CMT-GPX9DAB, HCD-GPX9 - Sony Audio Service Manual (repair manual)

AEP Model

UK Model

2005H05-1
© 2005.08

– Continued on next page –

HCD-GPX9 is the amplifier, CD player, tape deck
and tuner section in CMT-GPX9DAB.

Model Name Using Similar Mechanism

HCD-GPX5

CDM80B-K6BD80A

CD Mechanism Type

or

CD

CDM80B-K6BD80AA

Section

BU-K6BD80A

Base Unit Name

or

BU-K6BD80AA

Optical Pick-up Block Name

KSM-213DCP

Tape deck

Model Name Using Similar Mechanism

HCD-GPX5

Section

Tape Transport Mechanism Type

CMAL1Z234A

DIN power output (rated): 30 + 30 W 

(6 ohms at 1 kHz, DIN)

Continuous RMS power output (reference):

35 + 35 W 
(6 ohms at 1 kHz, 10% 
THD)

Music power output (reference):

60 + 60 W

Inputs
AUDIO IN:

Sensitivity 250 mV, 
impedance 47 kilohms

Outputs
PHONES:

Accepts headphones with 
an impedance of 8 ohms or 
more

SPEAKER:

Accepts impedance of 6 to 
16 ohms.

Laser Diode Properties

Emission Duration:
Continuous
Laser Output*:
Less than 44.6 µW 

µ

* This output is the value measurement at a distance of 

200 mm from the objective lens surface on the 
Optical Pick-up Block with 7 mm operture.

Frequency response

20 Hz – 20 kHz

Wavelength

780 – 790 nm

Aerial terminal

75 

Ω, F female

FM stereo, FM/AM superheterodyne tuner

FM tuner section

Tuning range

87.5 – 108.0 MHz

Aerial

FM lead aerial

Aerial terminals

75 ohms unbalanced

Intermediate frequency

10.7 MHz

AM tuner section

Tuning range

531 – 1,602 kHz

(with the tuning interval 
set at 9 kHz) 

Aerial

AM loop aerial, external 
aerial terminal

Intermediate frequency

450 kHz 

Recording system

4-track 2-channel, stereo

Frequency response

50 – 13,000 Hz (±3 dB), 
using Sony TYPE I 
cassettes

DAB tuner section

Frequency range
Band-III:

174.928 (5A) – 
239.200 (13F) MHz

L-Band:

1452.960 MHz (L1) – 
1490.624 MHz (L23)
(L-Band is not available 
for the UK model.)

* For details, see “DAB frequency table” below.

2

•

Never reuse a disconnected chip component.

•

Notice that the minus side of a tantalum capacitor may be

damaged by heat.r may be damaged by heat.

•

Keep the temperature of the soldering iron around 270 

∞

C

during repairing.

•

Do not touch the soldering iron on the same conductor of the

circuit board (within 3 times).

•

Be careful not to apply force on the conductor when soldering

or unsoldering.

This appliance is classified as
a CLASS 1 LASER product.
The CLASS 1 LASER
PRODUCT MARKING is
located on the rear exterior.

Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radiation
exposure.

0

0

• L-Band is not available for the UK model.

• Frequencies are displayed to two places of decimals 

on this system.

1452.960 MHz

L1

1454.672 MHz

L2

1456.384 MHz

L3

1458.096 MHz

L4

1459.808 MHz

L5

1461.520 MHz

L6

1463.232 MHz

L7

1464.944 MHz

L8

1466.656 MHz

L9

1468.368 MHz

L10

1470.080 MHz

L11

1471.792 MHz

L12

1473.504 MHz

L13

1475.216 MHz

L14

1476.928 MHz

L15

1478.640 MHz

L16

1480.352 MHz

L17

1482.064 MHz

L18

1483.776 MHz

L19

1485.488 MHz

L20

1487.200 MHz

L21

1488.912 MHz

L22

1490.624 MHz

L23

Power consumption

85 W
0.25 W (in Power Saving 
Mode)

Dimensions (w/h/d)

Approx. 181.5 × 261.5 × 
357.5 mm incl. projecting 
parts and controls

Mass

Approx. 5.8 kg

Power requirements

230 V AC, 50/60 Hz

Design and specifications are subject to change 
without notice.

Frequencies are displayed to two places of decimals on 
this system.

