CMT-HPX9, HCD-HPX9 - Sony Audio Service Manual (repair manual)

cmt-hpx9, hcd-hpx9 service manual
Model
CMT-HPX9 HCD-HPX9
Pages
107
Size
6.49 MB
Type
PDF
Document
Service Manual
Brand
Device
Audio
File
cmt-hpx9-hcd-hpx9.pdf
Date

Read Sony CMT-HPX9 / HCD-HPX9 Service Manual online

SERVICE MANUAL
Sony Corporation
Personal Audio Division
Published by Sony Techno Create Corporation
US Model
Canadian Model
E Model
Australian Model
COMPACT DISC DECK RECEIVER
9-877-809-11
2006I16-1
© 2006.09
Ver. 2.0  2006.09
SPECIFICATIONS
HCD-HPX9
HCD-HPX9 is the amplifier, CD player,
tape deck and tuner section in CMT-HPX9.
Outputs
PHONES:
Accepts headphones with
an impedance of 8 ohms or
more.
 
SPEAKER:
Accepts impedance of 6 t
16 ohms.
CD player section
Laser
Semiconductor laser 
(
λ=780 nm)
Emission duration: 
continuous
Frequency response
20 Hz – 20 kHz
Tape deck section
Recording system
4-track 2-channel, stereo
Frequency response
50 – 13,000 Hz (
±3 dB),
using Sony TYPE I 
cassettes
Tuner section
FM stereo, FM/AM superheterodyne tuner
FM tuner section
Tuning range
87.5 – 108.0 MHz
Antenna
FM lead antenna
Antenna terminals
75 ohms unbalanced
Intermediate frequency
10.7 MHz
AM tuner section
Tuning range
Pan-American model:
530 – 1,710 kHz 
(with the tuning interval 
set at 10 kHz)
531 – 1,710 kHz 
(with the tuning interval 
set at 9 kHz)
Other models:
530 – 1,710 kHz 
(with the tuning interval 
set at 10 kHz)
531 – 1,602 kHz 
(with the tuning interval 
set at 9 kHz)
Antenna
AM loop antenna, external 
antenna terminal
Intermediate frequency
450 kHz 
General
Power requirements
North American model: 120 V AC, 60 Hz
Australian model:
230 – 240 V AC, 50/60 Hz
Argentine model:
220 V AC, 50/60 Hz
Saudi Arabian model:
120 – 127/220 or 230 – 240 
V AC, 50/60 Hz 
Adjustable with voltage 
selector
Other models:
120 V, 220 V or 230 – 240 
V AC, 50/60 Hz
Adjustable with voltage 
selector
Power consumption
North American model: 120 W
Other models:
105 W
Design and specifications are subject to change 
without notice.
Inputs
MD/VIDEO:
Sensitivity 450/250 mV, 
impedance 47 kilohms
Main unit 
Amplifier section
For the United States model
AUDIO POWER SPECIFICATIONS
POWER OUTPUT AND TOTAL HARMONIC 
DISTORTION:
With 6-ohm loads, both channels driven, from 
120 – 10,000 Hz: rated 75 watts per channel 
minimum RMS power, with no more than 10% 
total harmonic distortion from 250 milliwatts to 
rated output.
North American model:
Continuous RMS power output (reference):
80 + 80 W 
(6 ohms at 1 kHz, 10% 
THD)
Other models:
The following measured at AC 240 V, AC 220 V or AC 
120 V
DIN power output (rated): 53 + 53 W 
(6 ohms at 1 kHz, DIN)
Continuous RMS power output (reference):
70 + 70 W 
(6 ohms at 1 kHz, 10% 
THD)
Korea model:
220 V AC, 60 Hz
Model Name Using Similar Mechanism
NEW
CD
CD Mechanism Type
CDM82A-F1BD81
Section
Base Unit Name
BU-F1BD81A
Optical Pick-up Block Name
KSM-215DCP
Tape deck
Model Name Using Similar Mechanism
NEW
Section
Tape Transport Mechanism Type
CMAL5Z225A
2
HCD-HPX9
TABLE OF CONTENTS
1.
SERVICING NOTES
................................................
4
2.
GENERAL
...................................................................
5
3.
DISASSEMBLY
3-1.
Disassembly Flow-1 ........................................................
7
3-2.
Disassembly Flow-2 ........................................................
8
3-3.
Optical Pick-Up Block ....................................................
9
3-4.
Side Plate (L) (R), Top Panel Section .............................. 10
3-5.
Mechanical Deck ............................................................. 11
3-6.
Front Panel Section ......................................................... 12
3-7.
PANEL (1), (2) Board, HEADPHONE Board ................ 12
3-8.
Tuner (FM/AM), Dc Fan ................................................. 13
3-9.
