CMT-G2BNIP, CMT-G2NIP, HCD-G2BNIP, HCD-G2NIP - Sony Audio Service Manual (repair manual). Page 2

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HCD-G2BNiP/G2NiP
2
1. 
SERVICING  NOTES
  .............................................   3
2. DISASSEMBLY
2-1. Disassembly 
Flow 
...........................................................  10
2-2. Case 
Block 
......................................................................  11
2-3.  Wireless LAN Module (MOD1) .....................................   11
2-4. Panel 
(CD 
Tray) 
..............................................................  12
2-5.  Panel (Front) Block .........................................................   13
2-6.  Panel (Rear) Block ..........................................................   14
2-7. MAIN 
Board 
...................................................................  15
2-8. NET 
Board 
......................................................................  16
2-9.  Holder (CD Front) Block ................................................   16
2-10.  AMP Board Block ...........................................................   17
2-11. AMP Board .....................................................................   18
2-12. Power Transformer (T901) .............................................   19
2-13.  CD Mechanism Deck Block 
(CDM77B-K6BD94DC) .................................................   20
2-14. Belt ..................................................................................   20
2-15.  Base Unit (BU-K6BD94DC) ..........................................   21
2-16.  Optical Pick-up Block (KSM-213DCP) .........................   21
2-17.  Holder (CD) Block ..........................................................   22
2-18. DCDC Board ...................................................................   22
3. 
TEST  MODE 
 ............................................................   23
4. 
ELECTRICAL  CHECK 
 .........................................   24
5. DIAGRAMS
5-1.  Block Diagram - CD/USB/PANEL Section - .................   25
5-2.  Block Diagram - TUNER/NETWORK Section - ...........   26
5-3.  Block Diagram - AMP Section - .....................................   27
5-4.  Block Diagram - POWER SUPPLY Section - ................   28
5-5.  Printed Wiring Board - BD94DC Board - ......................   30
TABLE  OF  CONTENTS
NOTES  ON  CHIP  COMPONENT  REPLACEMENT
• 
Never reuse a disconnected chip component.
• 
Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
FLEXIBLE  CIRCUIT  BOARD  REPAIRING
• 
Keep the temperature of soldering iron around 270 °C during 
repairing.
• 
Do not touch the soldering iron on the same conductor of the 
circuit board (within 3 times).
• 
Be careful not to apply force on the conductor when soldering 
or unsoldering.
SAFETY-RELATED  COMPONENT  WARNING!
COMPONENTS  IDENTIFIED  BY  MARK  
0  OR  DOTTED  LINE  
WITH  MARK  
0  ON  THE  SCHEMATIC  DIAGRAMS  AND  IN  
THE  PARTS  LIST  ARE  CRITICAL  TO  SAFE  OPERATION.
REPLACE  THESE  COMPONENTS  WITH  SONY  PARTS 
 
WHOSE  PART  NUMBERS  APPEAR  AS  SHOWN  IN  THIS  
MANUAL  OR  IN  SUPPLEMENTS  PUBLISHED  BY  SONY.
5-6.  Schematic Diagram - BD94DC Board - .........................   31
5-7.  Printed Wiring Board - TUNER Board - ........................   32
5-8.  Schematic Diagram - TUNER Board - ...........................   32
5-9.  Printed Wiring Board - DAB Board (G2BNiP) - ............   33
5-10.  Schematic Diagram - DAB Board (G2BNiP) - ..............   33
5-11.  Printed Wiring Boards - NETWORK Section - ..............   34
5-12.  Schematic Diagram - NETWORK Section - ..................   35
5-13.  Printed Wiring Board - MAIN Board (Side A) - ............   36
5-14.  Printed Wiring Board - MAIN Board (Side B) - ............   37
5-15.  Schematic Diagram - MAIN Board (1/3) - .....................   38
5-16.  Schematic Diagram - MAIN Board (2/3) - .....................   39
5-17.  Schematic Diagram - MAIN Board (3/3) - .....................   40
5-18.  Schematic Diagram - AMP Section - ..............................   41
5-19.  Printed Wiring Board - AMP Section (1/2) - ..................   42
5-20.  Printed Wiring Boards - AMP Section (2/2) - .................   43
5-21. Printed Wiring Boards 
- HP/JOG1/JOG2/USB Boards - .....................................   44
5-22.  Schematic Diagram - HP/JOG1/JOG2/USB Boards - ....   45
5-23.  Printed Wiring Board - FL-NET Board - ........................   46
5-24.  Schematic Diagram - FL-NET Board - ...........................   47
5-25.  Printed Wiring Boards - POWER SUPPLY Section - ....   48
5-26.  Schematic Diagram - POWER SUPPLY Section - .........   49
6. 
