Read Sony CMT-HX30R / HCD-HX30R Service Manual online
HCD-HX30R
2
TABLE OF CONTENTS
NOTES ON CHIP COMPONENT REPLACEMENT
•
•
Never reuse a disconnected chip component.
•
Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
aged by heat.
FLEXIBLE CIRCUIT BOARD REPAIRING
•
•
Keep the temperature of soldering iron around 270 °C during
repairing.
repairing.
•
Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
circuit board (within 3 times).
•
Be careful not to apply force on the conductor when soldering
or unsoldering.
or unsoldering.
SAFETY-RELATED COMPONET WARNING!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS
WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
This appliance is classifi ed as a CLASS 1
LASER product. This marking is located
on the rear exterior.
LASER product. This marking is located
on the rear exterior.
1.
SERVICING NOTES
............................................. 3
2. GENERAL
.................................................................. 4
3. DISASSEMBLY
3-1. Disassembly
Flow
........................................................... 6
3-2. Panel
(Top)
...................................................................... 7
3-3. Front Panel Block ........................................................... 7
3-4. MAIN
3-4. MAIN
Board
................................................................... 8
3-5. SWITCHING POWER Board/SUB POWER Board ...... 8
3-6. Loading Mechanism Block ............................................. 9
3-7. Base
3-6. Loading Mechanism Block ............................................. 9
3-7. Base
Unit
......................................................................... 9
3-8. Belt
.................................................................................. 10
3-9. OP Base Assy (KSM-213D) ........................................... 10
4.
TEST MODE
............................................................ 11
5.
ELECTRICAL CHECKS
...................................... 13
6. DIAGRAMS
6-1. Block Diagram - CD SERVO Section - .......................... 15
6-2. Block Diagram - MAIN Section - ................................... 16
6-3. Block Diagram - AMP Section - ..................................... 17
6-4. Block
6-2. Block Diagram - MAIN Section - ................................... 16
6-3. Block Diagram - AMP Section - ..................................... 17
6-4. Block
Diagram
- PANEL/POWER SUPPLY Section - ............................ 18
6-5. Printed Wiring Boards - CD Section - ............................ 20
6-6. Schematic Diagram - CD Section - ................................. 21
6-7. Printed Wiring Boards - USB Section - .......................... 22
6-8. Schematic Diagram - USB Section - .............................. 23
6-9. Printed Wiring Board - MAIN Section - ......................... 24
6-10. Schematic Diagram - MAIN Section (1/3) - ................... 25
6-11. Schematic Diagram - MAIN Section (2/3) - ................... 26
6-12. Schematic Diagram - MAIN Section (3/3) - ................... 27
6-13. Printed Wiring Board - AMP Section - ........................... 28
6-14. Schematic Diagram - AMP Section - .............................. 29
6-15. Printed Wiring Boards - OUTPUT Section - .................. 30
6-16. Schematic Diagram - OUTPUT Section - ...................... 30
6-17. Printed Wiring Boards - PANEL Section - ..................... 32
6-18. Schematic Diagram - PANEL Section - .......................... 33
6-19. Printed Wiring Boards - POWER SUPPLY Section - .... 34
6-20. Schematic Diagram - POWER SUPPLY Section - ......... 35
6-6. Schematic Diagram - CD Section - ................................. 21
6-7. Printed Wiring Boards - USB Section - .......................... 22
6-8. Schematic Diagram - USB Section - .............................. 23
6-9. Printed Wiring Board - MAIN Section - ......................... 24
6-10. Schematic Diagram - MAIN Section (1/3) - ................... 25
6-11. Schematic Diagram - MAIN Section (2/3) - ................... 26
6-12. Schematic Diagram - MAIN Section (3/3) - ................... 27
6-13. Printed Wiring Board - AMP Section - ........................... 28
6-14. Schematic Diagram - AMP Section - .............................. 29
6-15. Printed Wiring Boards - OUTPUT Section - .................. 30
6-16. Schematic Diagram - OUTPUT Section - ...................... 30
6-17. Printed Wiring Boards - PANEL Section - ..................... 32
6-18. Schematic Diagram - PANEL Section - .......................... 33
6-19. Printed Wiring Boards - POWER SUPPLY Section - .... 34
6-20. Schematic Diagram - POWER SUPPLY Section - ......... 35
7.
EXPLODED VIEWS
7-1. Panel
Section
................................................................... 48
7-2. Chassis
(Top)
Section
..................................................... 49
7-3. Panel Key Section ........................................................... 50
7-4. Front Panel Section ......................................................... 51
7-5. Main
7-4. Front Panel Section ......................................................... 51
7-5. Main
Section
................................................................... 52
7-6. Chassis
Section
............................................................... 53
7-7. Loading Mechanism Section ......................................... 54
7-8. Base Unit Section (BU-K6BD91UR-WOD) ................. 55
7-8. Base Unit Section (BU-K6BD91UR-WOD) ................. 55
8.
ELECTRICAL PARTS LIST
.............................. 56
CAUTION
Use of controls or adjustments or performance of procedures
other than those specifi ed herein may result in hazardous radia-
tion exposure.
Use of controls or adjustments or performance of procedures
other than those specifi ed herein may result in hazardous radia-
tion exposure.
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