MAIN Board .................................................................... 14
3-10. Rear Panel Section ........................................................... 14
3-11. AMP Board, Switching Regulator ................................... 15
3-12. POWER Board ................................................................ 15
3-13. CD Mechanism Deck (CDM82A) ................................... 16
3-14. Plate (Cover Top) ............................................................. 17
3-15. Top Section ...................................................................... 17
3-16. Arm Section ..................................................................... 18
3-17. CD Mechanism Deck Section ......................................... 19
3-18. Sub Gear (2 Step), Sub Slider Assy .................................  20
3-19. Arm (R) ........................................................................... 21
3-20. Gear (Stock Planet) (Right) ............................................. 22
3-21. Lever (Sub Gear Back L) ................................................ 22
3-22. Arm (L) ............................................................................ 23
3-23. Gear (Stock Rot Long) (Left) .......................................... 24
3-24. Gear (Stock Rot Short) (Right) ....................................... 24
3-25. Stocker (1) Assy To Stocker (5) Assy .............................. 25
3-26. SPR-E (Roller Slider Upper) (Top Section) .................... 26
3-27. Rubber Roller (Top Section) ........................................... 26
3-28. LOD Motor ...................................................................... 27
3-29. Slider (Push-popup) ......................................................... 27
3-30. Rotary Encoder ................................................................ 28
3-31. Assembling of the Rotary Encoder ................................. 29
3-32. ELV Motor ....................................................................... 30
3-33. Chassis (Top), Chassis (Bottom) ..................................... 31
3-34. Lever (Loading R, Loading L) ........................................ 32
3-35. Disc Stop Lever ............................................................... 33
3-36. DRIVER Board ............................................................... 33
3-37. CD Board (A) .................................................................. 34
3-38. Optical Pick-up (KSM-215DCP) .................................... 34
3-39. Base Unit Section ............................................................ 35
3-40. Lever (BU Lock) ............................................................. 35
3-41. Gear (IDL-B) ................................................................... 36
3-42. Gear (IDL-C) ................................................................... 36
3-43. SPR-E (Tako-Back) ......................................................... 37
3-44. Plate (Push) Assy ............................................................. 38
3-45. SPR-P (Lock) .................................................................. 39
4.
ASSEMBLY
4-1.
Assembly Flow ................................................................ 40
4-2.
Assembling of the Stocker Section ................................. 41
4-3.
Assembling of the Gear (Stock Rot Short) (Right) ......... 42
4-4.
Assembling of the Gear (Stock Rot Long) (Left) ............ 43
4-5.
Confirming the Assembling of the Stocker Section ........ 44
4-6.
Assembling of the Gear (Stock Rotary Left) ................... 45
4-7.
Assembling of the Gear (Stock Rotary Right) ................ 46
4-8.
Assembling of the Lever (Sub Gear Back L) .................. 47
4-9.
Assembling of the Gear (Sub Gear Pin Right) ................ 48
4-10. Assembling of the Lever (Sub Gear Back R) .................. 49
4-11. Assembling of the Sub Gear (Idler) ................................ 50
4-12. Assembling of the Sub Gear (2 Step) .............................. 51
4-13. Confirming the Assembling of the Arm Section ............. 52
5.
TEST MODE
............................................................... 53
6.
ELECTRICAL ADJUSTMENTS
.......................... 55
7.
DIAGRAMS
7-1.
Block Diagrams – CD Servo Section – ........................... 59
7-2.
Block Diagrams – MAIN Section – ................................ 60
7-3.
Block Diagrams
– PANEL/POWER SUPPLY Section – ........................... 61
7-4.
Printed Wiring Board – CD Board – ............................... 62
7-5.
Schematic Diagram – CD Board – .................................. 63
7-6.
Printed Wiring Board – CD MECHANISM Section – .... 64
7-7.
Schematic Diagram – CD MECHANISM Section – ...... 65
7-8.
Printed Wiring Board – MAIN Board – .......................... 66
7-9.
Schematic Diagram – MAIN Board (1/3) – .................... 67
7-10. Schematic Diagram – MAIN Board (2/3) – .................... 68
7-11. Schematic Diagram – MAIN Board (3/3) – .................... 69
7-12. Printed Wiring Board – AMP Board – ............................ 70
7-13. Schematic Diagram – AMP Board – ............................... 71
7-14. Printed Wiring Board – PANEL Section – ...................... 72
7-15. Schematic Diagram – PANEL Section – ......................... 73
7-16. Printed Wiring Board – POWER Board – ....................... 74
7-17. Schematic Diagram – POWER Board – .......................... 75
8.
EXPLODED VIEWS
8-1.
Side Plate, Top Panel Section .......................................... 83
8-2.
Front Panel Section ......................................................... 84
8-3.
Chassis Section ................................................................ 85
8-4.
CD Mechanism Deck Section-1 (CDM82A) .................. 86
8-5.