EXPLODED  VIEWS
6-1. Overall 
Section 
...............................................................  62
6-2.  Front Panel Section .........................................................   63
6-3.  Rear Panel Section ..........................................................   64
6-4.  MAIN Board Section ......................................................   65
6-5. Chassis 
Section 
...............................................................  66
6-6.  CD Mechanism Deck Section 
(CDM77B-K6BD94DC) .................................................   67
7. 
ELECTRICAL  PARTS  LIST
  ..............................   68
This appliance is classified as a 
CLASS 1 LASER product. This 
marking is located on the rear 
exterior.
CAUTION
Use of controls or adjustments or performance of procedures 
other than those specifi ed herein may result in hazardous radia-
tion exposure.
Trademarks, etc.
s
PARTY STREAMING and PARTY STREAMING 
logo are trademarks of Sony Corporation.
s
VAIO and VAIO Media are registered trademarks of 
Sony Corporation.
s
MPEG Layer-3 audio coding technology and patents 
licensed from Fraunhofer IIS and Thomson.
s
Microsoft, Windows, Windows Vista, Windows 7™, 
Windows Media are trademarks or registered 
trademarks of Microsoft Corporation in the United 
States and/or other countries.
s
Mac and Macintosh are trademarks of Apple Inc.
s
AirPlay, the AirPlay logo, iPhone, iPod, iPod classic, 
iPod nano, and iPod touch are trademarks of Apple Inc., 
registered in the U.S. and other countries.
s
“Made for iPod,” and “Made for iPhone” mean that an 
electronic accessory has been designed to connect 
specifically to iPod or iPhone, respectively, and has 
been certified by the developer to meet Apple 
performance standards. Apple is not responsible for the 
operation of this device or its compliance with safety 
and regulatory standards. Please note that the use of this 
accessory with iPod or iPhone may affect wireless 
performance.
s
Apple is not responsible for the operation of this device 
or its compliance with safety and regulatory standards.
s
” is a mark of the Wi-Fi Alliance.
s
DLNA®, the DLNA Logo and DLNA CERTIFIED™ 
are trademarks, service marks, or certification marks of 
the Digital Living Network Alliance.
s
Wake-on-LAN is a trademark of International Business 
Machines Corporation in the United States.
s
This product is protected by certain intellectual 
property rights of Microsoft Corporation. Use or 
distribution of such technology outside of this product 
is prohibited without a license from Microsoft or an 
authorized Microsoft subsidiary.
s
The system names and product names indicated in this 
manual are generally the trademarks or registered 
trademarks of the manufacturer.
s
In this manual, Microsoft Windows XP Home Edition, 
Microsoft Windows XP Professional and Microsoft 
Windows XP Media Center Edition are referred to as 
Windows XP.
s
In this manual, Microsoft Windows Vista Home Basic, 
Microsoft Windows Vista Home Premium, Microsoft 
Windows Vista Business and Microsoft Windows Vista 
Ultimate are referred to as Windows Vista.
s
In this manual, Microsoft Windows 7 Starter, Microsoft 
Windows 7 Home Premium, Microsoft Windows 7 
Professional, Microsoft Windows 7 Ultimate are 
referred to as Windows 7.
s
™ and ® marks are omitted in this manual.
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