Read Sony CMT-EH55DAB / HCD-EH55DAB Service Manual online
SERVICE MANUAL
Sony Corporation
Audio&Video Business Group
Published by Sony Techno Create Corporation
HCD-EH55DAB
SPECIFICATIONS
COMPACT DISC DECK RECEIVER
9-889-210-01
2008G05-1
©
2008.07
UK Model
Ver. 1.0 2008.07
• HCD-EH55DAB is the amplifi er, USB, CD player,
tape deck and tuner section in CMT-EH55DAB.
CD
Section
Section
Model Name Using Similar Mechanism
HCD-EH15
Base Unit Name
BU-K8BD90-WOD
Optical Pick-up Block Name
KSM-213CDP
TAPE
Section
Section
Model Name Using Similar Mechanism
HCD-EH15
Tape Transport Mechanism Type
MF-EH10
DIN power output (rated):
4 + 4 watts (4 ohms at 1 kHz, DIN)
Continuous RMS power output
(reference): 5 + 5 watts (4 ohms at
1 kHz, 10% THD)
Music power output (reference):
7 + 7 watts (4 ohms at 1 kHz, 10%
THD)
4 + 4 watts (4 ohms at 1 kHz, DIN)
Continuous RMS power output
(reference): 5 + 5 watts (4 ohms at
1 kHz, 10% THD)
Music power output (reference):
7 + 7 watts (4 ohms at 1 kHz, 10%
THD)
Inputs:
AUDIO IN (stereo mini jack):
voltage 800 mV, impedance
47 kilohms
voltage 800 mV, impedance
47 kilohms
(USB) port: Type A, maximum
current 500 mA
Outputs:
PHONES (stereo mini jack): accepts
headphones of 8 ohms or more
SPEAKER: accepts impedance of
4 ohms
headphones of 8 ohms or more
SPEAKER: accepts impedance of
4 ohms
USB section
Supported bit rate
MP3 (MPEG 1 Audio Layer-3):
32 — 320 kbps, VBR
32 — 320 kbps, VBR
Sampling frequencies
MP3 (MPEG 1 Audio Layer-3):
32/44.1/48 kHz
32/44.1/48 kHz
CD player section
System: Compact disc and digital audio
system
Laser Diode Properties
system
Laser Diode Properties
Emission Duration: Continuous
Laser Output*: Less than 44.6μW
Laser Output*: Less than 44.6μW
*
at a distance of 200mm from the
This output is the value measurement
objective lens surface on the Optical
Pick-up Block with 7mm aperture.
Pick-up Block with 7mm aperture.
Frequency response: 20 Hz — 20 kHz
Signal-to-noise ratio: More than 90 dB
Dynamic range: More than 90 dB
Signal-to-noise ratio: More than 90 dB
Dynamic range: More than 90 dB
Tape deck section
Recording system: 4-track 2-channel, stereo
Tuner section
FM/DAB stereo tuner
DAB tuner section:
Frequency range*
Band-III: 174.928 (5A) — 239.200
(13F) MHz
Band-III: 174.928 (5A) — 239.200
(13F) MHz
* For details, see “DAB frequency table”
(page 31).
Antenna: FM/DAB lead antenna
FM tuner section:
FM tuner section:
Tuning range:
87.5 — 108.0 MHz (50 kHz step)
Antenna: FM/DAB lead antenna
Intermediate frequency: 10.7 MHz
Intermediate frequency: 10.7 MHz
DAB frequency table (Band-III)
Frequency Label Frequency Label
Frequency Label Frequency Label
174.928 MHz 5A
209.936 MHz 10A
176.640 MHz 5B
211.648 MHz 10B
178.352 MHz 5C
213.360 MHz 10C
180.064 MHz 5D
215.072 MHz 10D
181.936 MHz 6A
216.928 MHz 11A
183.648 MHz 6B
218.640 MHz 11B
185.360 MHz 6C
220.352 MHz 11C
187.072 MHz 6D
222.064 MHz 11D
188.928 MHz 7A
223.936 MHz 12A
190.640 MHz 7B
225.648 MHz 12B
192.352 MHz 7C
227.360 MHz 12C
194.064 MHz 7D
229.072 MHz 12D
195.936 MHz 8A
230.784 MHz 13A
197.648 MHz 8B
232.496 MHz 13B
199.360 MHz 8C
234.208 MHz 13C
201.072 MHz 8D
235.776 MHz 13D
202.928 MHz 9A
237.488 MHz 13E
204.640 MHz 9B
239.200 MHz 13F
206.352 MHz 9C
208.064 MHz 9D
* Frequencies are displayed to two decimal
places on this system.