174.928 MHz

5A

209.936 MHz

10A

176.640 MHz

5B

211.648 MHz

10B

178.352 MHz

5C

213.360 MHz

10C

180.064 MHz

5D

215.072 MHz

10D

181.936 MHz

6A

216.928 MHz

11A

183.648 MHz

6B

218.640 MHz

11B

185.360 MHz

6C

220.352 MHz

11C

187.072 MHz

6D

222.064 MHz

11D

188.928 MHz

7A

223.936 MHz

12A

190.640 MHz

7B

225.648 MHz

12B

192.352 MHz

7C

227.360 MHz

12C

194.064 MHz

7D

229.072 MHz

12D

195.936 MHz

8A

230.784 MHz

13A

197.648 MHz

8B

232.496 MHz

13B

199.360 MHz

8C

234.208 MHz

13C

201.072 MHz

8D

235.776 MHz

13D

202.928 MHz

9A

237.488 MHz

13E

204.640 MHz

9B

239.200 MHz

13F

206.352 MHz

9C

208.064 MHz

9D

3

...............................................

4

Location of Controls ........................................................

6

3-1.

Disassembly Flow ...........................................................

8

3-2.

Side Plate (L)/(R) ............................................................

9

3-3.

Top Block Assy ...............................................................

9

3-4.

Tape Mechanism Deck (CMAL1Z234A) ........................ 10

3-5.

Front Panel Section ......................................................... 10

3-6.

MAIN Board .................................................................... 11

3-7.

DAB Board ...................................................................... 11

3-8.

CD Mechanism Deck Block ............................................ 12

3-9.

Base Unit (BU-K6BD80A) ............................................. 12

3-10. BD Board ......................................................................... 13
3-11. Driver Board .................................................................... 13
3-12. Chassis (Top) ................................................................... 14
3-13. Lever (Loading-L/R) ....................................................... 15
3-14. Lever (Disc Sensor)/(Disc Stop) ..................................... 16
3-15. Holder (BU215) Assy ...................................................... 16
3-16. Lever (BU Lock) ............................................................. 17
3-17. Close Lever ...................................................................... 17
3-18. Lever (Dir), Gear (IDL-B) ............................................... 18
3-19. Gear (IDL-C) ................................................................... 18

.............................................................. 19

Deck Section .................................................................... 21
CD Section ...................................................................... 22

6-1.

Block Diagram  – CD SERVO Section – ........................ 23

6-2.

Block Diagram  – AUDIO Section – ............................... 24

6-3.

Block Diagram
– PANEL/POWER SUPPLY Section – ........................... 25

6-4.

Printed Wiring Board  – DRIVER Board – ..................... 27

6-5.

Schematic Diagram  – DRIVER Board – ........................ 27

6-6.

Printed Wiring Board  – BD Board – .............................. 28

6-7.

Schematic Diagram  – BD Board – ................................. 29

6-8.

Printed Wiring Board  – DAB Board – ............................ 30

6-9.

Schematic Diagram  – DAB Board – .............................. 31

6-10. Printed Wiring Board  – MAIN Board – ......................... 32
6-11. Schematic Diagram  – MAIN Board (1/3) – ................... 33
6-12. Schematic Diagram  – MAIN Board (2/3) – ................... 34
6-13. Schematic Diagram  – MAIN Board (3/3) – ................... 35
6-14. Printed Wiring Board  – AMP Board – ........................... 36
6-15. Schematic Diagram  – AMP Board – .............................. 37
6-16. Printed Wiring Board  – PANEL (1) Board – .................. 38
6-17. Schematic Diagram  – PANEL (1) Board – .................... 39
6-18. Printed Wiring Board  – PANEL (2) Board – .................. 40
6-19. Schematic Diagram  – PANEL (2) Board – .................... 41
6-20. Printed Wiring Board  – POWER Board – ...................... 42
6-21. Schematic Diagram  – POWER Board – ......................... 43

7-1.

Side Plates Section .......................................................... 52

7-2.

Front Panel Section ......................................................... 53

7-3.

Top Block Section ........................................................... 54

7-4.

MAIN Section ................................................................. 55

7-5.

Chassis Section-2 ............................................................ 56

7-6.

CD Mechanism Deck Section-1
(CDM80B-K6BD80A) .................................................... 57

7-7.

CD Mechanism Deck Section-2
(CDM80B-K6BD80A) .................................................... 58

7-8.

CD Mechanism Deck Section-3
(CDM80B-K6BD80A) .................................................... 59

7-9.

CD Mechanism Deck Section-4
(CDM80B-K6BD80A) .................................................... 60

7-10. Base Unit Section (BU-K6BD80A) ................................ 61

................................ 62

4

The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.

The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.

Carry out the “S curve check” in “CD section adjustment” and check
that the S curve waveforms is output three times.

tape mechanism deck

Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with

the lead free mark due to their particular size)

Unleaded solder has the following characteristics.

•

Unleaded solder melts at a temperature about 40 

°

C higher

than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 

°

C.

Caution: The printed pattern (copper foil) may peel away if

the heated tip is applied for too long, so be careful!

•

Strong viscosity
Unleaded solder is more viscou-s (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.

•

Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.