Read Sony CMT-EH12 / HCD-EH12 Service Manual online
SERVICE MANUAL
Model Name Using Similar Mechanism
HCD-EH10
CD Section
Base Unit Name
BU-K8BD83S-WOD
Optical Pick-up Name
KSM-213CDP
TAPE Section
Model Name Using Similar Mechanism
HCD-EH10
Tape Transport Mechanism Type
H-21SB
COMPACT DISC DECK RECEIVER
HCD-EH12
Ver. 1.0 2006.02
SPECIFICATIONS
9-887-024-01
2006B05-1
© 2006.02
© 2006.02
Sony Corporation
Personal Audio Division
Published by Sony Techno Create Corporation
Published by Sony Techno Create Corporation
US Model
•
HCD-EH12 is the amplifier, CD player, tape deck and
tuner section in CMT-EH12.
tuner section in CMT-EH12.
Main unit
AUDIO POWER SPECIFICATIONS
POWER OUTPUT AND TOTAL HARMONIC DISTORTION:
POWER OUTPUT AND TOTAL HARMONIC DISTORTION:
With 4 ohm loads, both channels driven, from 100 – 20,000 Hz; rated 4 watts
per channel minimum RMS power, with no more than 10% total harmonic
distortion from 250 milliwatts to rated output.
per channel minimum RMS power, with no more than 10% total harmonic
distortion from 250 milliwatts to rated output.
Amplifier section
Continuous RMS power output (reference): 5 + 5 W (4 ohms at 1 kHz, 10%
THD)
THD)
Inputs
AUDIO IN (stereo mini jack): Sensitivity 800 mV, impedance 47 kilohms
Outputs
PHONES (stereo mini jack): Accepts headphones with an impedance of 8
ohms or more
SPEAKER: Accepts impedance of 4 ohms
ohms or more
SPEAKER: Accepts impedance of 4 ohms
CD player section
System: Compact disc and digital audio system
Laser Diode Properties
Laser Diode Properties
Emission duration: continuous
Laser Output*: Less than 44.6
Laser Output*: Less than 44.6
µ
W
* This output is the value measurement at a distance of 200mm from the
objective lens surface on the Optical Pick-up Block with 7mm aperture.
Frequency response: 20 Hz – 20 kHz
Signal-to-noise ratio: More than 90 dB
Dynamic range: More than 90 dB
Signal-to-noise ratio: More than 90 dB
Dynamic range: More than 90 dB
Tape deck section
Recording system: 4-track 2-channel, stereo
Tuner section
FM stereo, FM/AM superheterodyne tuner
Antenna:
Antenna:
FM lead antenna
AM loop antenna
AM loop antenna
FM tuner section:
Tuning range
87.5 – 108.0 MHz (100 kHz step)
Intermediate frequency: 10.7 MHz
87.5 – 108.0 MHz (100 kHz step)
Intermediate frequency: 10.7 MHz
AM tuner section:
Tuning range
530 – 1,710 kHz (with 10 kHz tuning interval)
531 – 1,710 kHz (with 9 kHz tuning interval)
Intermediate frequency: 450 kHz
530 – 1,710 kHz (with 10 kHz tuning interval)
531 – 1,710 kHz (with 9 kHz tuning interval)
Intermediate frequency: 450 kHz
General
Power requirements
AC 120 V, 60 Hz
Power consumption:
23W
Dimensions (w/h/d) (excl. speakers): Approx. 158
×
241.5
×
233mm
Mass (excl. speakers):
Approx. 2.1 kg
Design and specifications are subject to change without notice.
2
HCD-EH12
Notes on chip component replacement
•
Never reuse a disconnected chip component.
•
Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
•
Keep the temperature of the soldering iron around 270 ˚C
during repairing.
•
Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
•
Be careful not to apply force on the conductor when soldering
or unsoldering.
1.
SERVICING NOTES
...............................................
3
2.
GENERAL
...................................................................
4
3.
DISASSEMBLY
3-1.
Disassembly Flow ...........................................................
6
3-2.
Rear Cabinet Section .......................................................
6
3-3.
Front Cabinet Section, Top Cabinet Section and
MAIN Board ....................................................................
MAIN Board ....................................................................
7
3-4.
Mechanical Deck (H-21SB) ............................................
7
3-5.
Base Unit Section (BU-K8BD83S-WOD) ......................
8
3-6.
Optical Pick-up Block (KSM-213CDP) ..........................
8
4.
TEST MODE
..............................................................
9
5.
MECHANICAL ADJUSTMENTS
....................... 10
6.
ELECTRICAL ADJUSTMENTS
......................... 10
7.
DIAGRAMS
7-1.
Block Diagram – CD SERVO Section – ......................... 14
7-2.
Block Diagram – TUNER Section – ............................... 15
7-3.
