Read Sony CMT-EH15 / HCD-EH15 Service Manual online
HCD-EH15
2
1.
SERVICING NOTES
.............................................
3
2. GENERAL
..................................................................
4
3. DISASSEMBLY
3-1. Disassembly
Flow
........................................................... 6
3-2. Rear Cabinet Block ......................................................... 6
3-3. Front Cabinet Block, Top Cabinet Block,
MAIN
3-3. Front Cabinet Block, Top Cabinet Block,
MAIN
Board
...................................................................
7
3-4. MF-EH10 (Tape Mechanism Deck), Cassette Lid .......... 7
3-5. Base Unit Block (BU-K8BD90-WOD) .......................... 8
3-6. Optical Pick-up Block (KSM-213CDP) ......................... 8
3-5. Base Unit Block (BU-K8BD90-WOD) .......................... 8
3-6. Optical Pick-up Block (KSM-213CDP) ......................... 8
4.
TEST MODE
............................................................
9
5. MECHANICAL
ADJUSTMENTS
...................... 10
6. ELECTRICAL
ADJUSTMENTS
........................ 10
7. DIAGRAMS
7-1. Printed Wiring Board - CD Board - ................................ 14
7-2. Schematic Diagram - CD Board - ................................... 15
7-3. Printed Wiring Board - PANEL Board - ......................... 16
7-4. Schematic Diagram - PANEL Board - ............................ 17
7-5. Schematic Diagram - MAIN Section (1/2) - ................... 18
7-6. Schematic Diagram - MAIN Section (2/2) - ................... 19
7-7. Printed Wiring Boards - MAIN Section - ....................... 20
7-2. Schematic Diagram - CD Board - ................................... 15
7-3. Printed Wiring Board - PANEL Board - ......................... 16
7-4. Schematic Diagram - PANEL Board - ............................ 17
7-5. Schematic Diagram - MAIN Section (1/2) - ................... 18
7-6. Schematic Diagram - MAIN Section (2/2) - ................... 19
7-7. Printed Wiring Boards - MAIN Section - ....................... 20
8.
EXPLODED VIEWS
8-1. Overall
Section
............................................................... 27
8-2. Front Cabinet Section ..................................................... 28
8-3. Top Cabinet Section ........................................................ 29
8-4. Base Unit Section (BU-K8BD90-WOD) ........................ 30
8-3. Top Cabinet Section ........................................................ 29
8-4. Base Unit Section (BU-K8BD90-WOD) ........................ 30
9.
ELECTRICAL PARTS LIST
.............................. 31
Note: Refer to supplement-1 for the MAIN board of printed wiring
board, schematic diagram and electrical parts list of AEP,
Brazilian and Thai models.
Brazilian and Thai models.
TABLE OF CONTENTS
Notes on chip component replacement
•
•
Never reuse a disconnected chip component.
•
Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
aged by heat.
This appliance is classified
as a CLASS 1 LASER
product. This marking
is located on the rear
exterior.
as a CLASS 1 LASER
product. This marking
is located on the rear
exterior.
Ver. 1.2
SAFETY-RELATED COMPONENT WARNING!
COMPONENTS IDENTIFIED BY MARK
0 OR DOTTED LINE
WITH MARK
0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS
REPLACE THESE COMPONENTS WITH SONY PARTS
WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ!
LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE
0 SUR
LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES
PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE FONC-
TIONNEMENT. NE REMPLACER CES COMPOSANTS QUE
PAR DES PIÈCES SONY DONT LES NUMÉROS SONT DON-
NÉS DANS CE MANUEL OU DANS LES SUPPLÉMENTS
PUBLIÉS PAR SONY.
PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE FONC-
TIONNEMENT. NE REMPLACER CES COMPOSANTS QUE
PAR DES PIÈCES SONY DONT LES NUMÉROS SONT DON-
NÉS DANS CE MANUEL OU DANS LES SUPPLÉMENTS
PUBLIÉS PAR SONY.
CAUTION
Use of controls or adjustments or performance of procedures other than
those specifi ed herein may result in hazardous radiation exposure.
Use of controls or adjustments or performance of procedures other than
those specifi ed herein may result in hazardous radiation exposure.
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