CMT-EH20DAB, HCD-EH20DAB - Sony Audio Service Manual (repair manual). Page 2

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2
HCD-EH20DAB
Notes on chip component replacement
Never reuse a disconnected chip component.
Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
Keep the temperature of the soldering iron around 270 ˚C
during repairing.
Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
Be careful not to apply force on the conductor when soldering
or unsoldering.
1.
SERVICING  NOTES
...............................................
3
2.
GENERAL
...................................................................
4
3.
DISASSEMBLY
3-1.
Disassembly Flow ...........................................................
6
3-2.
Rear Cabinet Section .......................................................
6
3-3.
Front Cabinet Section, Top Cabinet Section and
MAIN Board ....................................................................
7
3-4.
Mechanical Deck (H-21SB) ............................................
7
3-5.
Base Unit Section (BU-K8BD83S2-WOD) ....................
8
3-6.
Optical Pick-up Block (KSM-213CDP) ..........................
8
4.
TEST  MODE
..............................................................
9
5.
MECHANICAL  ADJUSTMENTS
....................... 10
6.
ELECTRICAL  ADJUSTMENTS
......................... 10
7.
DIAGRAMS
7-1.
Block Diagram
– CD SERVO, DAB TUNER Section – .......................... 13
7-2.
Block Diagram – MAIN Section – .................................. 14
7-3.
Printed Wiring Board – CD Board – ............................... 16
7-4.
Schematic Diagram – CD Board – .................................. 17
7-5.
Printed Wiring Boards – MAIN Section – ...................... 19
7-6.
Schematic Diagram – MAIN Section (1/2) – .................. 20
7-7.
Schematic Diagram – MAIN Section (2/2) – .................. 21
7-8.
Printed Wiring Boards – DAB Section – ......................... 22
7-9.
Schematic Diagram – DAB Section – ............................. 23
7-10. Printed Wiring Board – PANEL Board – ........................ 24
7-11. Schematic Diagram – PANEL Board – ........................... 25
8.
EXPLODED  VIEWS
8-1.
Overall Section ................................................................ 32
8-2.
Front Cabinet Section ...................................................... 33
8-3.
Top Cabinet Section ........................................................ 34
8-4.
Base Unit Section (BU-K8BD83S2-WOD) .................... 35
9.
ELECTRICAL  PARTS  LIST
................................ 36
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radiation
exposure.
SAFETY-RELATED  COMPONENT  WARNING!!
COMPONENTS  IDENTIFIED  BY  MARK 
 0
  OR  DOTTED  LINE
WITH  MARK  
0
  ON  THE  SCHEMATIC  DIAGRAMS  AND  IN
THE  PARTS  LIST  ARE  CRITICAL  TO  SAFE  OPERATION.
REPLACE  THESE  COMPONENTS  WITH  SONY  PARTS  WHOSE
PART  NUMBERS  APPEAR  AS  SHOWN  IN  THIS  MANUAL  OR
IN  SUPPLEMENTS  PUBLISHED  BY  SONY.
The following caution label is located inside the unit.
CLASS 1 LASER PRODUCT
LUOKAN 1 LASER LAITE
KLASS 1 LASER APPARA
T
This appliance is classified
as a CLASS 1 LASER
product.
This label is located on the
rear exterior.
TABLE  OF  CONTENTS
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