Block Diagram – MAIN Section – .................................. 16
7-4.
Printed Wiring Board – CD Board – ............................... 18
7-5.
Schematic Diagram – CD Board – .................................. 19
7-6.
Printed Wiring Boards – MAIN Section – ...................... 20
7-7.
Schematic Diagram – MAIN Section (1/3) – .................. 21
7-8.
Schematic Diagram – MAIN Section (2/3) – .................. 22
7-9.
Schematic Diagram – MAIN Section (3/3) – .................. 23
7-10. Printed Wiring Board – PANEL Board – ........................ 24
7-11. Schematic Diagram – PANEL Board – ........................... 25
7-11. Schematic Diagram – PANEL Board – ........................... 25
8.
EXPLODED VIEWS
8-1.
Overall Section ................................................................ 33
8-2.
Front Cabinet Section ...................................................... 34
8-3.
Top Cabinet Section ........................................................ 35
8-4.
Base Unit Section (BU-K8BD83S-WOD) ...................... 36
9.
ELECTRICAL PARTS LIST
................................ 37
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radiation
exposure.
other than those specified herein may result in hazardous radiation
exposure.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK
0
OR DOTTED LINE
WITH MARK
0
ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
TABLE OF CONTENTS
SAFETY CHECK-OUT
After correcting the original service problem, perform the following
safety check before releasing the set to the customer:
Check the antenna terminals, metal trim, “metallized” knobs, screws,
and all other exposed metal parts for AC leakage.
Check leakage as described below.
safety check before releasing the set to the customer:
Check the antenna terminals, metal trim, “metallized” knobs, screws,
and all other exposed metal parts for AC leakage.
Check leakage as described below.
LEAKAGE TEST
The AC leakage from any exposed metal part to earth ground and
from all exposed metal parts to any exposed metal part having a
return to chassis, must not exceed 0.5 mA (500 microamperes.).
Leakage current can be measured by any one of three methods.
from all exposed metal parts to any exposed metal part having a
return to chassis, must not exceed 0.5 mA (500 microamperes.).
Leakage current can be measured by any one of three methods.
1. A commercial leakage tester, such as the Simpson 229 or RCA
WT-540A. Follow the manufacturers’ instructions to use these
instruments.
instruments.
2. A battery-operated AC milliammeter. The Data Precision 245
digital multimeter is suitable for this job.
3. Measuring the voltage drop across a resistor by means of a
VOM or battery-operated AC voltmeter. The “limit” indication
is 0.75 V, so analog meters must have an accurate low-voltage
scale. The Simpson 250 and Sanwa SH-63Trd are examples
of a passive VOM that is suitable. Nearly all battery operated
digital multimeters that have a 2 V AC range are suitable. (See
Fig. A)
is 0.75 V, so analog meters must have an accurate low-voltage
scale. The Simpson 250 and Sanwa SH-63Trd are examples
of a passive VOM that is suitable. Nearly all battery operated
digital multimeters that have a 2 V AC range are suitable. (See
Fig. A)
Fig. A.
Using an AC voltmeter to check AC leakage.
1.5 k
Ω
0.15
µ
F
AC
voltmeter
(0.75 V)
voltmeter
(0.75 V)
To Exposed Metal
Parts on Set
Parts on Set
Earth Ground
3
HCD-EH12
SECTION 1
SERVICING NOTES
The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
•
Unleaded solder melts at a temperature about 40 ˚C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 ˚C.
Caution: The printed pattern (copper foil) may peel away if
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 ˚C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
•
Strong viscosity
Unleaded solder is more viscou-s (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
Unleaded solder is more viscou-s (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
•
Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
BLOCK OR BASE UNIT
Fig.1 Method to push the SW750
SW750
LASER DIODE AND FOCUS SEARCH OPERATION
CHECK
CHECK
During normal operation of the equipment, emission of the laser
diode is prohibited unless the upper lid is closed while turning ON
the SW750. (push switch type)
The following checking method for the laser diode is operable.
diode is prohibited unless the upper lid is closed while turning ON
the SW750. (push switch type)
The following checking method for the laser diode is operable.
•
Method
Emission of the laser diode is visually checked.
Emission of the laser diode is visually checked.
1. Open the upper lid.
2. Push the SW750 as shown in Fig.1.
2. Push the SW750 as shown in Fig.1.
Note:
Do not push the detection lever strongly, or it may be bent or damaged.
3. Press the
CD
u
button.
4. Check the object lens for confirming normal emission of the
laser diode. If not emitting, there is a trouble in the automatic
power control circuit or the optical pick-up.
power control circuit or the optical pick-up.
In this operation, the object lens will move up and down 2
times along with inward motion for the focus search.
4
HCD-EH12
SECTION 2
GENERAL
This section is extracted from
instruction manual.
instruction manual.
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