General
Power requirements:
230 V AC, 50/60 Hz
Power consumption: 29 watts
Dimensions (w/h/d) (excl. speakers):
Approx. 155 × 241 × 224.6 mm
Mass (excl. speakers): Approx. 2.2 kg
Dimensions (w/h/d) (excl. speakers):
Approx. 155 × 241 × 224.6 mm
Mass (excl. speakers): Approx. 2.2 kg
Design and specifications are subject to
change without notice.
change without notice.
Amplifier section
HCD-EH55DAB
2
1.
SERVICING NOTES
.............................................
3
2. GENERAL
.................................................................. 4
3. DISASSEMBLY
3-1. Disassembly .................................................................... 6
3-2. Rear Cabinet Block ......................................................... 6
3-3. Front Cabinet Block, Top Cabinet Block,
MAIN
3-2. Rear Cabinet Block ......................................................... 6
3-3. Front Cabinet Block, Top Cabinet Block,
MAIN
Board
...................................................................
7
3-4. MF-EH10 (Tape Mechanism Deck), Cassette Lid .......... 7
3-5. Base Unit Block (BU-K8BD90-WOD) .......................... 8
3-6. Optical Pick-Up Block (KSM-213CDP) ........................ 8
3-5. Base Unit Block (BU-K8BD90-WOD) .......................... 8
3-6. Optical Pick-Up Block (KSM-213CDP) ........................ 8
4.
TEST MODE
............................................................
9
5. MECHANICAL
ADJUSTMENTS
...................... 10
6. ELECTRICAL
ADJUSTMENTS
........................ 10
7. DIAGRAMS
7-1. Block Diagram - CD SERVO Section - .......................... 12
7-2. Block Diagram - MAIN Section - ................................... 13
7-3. Block
7-2. Block Diagram - MAIN Section - ................................... 13
7-3. Block
Diagram
- PANEL, POWER SUPPLY Section - ........................... 14
7-4. Printed Wiring Board - CD Board - ................................ 16
7-5. Schematic Diagram - CD Board - ................................... 17
7-6. Printed Wiring Board - USB Board - .............................. 18
7-7. Schematic Diagram - USB Board - ................................. 19
7-8. Printed Wiring Board - PANEL Board - ......................... 20
7-9. Schematic Diagram - PANEL Board - ............................ 21
7-10. Printed Wiring Board - MAIN Board - ........................... 22
7-11. Schematic Diagram - MAIN Board (1/3) - ..................... 23
7-12. Schematic Diagram - MAIN Board (2/3) - ..................... 24
7-13. Schematic Diagram - MAIN Board (3/3) - ..................... 25
7-14. Printed Wiring Board - PT-VBUS Board - ..................... 26
7-15. Schematic Diagram - PT-VBUS Board - ........................ 26
7-5. Schematic Diagram - CD Board - ................................... 17
7-6. Printed Wiring Board - USB Board - .............................. 18
7-7. Schematic Diagram - USB Board - ................................. 19
7-8. Printed Wiring Board - PANEL Board - ......................... 20
7-9. Schematic Diagram - PANEL Board - ............................ 21
7-10. Printed Wiring Board - MAIN Board - ........................... 22
7-11. Schematic Diagram - MAIN Board (1/3) - ..................... 23
7-12. Schematic Diagram - MAIN Board (2/3) - ..................... 24
7-13. Schematic Diagram - MAIN Board (3/3) - ..................... 25
7-14. Printed Wiring Board - PT-VBUS Board - ..................... 26
7-15. Schematic Diagram - PT-VBUS Board - ........................ 26
8.
EXPLODED VIEWS
8-1. Overall
Section
............................................................... 36
8-2. Front Cabinet Section ..................................................... 37
8-3. Top Cabinet Section ........................................................ 38
8-4. Base Unit Section (BU-K8BD90-WOD) ........................ 39
8-3. Top Cabinet Section ........................................................ 38
8-4. Base Unit Section (BU-K8BD90-WOD) ........................ 39
9.
ELECTRICAL PARTS LIST
.............................. 40
TABLE OF CONTENTS
NOTES ON CHIP COMPONENT REPLACEMENT
•
•
Never reuse a disconnected chip component.
•
Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
aged by heat.
SAFETY-RELATED COMPONET WARNING!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS
WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
This appliance is classifi ed as
a CLASS 1 LASER product.
This marking is located on the
rear or bottom exterior.
a CLASS 1 LASER product.
This marking is located on the
rear or bottom exterior.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specifi ed herein may result in hazardous radia-
tion exposure.
Use of controls or adjustments or performance of procedures
other than those specifi ed herein may result in hazardous radia-
tion exposure.
HCD-EH55DAB
3
SECTION 1
SERVICING NOTES
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostat-
ic break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The fl exible board is easily damaged and should be handled with
care.
ic break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The fl exible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused
on the disc refl ective surface by the objective lens in the optical
pickup block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
The laser beam on this model is concentrated so as to be focused
on the disc refl ective surface by the objective lens in the optical
pickup block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher
• Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong
viscosity
Unleaded solder is more viscous (sticky, less prone to fl ow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
also be added to ordinary solder.
