Read Sony CMT-EH25 / CMT-EH26 / HCD-EH25 / HCD-EH26 Service Manual online
HCD-EH25/EH26
3
SECTION 1
SERVICING NOTES
Model
POWER VOLTAGE INDICATION
EH25: AEP, UK, Russian
models/EH26
models/EH26
AC 230 V, 50/60 Hz
EH25: Australian model
AC 230 – 240 V, 50/60 Hz
EH25: Mexican model
AC 120 V, 60 Hz
EH25: Colombian, Chilean
and Peruvian models
and Peruvian models
AC 110 – 120 V or 220 – 240 V,
50/60 Hz
50/60 Hz
EH25: Singapore and
Indian models
Indian models
AC 220 – 240 V, 50/60 Hz
EH25: Korean model
AC 220 V, 60 Hz
MODEL IDENTIFICATION
LASER DIODE AND FOCUS SEARCH OPERATION
CHECK
During normal operation of the equipment, emission of the laser
diode is prohibited unless the upper lid is closed while turning on
the SW750. (push switch type)
The following checking method for the laser diode is operable.
• Method
Emission of the laser diode is visually checked.
CHECK
During normal operation of the equipment, emission of the laser
diode is prohibited unless the upper lid is closed while turning on
the SW750. (push switch type)
The following checking method for the laser diode is operable.
• Method
Emission of the laser diode is visually checked.
1. Open the upper lid.
2. Push the SW750 as shown in Fig.1.
2. Push the SW750 as shown in Fig.1.
Note: Do not push the detection lever strongly, or it may be bent or dam-
aged.
3. Check the object lens for confi rming normal emission of the
laser diode. If not emitting, there is a trouble in the auto-
matic power control circuit or the optical pick-up.
matic power control circuit or the optical pick-up.
In this operation, the object lens will move up and down 2
times along with inward motion for the focus search.
times along with inward motion for the focus search.
SW750
Fig. 1. Method to push the SW750
Power Voltage
Indication
Indication
– Rear Cabinet –
Ver. 1.6
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher
• Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong
viscosity
Unleaded solder is more viscous (sticky, less prone to fl ow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
also be added to ordinary solder.
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electro-
static break-down because of the potential difference generated by
the charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The fl exible board is easily damaged and should be handled with
care.
static break-down because of the potential difference generated by
the charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The fl exible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused
on the disc refl ective surface by the objective lens in the optical
pickup block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
The laser beam on this model is concentrated so as to be focused
on the disc refl ective surface by the objective lens in the optical
pickup block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
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