CMT-HPR95, HCD-HPR95 - Sony Audio Service Manual (repair manual)

Model Name Using Similar Mechanism

HCD-HPR90

CD Mechanism Name

DLM5B

Base Unit Name

BU-K6BD83S-WOD

Optical Pick-Up Block Name

KSM-213DCP

2007B05-1
© 2007.02

• HCD-HPR95 is the amplifier, CD player and

tuner section in CMT-HPR95.

US and foreign patents licensed from Dolby Laboratories.

E Model

The following measured at AC 127 V, 60 Hz (Mexican model), 
AC 220 – 240 V, 50/60 Hz (Other models)

DIN power output (rated): 56 + 56 W (4 ohms at 1 kHz, DIN)
Continuous RMS power output (reference): 70 + 70 W (4 ohms at 1 kHz, 
10% THD)

Inputs

AUDIO IN: Sensitivity 250 mV, impedance of 47 kilohms

Outputs

PHONES (stereo mini jack): accepts headphones with an impedance of 8 
ohms or more
SPEAKER: accepts impedance of 4 ohms

System: Compact disc and digital audio system
Laser Diode Properties  

Emission Duration: Continuous 
Laser Output*: Less than 44.6 

µW

* This output is the value measurement at a distance of 200 mm from the  

objective lens surface on the Optical Pick-up Block with 7 mm aperture. 

Frequency response: 20 Hz – 20 kHz (

±2 dB) 

Wavelength: 780 – 790 nm

FM stereo, FM/AM superheterodyne tuner
FM tuner section:

Tuning range: 87.5 – 108.0 MHz
Antenna: FM lead antenna
Antenna terminals: 75 ohms unbalanced
Intermediate frequency: 10.7 MHz

AM tuner section:
Tuning range

   

530 – 1,710 kHz (with 10 kHz tuning interval)
531 – 1,602 kHz (with 9 kHz tuning interval)

Antenna: AM loop antenna
Antenna terminals: External antenna terminal
Intermediate frequency: 450 kHz

Power requirements

Mexican model: 127 V AC, 60 Hz
Other models: 220 – 240 V AC, 50/60 Hz
Adjustable with voltage selector

Power consumption: 45 watts

Dimensions (w/h/d) (excl. speakers): Approx. 180 

× 280 × 360 mm 

Mass (excl. speakers): 3.9 kg

Design and specifications are subject to change without notice.

2

•

Never reuse a disconnected chip component.

•

Notice that the minus side of a tantalum capacitor may be

damaged by heat.

•

Keep the temperature of the soldering iron around 270 ˚C

during repairing.

•

Do not touch the soldering iron on the same conductor of the

circuit board (within 3 times).

•

Be careful not to apply force on the conductor when soldering

or unsoldering.

Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radiation
exposure.

0

...............................................

3

...................................................................

4

3-1.

Disassembly Flow ...........................................................

6

3-2.

Case .................................................................................

7

3-3.

Back Panel .......................................................................

7

3-4.

MAIN Board ....................................................................

8

3-5.

AMP Board, POWER Board Block ................................

8

3-6.

Front Panel Block, CD Mechanical (DLM5B) ...............

9

3-7.

Belt (DLM3A) ................................................................. 10

3-8.

Optical Pick-Up Block .................................................... 10

.............................................................. 11

........................................ 13

6-1.

Block Diagram – CD SERVO Section – ......................... 14

6-2.

Block Diagram – AUDIO Section – ................................ 15

6-3.

Block Diagram
– PANEL, POWER SUPPLY Section – .......................... 16

6-4.

Printed Wiring Board – CD Board – ............................... 18

6-5.

Schematic Diagram – CD Board – .................................. 19

6-6.

Printed Wiring Board – MAIN Board – .......................... 20

6-7.

Schematic Diagram – MAIN Board (1/3) – .................... 21

6-8.

Schematic Diagram – MAIN Board (2/3) – .................... 22

6-9.

Schematic Diagram – MAIN Board (3/3) – .................... 23

6-10. Printed Wiring Board – AMP Board – ............................ 24
6-11. Schematic Diagram – AMP Board – ............................... 25
6-12. Printed Wiring Board – PANEL Board – ........................ 26
6-13. Printed Wiring Boards – FL Section – ............................ 27
6-14. Schematic Diagram – PANEL Section – ......................... 28
6-15. Schematic Diagram – FL Board – ................................... 29
6-16. Printed Wiring Board – POWER Board – ....................... 30
6-17. Schematic Diagram – POWER Board – .......................... 31

7-1.

Overall Section ................................................................ 45

7-2.

Front Panel Section ......................................................... 46

7-3.

AMP Board, POWER Board Section .............................. 47

7-4.

CD Mechanical Section (DLM5B) .................................. 48

................................ 49

4HIS

3

MODEL

PART No.

E model

3-094-267-0[]

Mexican model

3-094-267-1[]

The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.

NOTES  ON  LASER  DIODE  EMISSION  CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.

UNLEADED  SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with

the lead free mark due to their particular size)

Unleaded solder has the following characteristics.

• Unleaded solder melts at a temperature about 40 °C higher

than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 

°C.

Caution: The printed pattern (copper foil) may peel away if

the heated tip is applied for too long, so be careful!

• Strong viscosity

Unleaded solder is more viscou-s (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.

• Usable with ordinary solder

It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.

RELEASING  THE  ANTITHEFT  LOCK
The disc table lock function for the antitheft of an demonstration
disc in the store is equipped.

1. Press the  

I/1

  button to turn the power on.

2. While pressing the

x

button, press the

Z

button until

“UNLOCKED” displayed on the fluorescent indicator tube
(around 5 seconds).

Note: When “LOCKED” is displayed, the antitheft lock is not released by

turning power on/off with the

I/1

button.

PART No.

4

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instruction manual.

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