Section - .......................... 41
6-26. Printed Wiring Board - SW POWER Board - ................. 42
6-27. Schematic Diagram - SW POWER Board - ................... 43
7.
EXPLODED VIEWS
7-1. Panel (Top) Section ......................................................... 57
7-2. Chassis (Top) Section ..................................................... 58
7-3. Panel (Front) Section ...................................................... 59
7-4. Main
7-2. Chassis (Top) Section ..................................................... 58
7-3. Panel (Front) Section ...................................................... 59
7-4. Main
Section
................................................................... 60
7-5. Chassis
Section
............................................................... 61
7-6. Loading Mechanism Section .......................................... 62
7-7. Base Unit Section (BU-K6BD91UR2-WOD) ................ 63
7-7. Base Unit Section (BU-K6BD91UR2-WOD) ................ 63
TABLE OF CONTENTS
8.
ELECTRICAL PARTS LIST
.............................. 64
HCD-HX50BTR/HX70BTR/HX80R/HX90BTR
4
SECTION 1
SERVICING NOTES
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostat-
ic break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The fl exible board is easily damaged and should be handled with
care.
ic break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The fl exible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused
on the disc refl ective surface by the objective lens in the optical
pickup block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
The laser beam on this model is concentrated so as to be focused
on the disc refl ective surface by the objective lens in the optical
pickup block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher
• Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if the
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
• Strong
viscosity
Unleaded solder is more viscous (sticky, less prone to fl ow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
also be added to ordinary solder.
RELEASING THE ANTITHEFT LOCK
The disc tray lock function for the antitheft of an demonstration
disc in the store is equipped.
The disc tray lock function for the antitheft of an demonstration
disc in the store is equipped.
Releasing Procedure:
1. Press the [
1. Press the [
?/1
] button to turn the power on.
2. While pressing the [
x/
CANCEL] button, press the [
Z
] but-
ton unit “UNLOCKED” displayed on the fl uorescent indicator
tube (around 5 seconds) .
tube (around 5 seconds) .
Note: When “LOCKED” is displayed, the tray lock is not released by
turning power on/off with the [?/1] button.
NOTE THE IC904 ON THE BT BOARD REPLACING
When IC904 cannot exchange with single. When IC904 is dam-
aged, exchange the entire mounted board.
When IC904 cannot exchange with single. When IC904 is dam-
aged, exchange the entire mounted board.
MODEL IDENTIFICATION
PART No.
– Back Panel –
Model
Part No.
HX50BTR: AEP model
3-284-497-0[]
HX50BTR: Canadian model
3-284-497-1[]
HX50BTR: Russian model
3-284-497-2[]
HX50BTR: Singapore model
3-284-497-3[]
HX50BTR: Korean model
3-284-497-5[]
HX50BTR: Mexican model
3-284-497-7[]
HX50BTR: Chilean and Peruvian models
3-284-497-8[]
HX50BTR: Argentina model
3-284-497-9[]
HX50BTR: Brazilian model
3-290-773-0[]
HX70BTR
3-290-773-1[]
HX90BTR
3-290-773-2[]
HX80R
3-290-773-3[]
Ver. 1.1