CD Mechanism Deck Section-2 (CDM82A) .................. 87
8-6.
CD Mechanism Deck Section-3 (CDM82A) .................. 88
8-7.
CD Mechanism Deck Section-4 (CDM82A) .................. 89
8-8.
CD Mechanism Deck Section-5 (CDM82A) .................. 90
8-9.
CD Mechanism Deck Section-6 (CDM82A) .................. 91
8-10. CD Mechanism Deck Section-7 (CDM82A) .................. 92
8-11. CD Mechanism Deck Section-8 (CDM82A) .................. 93
8-12. CD Mechanism Deck Section-9 (CDM82A) .................. 94
8-13. CD Mechanism Deck Section-10 (CDM82A) ................ 95
8-14. Base Unit Section (BU-F1BD81A) ................................. 96
9.
ELECTRICAL PARTS LIST
.................................. 97
3
HCD-HPX9
SAFETY  CHECK-OUT
After correcting the original service problem, perform the following
safety check before releasing the set to the customer:
Check the antenna terminals, metal trim, “metallized” knobs, screws,
and all other exposed metal parts for AC leakage.
Check leakage as described below.
LEAKAGE  TEST
The AC leakage from any exposed metal part to earth ground and
from all exposed metal parts to any exposed metal part having a
return to chassis, must not exceed 0.5 mA (500 microamperes.).
Leakage current can be measured by any one of three methods.
1. A commercial leakage tester, such as the Simpson 229 or RCA
WT-540A. Follow the manufacturers’ instructions to use these
instruments.
2. A battery-operated AC milliammeter. The Data Precision 245
digital multimeter is suitable for this job.
3. Measuring the voltage drop across a resistor by means of a
VOM or battery-operated AC voltmeter. The “limit” indication
is 0.75 V, so analog meters must have an accurate low-voltage
scale. The Simpson 250 and Sanwa SH-63Trd are examples
of a passive VOM that is suitable. Nearly all battery operated
digital multimeters that have a 2 V AC range are suitable.  (See
Fig. A)
Fig. A.
Using an AC voltmeter to check AC leakage.
1.5 k
0.15 
µ
F
AC
voltmeter
(0.75 V)
To Exposed Metal
Parts on Set
Earth Ground
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270 °C
during repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radiation
exposure.
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 
°C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscou-s (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
This appliance is 
classified as a CLASS 1 
LASER product. This 
label is located on the 
rear exterior.
SAFETY-RELATED  COMPONENT  WARNING!!
COMPONENTS  IDENTIFIED  BY  MARK  
0
  OR  DOTTED  LINE
WITH  MARK  
0
  ON  THE  SCHEMATIC  DIAGRAMS  AND  IN
THE  PARTS  LIST  ARE  CRITICAL  TO  SAFE  OPERATION.
REPLACE  THESE  COMPONENTS  WITH  SONY  PARTS  WHOSE
PART  NUMBERS  APPEAR  AS  SHOWN  IN  THIS  MANUAL  OR
IN  SUPPLEMENTS  PUBLISHED  BY  SONY.
ATTENTION  AU  COMPOSANT  AYANT  RAPPORT
À  LA  SÉCURITÉ!
LES  COMPOSANTS  IDENTIFIÉS  PAR  UNE  MARQUE  
0
 SUR
LES  DIAGRAMMES  SCHÉMATIQUES  ET  LA  LISTE  DES
PIÈCES  SONT  CRITIQUES  POUR  LA  SÉCURITÉ  DE
FONCTIONNEMENT.  NE  REMPLACER  CES  COM-  POSANTS
QUE  PAR  DES  PIÈCES  SONY  DONT  LES  NUMÉROS  SONT
DONNÉS  DANS  CE  MANUEL  OU  DANS  LES  SUPPLÉMENTS
PUBLIÉS  PAR  SONY.
4
HCD-HPX9
SECTION 1
SERVICING NOTES
NOTES  ON  HANDLING  THE  OPTICAL  PICK-UP
BLOCK  OR  BASE  UNIT
The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
NOTES  ON  LASER  DIODE  EMISSION  CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
LASER  DIODE  AND  FOCUS  SEARCH  OPERATION
CHECK
Carry out the “S curve check” in “CD section adjustment” and check
that the S curve waveforms is output three times.
• MODEL  IDENTIFICATION
– Rear View –
Power requirement
indication
Model Name
Power Voltage Indication
US, Canadian models
AC: 120 V 
-
 60 Hz
Saudi Arabia model
AC: 120 – 127 V/220 or
230 – 240 V 
-
 50/60 Hz
Other models
AC: 120 V, 220 V, 230 – 240 V
-
 50/60 Hz
Argentine model
AC: 220 V 
-
 50 Hz
Australian model
AC: 230 – 240 V 
-
 50/60 Hz
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