Read Sony CMT-EH20DAB / HCD-EH20DAB Service Manual online
2
HCD-EH20DAB
Notes on chip component replacement
•
Never reuse a disconnected chip component.
•
Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
•
Keep the temperature of the soldering iron around 270 ˚C
during repairing.
•
Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
•
Be careful not to apply force on the conductor when soldering
or unsoldering.
1.
SERVICING NOTES
...............................................
3
2.
GENERAL
...................................................................
4
3.
DISASSEMBLY
3-1.
Disassembly Flow ...........................................................
6
3-2.
Rear Cabinet Section .......................................................
6
3-3.
Front Cabinet Section, Top Cabinet Section and
MAIN Board ....................................................................
MAIN Board ....................................................................
7
3-4.
Mechanical Deck (H-21SB) ............................................
7
3-5.
Base Unit Section (BU-K8BD83S2-WOD) ....................
8
3-6.
Optical Pick-up Block (KSM-213CDP) ..........................
8
4.
TEST MODE
..............................................................
9
5.
MECHANICAL ADJUSTMENTS
....................... 10
6.
ELECTRICAL ADJUSTMENTS
......................... 10
7.
DIAGRAMS
7-1.
Block Diagram
– CD SERVO, DAB TUNER Section – .......................... 13
– CD SERVO, DAB TUNER Section – .......................... 13
7-2.
Block Diagram – MAIN Section – .................................. 14
7-3.
Printed Wiring Board – CD Board – ............................... 16
7-4.
Schematic Diagram – CD Board – .................................. 17
7-5.
Printed Wiring Boards – MAIN Section – ...................... 19
7-6.
Schematic Diagram – MAIN Section (1/2) – .................. 20
7-7.
Schematic Diagram – MAIN Section (2/2) – .................. 21
7-8.
Printed Wiring Boards – DAB Section – ......................... 22
7-9.
Schematic Diagram – DAB Section – ............................. 23
7-10. Printed Wiring Board – PANEL Board – ........................ 24
7-11. Schematic Diagram – PANEL Board – ........................... 25
7-11. Schematic Diagram – PANEL Board – ........................... 25
8.
EXPLODED VIEWS
8-1.
Overall Section ................................................................ 32
8-2.
Front Cabinet Section ...................................................... 33
8-3.
Top Cabinet Section ........................................................ 34
8-4.
Base Unit Section (BU-K8BD83S2-WOD) .................... 35
9.
ELECTRICAL PARTS LIST
................................ 36
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radiation
exposure.
other than those specified herein may result in hazardous radiation
exposure.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK
0
OR DOTTED LINE
WITH MARK
0
ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
The following caution label is located inside the unit.
CLASS 1 LASER PRODUCT
LUOKAN 1 LASER LAITE
KLASS 1 LASER APPARA
T
This appliance is classified
as a CLASS 1 LASER
product.
as a CLASS 1 LASER
product.
This label is located on the
rear exterior.
rear exterior.
TABLE OF CONTENTS
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