LASER DIODE AND FOCUS SEARCH OPERATION
CHECK
During normal operation of the equipment, emission of the laser
diode is prohibited unless the upper lid is closed while turning on
the SW750. (push switch type)
The following checking method for the laser diode is operable.
• Method
Emission of the laser diode is visually checked.
CHECK
During normal operation of the equipment, emission of the laser
diode is prohibited unless the upper lid is closed while turning on
the SW750. (push switch type)
The following checking method for the laser diode is operable.
• Method
Emission of the laser diode is visually checked.
1. Open the upper lid.
2. Push the SW750 as shown in Fig.1.
2. Push the SW750 as shown in Fig.1.
Note: Do not push the detection lever strongly, or it may be bent or dam-
aged.
3. Check the object lens for confi rming normal emission of the
laser diode. If not enitting, there is a trouble in the automatic
power control cirsuit or the optical pick-up.
power control cirsuit or the optical pick-up.
In this operation, the object lens will move up and down 2
times along with inward motion for the focus search.
times along with inward motion for the focus search.
SW750
Fig. 1. Method to push the SW750
HCD-EH55DAB
4
SECTION 2
GENERAL
This section is extracted
from instruction manual.
from instruction manual.
Guide to parts and controls
This manual mainly explains operations using the remote, but the same operations can also be performed using the buttons on the unit having the
same or similar names.
same or similar names.
Unit
Open the tape
section lid.
section lid.
Remote
/ (power) button
Press to turn on the system.
Press to select a track or file.
/ (go back/go forward)
button
button
Unit: TUNING +/− (tuning)
button
Remote: +/− (tuning) button
button
Remote: +/− (tuning) button
Press to tune in the desired station.
Press to find a point in a track or file.
/ (rewind/fast forward)
button
button
DAB
Press to select the DAB function.
DAB AUTO SCAN
Press to run the DAB Automatic Scan.
Press to select the sound effect.
Sound buttons
Unit: DSGX button
Remote: EQ button
Unit: DSGX button
Remote: EQ button
PUSH OPEN/CLOSE
Press to open or close the CD
compartment.
compartment.
Remote sensor
Playback buttons and function
buttons
Unit: USB (play/pause)
button
buttons
Unit: USB (play/pause)
button
Press to select the USB function.
Press to start or pause playback of an
optional USB device.
Press to start or pause playback of an
optional USB device.
Remote: USB button
Press to select the USB function.
Unit: CD (play/pause)
button
button
Press to select the CD function.
Press to start or pause playback of a disc.
Press to start or pause playback of a disc.
Remote: CD button
Press to select the CD function.
Remote: (play) button,
(pause) button
Press to start or pause playback.
TUNER/BAND button
Press to select the TUNER function.
Press to select DAB or FM reception
mode.
Press to select DAB or FM reception
mode.
FUNCTION button
Press to select the function.
(stop) button
Press to stop playback.
(USB) port
Connect to an optional USB device.
Unit: VOLUME control
Remote: VOLUME +/− button
Remote: VOLUME +/− button
Turn or press to adjust the volume.
(record) button, (play)
button, / (rewind/fast
forward) button, (stop/
eject) button, (pause) button
button, / (rewind/fast
forward) button, (stop/
eject) button, (pause) button
Press to operate the tape functions.
PHONES jack
Connect the headphones.
AUDIO IN jack
Connect to an optional audio
Lights up when the system is turned off.
component.
STANDBY indicator
CLOCK/TIMER SELECT button
CLOCK/TIMER SET button
CLOCK/TIMER SET button
Press to set the clock and the Play Timer.
REPEAT/FM MODE button
Press to listen to a disc or USB device
repeatedly. Or press to listen to a single
track/file or all tracks/files in a folder (for
USB devices only) repeatedly.
Press to select the FM reception mode
(monaural or stereo).
repeatedly. Or press to listen to a single
track/file or all tracks/files in a folder (for
USB devices only) repeatedly.
Press to select the FM reception mode
(monaural or stereo).
ENTER button
Press to enter the settings.
R
RB
RT
RE
RG
RH
RI
RK
RL
X
XB
XT
XE
XG
RM
+/− (select folder) button
Press to select a folder.
Battery compartment lid
CLEAR button
Press to delete a pre-programmed track
or file.
or file.
TUNER MEMORY button
Press to preset the radio station.
PLAY MODE/TUNING MODE
button
button
Press to select the play mode of a CD or
MP3 disc.
Press to select the tuning mode.
MP3 disc.
Press to select the tuning mode.
DISPLAY button
Press to change the information on the
display.
display.
SLEEP button
Press to set the Sleep Timer.